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公开(公告)号：US20060032527A1
公开(公告)日：2006-02-16
申请号：US11192324
申请日：2005-07-27
IPC分类号： H01L25/00
CPC分类号： H02S20/23 , F24S20/67 , F24S25/61 , F24S2020/13 , H01L31/048 , Y02B10/12 , Y02B10/20 , Y02E10/47 , Y02E10/50
摘要： A solar panel overlay for mounting on an underlying roof deck comprises a substrate and at least one row of photovoltaic cells on the substrate. The photovoltaic cells define a solar collecting surface having an appearance mimicking that of the underlying roof deck. A solar panel overlay assembly comprising a plurality of interconnect solar panel overlays is also provided.
摘要翻译： 用于安装在下面的屋顶甲板上的太阳能电池板覆盖物包括衬底和衬底上的至少一排光伏电池。 光伏电池限定了具有模仿下面的屋顶甲板的外观的太阳能收集表面。 还提供了包括多个互连太阳能电池板覆盖物的太阳能电池板覆盖组件。
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公开(公告)号：US20050284515A1
公开(公告)日：2005-12-29
申请号：US11145067
申请日：2005-06-06
IPC分类号： F24J2/52 , H01L23/32 , H01L25/00 , H01L27/00 , H01L31/042 , H01L31/048 , H01L31/052 , H05K7/00
CPC分类号： H02S20/23 , F24S25/40 , H01L31/048 , H01L31/0521 , H01L2924/0002 , H02S40/34 , Y02B10/12 , Y02B10/20 , Y02E10/47 , Y02E10/50 , H01L2924/00
摘要： A flexible solar module is provided sufficient rigidity for use in construction, and comparable rigidity to a glass based solar module, by incorporation of a metal backing to the module, preferably in the laminated module. The rigidity of the construction is enhanced by the inclusion of a corrugation, either in the metal backing, or in a structure that is affixed to the backing. The resulting structure is a modular unit that has connection points and does not need to be connected to other modules to operate. A connection point is provided by an integrated junction box that allows for a simpler installation and the use of standard building techniques for the installation on a roof or wall.
摘要翻译： 通过将金属背衬结合到模块中，优选地在层压模块中，柔性太阳能模块提供足够的刚度用于建筑中，以及与玻璃基太阳能模块相当的刚性。 通过在金属背衬中或在固定到背衬的结构中包括波纹来增强结构的刚性。 所得到的结构是具有连接点的模块化单元，并且不需要连接到其他模块来操作。 连接点由集成接线盒提供，允许更简单的安装和使用标准的建筑技术来安装在屋顶或墙壁上。
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3.发明申请公开(公告)号：US20050217721A1
公开(公告)日：2005-10-06
申请号：US11135080
申请日：2005-05-23
IPC分类号： H01L31/0216 , H01L31/0352 , H01L31/042 , H01L31/00
CPC分类号： H01L31/035281 , H01L31/02008 , H01L31/02168 , H01L31/0547 , Y02E10/52
摘要： A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.
摘要翻译： 提供一种制造光伏太阳能电池的方法。 提供多个大致球形的半导体元件。 每个半导体元件具有形成p-n结的芯和外表面表面。 在每个半导体元件的外表面上沉积防反射涂层，并且将每个半导体元件结合到穿孔铝箔阵列中，从而向p-n结的第一侧提供欧姆接触。 从每个半导体元件的一部分去除防反射涂层，然后将芯暴露，由此允许欧姆接触到p-n结的第二侧。
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公开(公告)号：US08685534B2
公开(公告)日：2014-04-01
申请号：US13349900
申请日：2012-01-13
CPC分类号： C08K3/14 , C08K3/22 , C08K3/28 , C08K2201/016 , Y10T428/25
摘要： In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.
