Method of packaging a sensor
    9.
    发明授权
    Method of packaging a sensor 有权
    包装传感器的方法

    公开(公告)号:US08732938B2

    公开(公告)日:2014-05-27

    申请号:US12783397

    申请日:2010-05-19

    IPC分类号: H04R31/00

    摘要: An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.

    摘要翻译: 提供了一种改进的封装传感器的方法。 该方法包括将音叉固定在平台上的步骤。 音叉包括包括一个或多个表面的尖齿,每个齿还包括电极和压电材料。 专用集成电路(ASIC)贴在平台上。 建立ASIC和每个齿的电极之间的电气通信,用于向音叉提供刺激并且用于从音叉接收响应信号。 施加保护层以覆盖平台和音叉的一部分,同时保持每个齿的一部分表面没有保护层,使得表面可以使与其接触的流体移位。