公开(公告)号：US06171921B2

公开(公告)日：2001-01-09

申请号：US09093007

申请日：1998-06-05

申请人： Gregory J. Dunn ,  Steven M. Scheifers

发明人： Gregory J. Dunn ,  Steven M. Scheifers

IPC分类号： B05D512

CPC分类号： H05K1/167 ,  H01C17/003 ,  H01C17/065 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2203/0568

摘要： A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer. Thereafter, subsequent processing is preformed to include the photoimageable layer as a permanent photoimageable layer of a circuit board, with the resistive mass and appropriate terminations forming a resistor in the permanent photoimageable layer.

摘要翻译： 一种用于形成可以精确获得尺寸的厚膜电阻器的方法，从而产生精确的电阻值。 该方法包括在基底上提供优选形成多层结构的永久介电层的可光成像层。 在光致成像层的表面中光刻限定开口，然后用电阻材料过满，以形成具有位于围绕开口的可光成象层的表面上的多余部分的电阻质量。 在固化之后，电阻材料的表面在可光成像层的表面下凹陷，电阻质量块的过剩部分优选通过研磨或类似的操作被去除，使得电阻质量的横向尺寸被确定 通过可光成像层中的开口的横向尺寸。 此后，进行后续处理，以将可光成像层作为电路板的永久可光成像层，其中电阻质量和合适的端接在永久可光成像层中形成电阻器。

公开(公告)号：US06229098B1

公开(公告)日：2001-05-08

申请号：US09621148

申请日：2000-07-21

申请人： Gregory J. Dunn ,  Steven M. Scheifers

发明人： Gregory J. Dunn ,  Steven M. Scheifers

IPC分类号： H05K116

CPC分类号： H05K1/167 ,  H01C17/003 ,  H01C17/065 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2203/0568

摘要： A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer. Thereafter, subsequent processing is performed to include the photoimageable layer as a permanent photoimageable layer of a circuit board, with the resistive mass and appropriate terminations forming a resistor in the permanent photoimageable layer.

摘要翻译： 一种用于形成可以精确获得尺寸的厚膜电阻器的方法，从而产生精确的电阻值。 该方法包括在基底上提供优选形成多层结构的永久介电层的可光成像层。 在光致成像层的表面中光刻限定开口，然后用电阻材料过满，以形成具有位于围绕开口的可光成象层的表面上的多余部分的电阻质量。 在固化之后，电阻材料的表面在可光成像层的表面下凹陷，电阻质量块的过剩部分优选通过研磨或类似的操作被去除，使得电阻质量的横向尺寸被确定 通过可光成像层中的开口的横向尺寸。 此后，进行后续处理，将可光成像层作为电路板的永久可光成像层，其中电阻质量和适当的端接在永久可光成像层中形成电阻器。

公开(公告)号：US06858660B1

公开(公告)日：2005-02-22

申请号：US10631374

申请日：2003-07-31

申请人： Steven M. Scheifers ,  Andrew F Skipor ,  Aaron Brown

发明人： Steven M. Scheifers ,  Andrew F Skipor ,  Aaron Brown

IPC分类号： C08F2/00 ,  C09J4/00 ,  H05K1/03 ,  H05K3/22 ,  H05K3/28 ,  H05K3/30 ,  C08K9/00 ,  B32B15/02

CPC分类号： C09J4/00 ,  B29C73/163 ,  B29C73/22 ,  H05K1/0373 ,  H05K3/225 ,  H05K3/284 ,  H05K3/305 ,  H05K2203/1163 ,  Y10T428/2985

摘要： A self-joining polymer composition, comprising a polymer, a plurality of amine pendant groups attached to the polymer and a plurality of microcapsules of flowable polymerizable material dispersed in the polymer where the microcapsules of flowable polymerizable material including microcapsules and flowable polymerizable material inside the microcapsules. The microcapsules are effective for rupturing with a failure of the polymer so the flowable polymerizable material cross-links with the reactable pendant groups upon rupture of the microcapsules.