摘要翻译： 在一个实施方案中，本发明提供了一种高导热性树脂，其包含主体树脂基体32和高导热性填料30.高导热性填料与主体树脂基体形成连续的有机 - 无机复合材料，并且填料具有 长宽比在3-100之间。 填料基本上均匀地分布在主体树脂基质中，并且在基本上相同的方向上排列。 在一些实施方案中，树脂是高度结构化的树脂类型。
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公开(公告)号：US08277613B2
公开(公告)日：2012-10-02
申请号：US12690144
申请日：2010-01-20
申请人： James D. B. Smith , Gary Stevens , John W. Wood
发明人： James D. B. Smith , Gary Stevens , John W. Wood
IPC分类号： D21F11/00
CPC分类号： B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
摘要： The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
摘要翻译： 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，并且高导热性材料覆盖主体基质表面的15-55％。 多个表面，包括我有图案的子层。
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公开(公告)号：US07851059B2
公开(公告)日：2010-12-14
申请号：US11529453
申请日：2006-09-28
申请人： Gary Stevens , James D. B. Smith , John W. Wood
发明人： Gary Stevens , James D. B. Smith , John W. Wood
CPC分类号： H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
摘要： A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
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7.发明申请Nano and meso shell-core control of physical properties and performance of electrically insulating composites 有权纳米和内核壳芯控制电气绝缘复合材料的物理性能和性能公开(公告)号：US20100239851A1
公开(公告)日：2010-09-23
申请号：US11529453
申请日：2006-09-28
申请人： Gary Stevens , James D.B. Smith , John W. Wood
发明人： Gary Stevens , James D.B. Smith , John W. Wood
CPC分类号： H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
摘要： A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
摘要翻译： 由主体树脂基体（42）和高导热性填料（30）构成的高导热性树脂，其混合在主体树脂内以形成树脂混合物。 填料包含至少3-5重量％的树脂混合物，并且填料在至少一个维度上平均为1-100nm，并且其中颗粒小于平均粒径为1000nm的颗粒' 最长尺寸。 主体树脂基体在高导热性填料（30）周围形成有序的树脂壳（40），由此树脂分子垂直于高热导率填料的表面排列。 在高导热性填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物产生有序树脂壳的连续路径。
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公开(公告)号：US20080262128A1
公开(公告)日：2008-10-23
申请号：US12164591
申请日：2008-06-30
申请人： Gary Stevens , James D.B. Smith , John W. Wood
发明人： Gary Stevens , James D.B. Smith , John W. Wood
CPC分类号： C08G83/001 , C08J5/046 , C08J2363/00 , C08K3/14 , C08K3/22 , C08L63/00 , D21H13/44 , H05K1/0373 , H05K2201/0251 , H05K2201/0278 , Y10T428/23943 , Y10T428/2907 , Y10T428/2913 , Y10T428/292 , Y10T428/2924 , Y10T428/2925 , Y10T428/2933 , Y10T428/2936 , Y10T428/2947 , Y10T442/2738 , C08L2666/54
摘要： Polymer brushes (50) in a resin that create phonon pathways therein The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).
摘要翻译： 在其中产生声子通道的树脂中的聚合物刷（50）聚合物刷本身包含密度为0.8至1.0g / cc，链长为1至1000nm，热导率为0.5至5.0W的结构化聚合物毛 / mK。 聚合物刷是树脂的10-25体积％，聚合物毛可以将周围的树脂分子定向到聚合物毛发排列（55）。
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公开(公告)号：US20050276977A1
公开(公告)日：2005-12-15
申请号：US11132802
申请日：2005-05-19
申请人： James Blackhall Smith , Gary Stevens , John Wood
发明人： James Blackhall Smith , Gary Stevens , John Wood
CPC分类号： H01B3/006 , B82Y30/00 , C01P2004/13 , C01P2004/20 , C01P2004/32 , C01P2004/50 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C09C1/028 , C09C1/043 , C09C1/3054 , C09C1/3661 , C09C1/407 , C09C3/063 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , Y10T428/2991 , Y10T428/2998
摘要： In one embodiment the present invention provides for a diamond like coating on small particles. This comprises small particles 10 in the size range of approximately 1-1000 nm and a diamond like coating on the small particles. The diamond like coating is distributed over approximately 50-100% of the surface of the small particles and the diamond like coating is one micron or less in thickness. These small particles then may be applied to materials such as resins 12 and insulating tapes.
摘要翻译： 在一个实施方案中，本发明提供了在小颗粒上的类金刚石涂层。 这包括尺寸范围约为1-1000nm的小颗粒10和在小颗粒上的金刚石样涂层。 金刚石状涂层分布在小颗粒表面的大约50-100％之上，并且类似金刚石的涂层的厚度为1微米或更小。 这些小颗粒然后可以应用于诸如树脂12和绝缘带的材料。
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公开(公告)号：US20050274774A1
公开(公告)日：2005-12-15
申请号：US11106846
申请日：2005-04-15
申请人： James Smith , Gary Stevens , John Wood
发明人： James Smith , Gary Stevens , John Wood
CPC分类号： H01B3/52 , D21H13/44 , D21H17/67 , H01B3/54 , Y10T428/25 , Y10T428/251 , Y10T428/256
摘要： The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
摘要翻译： 本发明提供了一种高导热性（HTC）纸，其包括诸如云母的主体基质和插入到主体基质中的HTC材料。 HTC材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层中的至少一种构成。
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