公开(公告)号：US07337528B2

公开(公告)日：2008-03-04

申请号：US11021444

申请日：2004-12-23

申请人： Gregory J. Dunn ,  Jovica Savic ,  John A. Svigelj ,  Nadia Yala

发明人： Gregory J. Dunn ,  Jovica Savic ,  John A. Svigelj ,  Nadia Yala

IPC分类号： H01P11/00

CPC分类号： H01Q9/0407 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49165

摘要： A textured dielectric patch antenna is fabricated by applying a first mask pattern (310, 510, 610, 710, 915, 1015, 1210) to a first side of a solid panel made of a first material that is a ceramic dielectric and then sandblasting the solid panel through the first mask pattern from the first side to at least partially generate a shaped cavity (315, 920, 1040). The shaped cavity of the solid panel may be filled with a second material (330, 740). The first and second materials have substantially differing dielectric constants. The first side and second side of the solid panel are metallized (325), forming a patch antenna. The shaped cavities can be made more complex by using additional masking and/or sandblasting steps.

摘要翻译： 通过将第一掩模图案（310,510,610,710,915,1015,1210）施加到由作为陶瓷电介质的第一材料制成的实心面板的第一侧上，然后对其进行喷砂来制造纹理化介质贴片天线 通过第一掩模图案从第一侧至少部分地产生成形腔（315,920,1040）。 固体面板的成形腔可以填充有第二材料（330,740）。 第一和第二材料具有基本上不同的介电常数。 固体面板的第一侧面和第二侧被金属化（325），形成贴片天线。 通过使用额外的掩模和/或喷砂步骤，可使成形的空腔变得更加复杂。

公开(公告)号：US20060137173A1

公开(公告)日：2006-06-29

申请号：US11021444

申请日：2004-12-23

申请人： Gregory Dunn ,  Jovica Savic ,  John Svigelj ,  Nadia Yala

发明人： Gregory Dunn ,  Jovica Savic ,  John Svigelj ,  Nadia Yala

IPC分类号： H01P11/00 ,  H01K3/10

CPC分类号： H01Q9/0407 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49165

摘要： A textured dielectric panel (305, 520, 625, 745, 925, 1035, 1205) is fabricated by applying a first mask pattern (310, 510, 610, 710, 915, 1015, 1210) to a first side of a solid panel made of a first material that is a ceramic dielectric and then sandblasting the solid panel through the first mask pattern from the first side to at least partially generate a shaped cavity (315, 920, 1040). The shaped cavity of the solid panel may be filled with a-second material (330, 740). The first and second materials have substantially differing dielectric constants. The first side and second side of the solid panel may be metallized (325), forming a patch antenna. The shaped cavities can be made more complex by using additional masking and/or sandblasting steps.

摘要翻译： 通过将第一掩模图案（310,510,610,710,915,1015,1210）施加到固体面板的第一侧来制造纹理化电介质面板（305,520,625,745,925,1035,1205） 由第一材料制成，其是陶瓷电介质，然后通过第一掩模图案从第一侧喷砂固体板，以至少部分地产生成型腔（315,920,1040）。 固体面板的成形腔可以填充有第二材料（330,740）。 第一和第二材料具有基本上不同的介电常数。 固体面板的第一面和第二面可以金属化（325），形成贴片天线。 通过使用额外的掩模和/或喷砂步骤，可使成形的空腔变得更加复杂。

公开(公告)号：US06774497B1

公开(公告)日：2004-08-10

申请号：US10402631

申请日：2003-03-28

申请人： Jing Qi ,  Janice M. Danvir ,  Tomasz L. Klosowiak ,  Prasanna Kulkarni ,  Nadia Yala

发明人： Jing Qi ,  Janice M. Danvir ,  Tomasz L. Klosowiak ,  Prasanna Kulkarni ,  Nadia Yala

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13021 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/274 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a plurality of connective bumps extending from the active surface, each connective bump including a side region. A thin layer of an underfill material is applied to the active surface of the flip chip and to a portion of the side regions of the connective bumps. The flip chip is positioned on the electrical substrate, the electrical substrate including a thick layer of a solder mask disposed on the electrical substrate. The flip chip is heated to electrically connect the flip chip to the electrical substrate, wherein the underfill material and the solder mask combine to form a stress-relief layer when the flip chip is electrically connected to the electrical substrate.

摘要翻译： 本发明提供了一种将倒装芯片附接到诸如印刷线路板的电气基板的方法。 提供了凸起的倒装芯片，该倒装芯片包括有源表面和从活性表面延伸的多个连接凸块，每个连接凸块包括侧面区域。 将底层填充材料的薄层施加到倒装芯片的有源表面和连接凸块的一部分侧面区域。 倒装芯片位于电气基板上，电气基板包括设置在电气基板上的焊接掩模的厚层。 将倒装芯片加热以将倒装芯片电连接到电气基板，其中当倒装芯片电连接到电气基板时，底部填充材料和焊接掩模组合形成应力消除层。

公开(公告)号：US07265994B2

公开(公告)日：2007-09-04

申请号：US10356419

申请日：2003-01-31

申请人： Janice Danvir ,  Katherine Devanie ,  Nadia Yala

发明人： Janice Danvir ,  Katherine Devanie ,  Nadia Yala

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K3/305 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32058 ,  H01L2224/73103 ,  H01L2224/73203 ,  H05K3/3436 ,  H05K7/1053 ,  H05K2201/0129 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2924/00012

摘要： A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

摘要翻译： 自支撑的底部填充膜（18）将表面贴装集成电路封装（14）粘合地粘合到印刷电路板（10）上。 印刷电路板在表面上具有导电迹线（12）和暴露的导电焊盘（13）。 薄膜粘合剂在导电焊盘附近在印刷电路板上有策略地定位，然后将表面贴装集成电路封装放置在板上，使得封装上的导电焊盘（16）与板上的导电焊盘对准。 当封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充物以增加焊点的机械完整性。

公开(公告)号：US06650022B1

公开(公告)日：2003-11-18

申请号：US10241017

申请日：2002-09-11

申请人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

发明人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

IPC分类号： H01L3300

CPC分类号： H01L22/24 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2203/161 ,  H01L2924/00

摘要： A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

摘要翻译： 凸起的半导体器件（10）在机器视觉系统中被照亮时表现出增强的图案识别。 半导体器件在一个面上具有基本上共面的焊料凸块阵列（16）和底部填充材料（17）的涂层。 包含图像增强剂的助熔剂组合物（18）被选择性地沉积在阵列中的至少两个焊料凸块上，以改变焊料凸块的光学特性，以使得焊料凸块相对于底部填充材料的背景而显得明亮， 半导体器件被选择的波长的光照射（19）。