摘要翻译： 一种自聚合物组合物，包括聚合物，多个连接到聚合物上的胺侧基和分散在聚合物中的多个可流动的可聚合材料的微胶囊，其中包含微胶囊的可流动的可聚合材料的微胶囊和可流动的可聚合材料在微囊内 。 微胶囊对聚合物破裂是有效的，因此当可微聚合物破裂时可流动的可聚合材料与可反应的侧基交联。

公开(公告)号：US06677607B2

公开(公告)日：2004-01-13

申请号：US10057367

申请日：2002-01-25

申请人： Steven M. Scheifers ,  Daniel R. Gamota ,  Paul W. Brazis, Jr. ,  Jie Zhang ,  Lawrence E. Lach

发明人： Steven M. Scheifers ,  Daniel R. Gamota ,  Paul W. Brazis, Jr. ,  Jie Zhang ,  Lawrence E. Lach

IPC分类号： H01L3524

CPC分类号： H01L51/0545 ,  H01L21/31683 ,  H01L51/0021 ,  H01L51/0512

摘要： A semiconductor device having a flexible or rigid substrate (11) having a gate electrode (21), a source electrode (61 and 101), and a drain electrode (62 and 102) formed thereon and organic semiconductor material (51, 81, and 91) disposed at least partially thereover. The gate electrode (21) has a thin dielectric layer 41 formed thereabout through oxidation. In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.

摘要翻译： 一种具有柔性或刚性基板（11）的半导体器件，具有栅电极（21），源电极（61,101）和形成在其上的漏极电极（62和102）和有机半导体材料（51,81和 91）至少部分地设置在其上。 栅电极（21）具有通过氧化形成在其周围的薄介电层41。 在许多实施例中，可以通过接触或非接触印刷形成任何上述元件。 可以容易地缩放所得到的装置的尺寸以适应各种需要。

公开(公告)号：US06603141B2

公开(公告)日：2003-08-05

申请号：US10034337

申请日：2001-12-28

申请人： Lawrence E. Lach ,  Steven M. Scheifers ,  Jie Zhang ,  Daniel R. Gamota ,  Paul W. Brazis, Jr.

发明人： Lawrence E. Lach ,  Steven M. Scheifers ,  Jie Zhang ,  Daniel R. Gamota ,  Paul W. Brazis, Jr.

IPC分类号： H01L2700

CPC分类号： H01L51/0508 ,  H01L51/0004 ,  H01L51/0005 ,  H01L51/0021

摘要： A semiconductor device formed of a flexible or rigid substrate (10) having a gate electrode (11), a source electrode (12), and a drain electrode (13) formed thereon and organic semiconductor material (14) disposed at least partially thereover. With appropriate selection of material, the gate electrode (11) will form a Schottky junction and an ohmic contact will form between the organic semiconductor material (14) and each of the source electrode (12) and drain electrode (13). In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.

摘要翻译： 由具有形成在其上的栅电极（11），源电极（12）和漏电极（13）的柔性或刚性基板（10）形成的半导体器件和至少部分地设置在其上的有机半导体材料（14）构成。 通过适当选择材料，栅电极（11）将形成肖特基结，在有机半导体材料（14）与源电极（12）和漏电极（13）之间形成欧姆接触。 在许多实施例中，可以通过接触或非接触印刷形成任何上述元件。 可以容易地缩放所得到的装置的尺寸以适应各种需要。

公开(公告)号：US20090017268A1

公开(公告)日：2009-01-15

申请号：US11776087

申请日：2007-07-11

申请人： Andrew F. Skipor ,  Steven M. Scheifers

发明人： Andrew F. Skipor ,  Steven M. Scheifers

IPC分类号： B32B3/10 ,  G03F7/20 ,  C08F2/50

CPC分类号： G03F7/038 ,  Y10T428/24802

摘要： Free standing quantum do (FSQDT) polymer composites and a method and apparatus for patterning the FSQDT polymer composites is provided. The method for patterning the FSQDT polymer composites includes creating a solution including FSQDTs where each of the FSQDTs has a plurality of reactive ligands chemically attached thereto. The method further includes providing a substrate, forming a coated substrate by coating a surface of the substrate with a layer of the solution, and providing a photo mask having a predetermined pattern thereon transparent to a predetermined radiation over the coated substrate. Finally, the method includes exposing a portion of the coated substrate to the predetermined radiation passing through the mask to pattern a polymer matrix in the predetermined pattern while adhering the FSQDTs to the polymer matrix to form the FSQDT polymer composite.

