Abstract:
Discloses, in the fabrication of semiconductor devices, the use of a nonreactive metallic layer such as molybdenum, which forms an adherent bond with dielectric insulating films, as a diffusion mask. The metallic layer may also be used as an etching mask to permit selective removal of portions of passivation layers.
Abstract:
Improved semiconductor field-effect transistors have selfregistration and electrical insulation. Conductivity-modified, surface adjacent source and drain regions are formed by diffusing dopants through gate-oxide layer. One embodiment features a conducting gate electrode which is formed from a thin deposited film. In this embodiment a large region of opposite-conductivitytype semiconductor is formed by diffusion through both conducting and oxide films. Complementary ''''N-channel'''' and ''''P-channel'''' devices may be formed on the same substrate by combining two separate embodiments. In such devices the original conductivitytype semiconductor is the base for one FET, while the large conductivity-modified-type region is the base for the other FET. Such modules may be interconnected to form integrated circuits capable of performing a variety of logical functions.
Abstract:
A surface-diffused transistor exhibiting high stability and low collector capacitance includes a metallic field plate buried within an insulating film which covers the active major wafer surface thereof and passivates a surface-adjacent collector junction. Metal field plate is fixed to a negative potential and prevents inversion of a surface-adjacent region of the P-type semiconductor, thereby preventing surface leakage and increased capacitance.
Abstract:
IMPROVED SEMICONDUCTOR FIELD-EFFECT TRANSISTORS HAVE SELF-REGISTRATION AND ELECTRICAL INSULATION. CONDUCTIVITYMODIFIED, SURFACE-ADJACENT SOURCE AND DRAIN REGIONS ARE FORMED BY DIFFUSING DOPANTS THROUGH GATE-OXIDE LAYER. ONE EMBODIMENT FEATURES A CONDUCTING GATE ELECTRODE WHICH IS FORMED FROM A THIN DEPOSITED FILM. IN THIS EMBODIMENT A LARGE REGION OF OPPOSITE-CONDUCTIVITY-TYPE SEMICONDUCTOR IS FORMED BY DIFFUSION THROUGH BOTH CONDUCTING AND OXIDE FILMS. COMPLEMENTARY "N-CHANNEL" AND "P-CHANNEL" DEVICES MAY BE FORMED ON THE SAME SUBSTRATE BY COMBINING TWO SEPARATE EMBODIMENTS. IN SUCH DEVICES THE ORIGINAL CONDUCTIVITY-TYPE SEMICONDUCTOR IS THE BASE FOR ONE FET, WHILE THE LARGE CONDUCTIVITY-MODIFIED TYPE REGION IS THE BASE FOR THE OTHER FET. SUCH MODULES MAY BE INTERCONNECTED TO FORM INTEGRATED CIRCUITS CAPABLE OF PERFORMING A VARIETY OF LOGICAL FUNCTIONS.
Abstract:
SELF-REGISTERED FIELD-EFFECT TRANSISTORS ARE BUILT BY FORMING THE GATE THEREOF AT THE SAME TIME THE CHANNEL-ADJACENT PORTION OF THE SOURCE AND DRAIN REGIONS ARE DEFINED. IN ONE EMBODIMENT A REFACTORY METALLIC FILM IS DEPOSITED OVER AN INSULATING FILM AND ETCHED TO FORM THE GATE. SUBSEQUENTLY, THE METALLIC FILM MAY SERVE AS A DIFFUSION MASK, ALTHOUGH THIS IS NOT ESSENTIAL. THE METALLIC FILM IS PATTERNED BY PHOTORESIST MASKING AND ETCHING. THE PORTION OF THE METALLIC FILM OVERLYING THE CHANNEL REGION OF THE SEMICONDUCTOR BODY THEREOF IS USED AS A GATE. AS A RESULT OF SIMULTANEOUS DEFINITION OF THE CHANNEL-ADJACENT PLORTIONS OF SOURCE AND DRAIN REGIONS AND PATTERNING OF THE CHANNELALIGNED PORTIONS OF THE GATE, WHEN SOURCE AND DRAIN REGIONS ARE FORMED BY DIFFUSION OF ACTIVATORS INTO THE SILICON WAFER, AUTOMATIC REGISTRATION OF THE GATE-ADJACENT PORTIONS OF THE SOURCE AND DRAIN JUNCTIONS BENEATH THE GATE IS ACHIEVED.