摘要翻译： 提供了自由立体量子（FSQDT）聚合物复合材料和用于图案化FSQDT聚合物复合材料的方法和设备。 图案化FSQDT聚合物复合材料的方法包括产生包括FSQDT的溶液，其中每个FSQDT具有与其化学连接的多个反应性配体。 该方法还包括提供基底，通过用溶液层涂覆基底的表面形成涂覆的基底，并且提供具有预定图案的光掩模，其上涂覆的基底上的预定辐射透明。 最后，该方法包括将涂覆的基底的一部分暴露于通过掩模的预定辐射，以将FSQDTs粘附到聚合物基质上以形成FSQDT聚合物复合材料，从而以预定图案形成聚合物基质。

公开(公告)号：US07197110B2

公开(公告)日：2007-03-27

申请号：US10999083

申请日：2004-11-29

申请人： Michael Riess ,  Steven M. Scheifers ,  William L. Olson

发明人： Michael Riess ,  Steven M. Scheifers ,  William L. Olson

IPC分类号： G01N23/223 ,  G01N23/06

CPC分类号： H05K3/00 ,  G01N23/06 ,  G01N23/223 ,  G01N2223/076 ,  H05K2203/162

摘要： A method for identifying hazardous substances in a printed wiring assembly having a plurality of discrete components, using micro X-ray fluorescence spectroscopy. A micro X-ray fluorescence spectroscopy (μ-XRF) and/or X-ray Absorption Fine Structure (XAFS) spectroscopy are used as detecting analyzers, to identify materials of concern in an electronic device. The device or assembly to be examined is analyzed by moving it in the X, Y, and Z directions under a probe in response to information in a reference database, to determine elemental composition at selected locations on the assembly, the probe positioned at an optimum analytical distance from each selected location for analysis. The determined elemental composition at each selected location is then correlated to the reference database, and the detected elements are assigned to the various components in the assembly.

摘要翻译： 一种使用微X射线荧光光谱法鉴定具有多个分立元件的印刷线路组件中的有害物质的方法。 使用微X射线荧光光谱（μ-XRF）和/或X射线吸收精细结构（XAFS）光谱作为检测分析仪，以识别电子设备中关注的材料。 要检查的设备或组件是通过在探针下在X，Y和Z方向上移动来响应于参考数据库中的信息来分析的，以确定组件上选定位置处的元素组成，探针定位在最佳状态 从每个选定位置的分析距离进行分析。 然后将确定的每个选定位置的元素组成与参考数据库相关联，并将检测到的元素分配给组件中的各种组件。

公开(公告)号：US06562663B2

公开(公告)日：2003-05-13

申请号：US09819393

申请日：2001-03-28

申请人： Steven M. Scheifers ,  Andrew Skipor ,  Daniel Gamota

发明人： Steven M. Scheifers ,  Andrew Skipor ,  Daniel Gamota

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/0401

摘要： A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.

公开(公告)号：US07989153B2

公开(公告)日：2011-08-02

申请号：US11776087

申请日：2007-07-11

申请人： Andrew F. Skipor ,  Steven M. Scheifers

发明人： Andrew F. Skipor ,  Steven M. Scheifers

IPC分类号： G03F7/00 ,  G03F1/00

CPC分类号： G03F7/038 ,  Y10T428/24802

摘要： Free standing quantum do (FSQDT) polymer composites and a method and apparatus for patterning the FSQDT polymer composites is provided. The method for patterning the FSQDT polymer composites includes creating a solution including FSQDTs where each of the FSQDTs has a plurality of reactive ligands chemically attached thereto. The method further includes providing a substrate, forming a coated substrate by coating a surface of the substrate with a layer of the solution, and providing a photo mask having a predetermined pattern thereon transparent to a predetermined radiation over the coated substrate. Finally, the method includes exposing a portion of the coated substrate to the predetermined radiation passing through the mask to pattern a polymer matrix in the predetermined pattern while adhering the FSQDTs to the polymer matrix to form the FSQDT polymer composite.

摘要翻译： 提供了自由立体量子（FSQDT）聚合物复合材料和用于图案化FSQDT聚合物复合材料的方法和设备。 图案化FSQDT聚合物复合材料的方法包括产生包括FSQDT的溶液，其中每个FSQDT具有与其化学连接的多个反应性配体。 该方法还包括提供基底，通过用溶液层涂覆基底的表面形成涂覆的基底，并且提供具有预定图案的光掩模，其上涂覆的基底上的预定辐射透明。 最后，该方法包括将涂覆的基底的一部分暴露于通过掩模的预定辐射，以将FSQDTs粘附到聚合物基质上以形成FSQDT聚合物复合材料，从而以预定图案形成聚合物基质。

公开(公告)号：US20100085715A1

公开(公告)日：2010-04-08

申请号：US12247150

申请日：2008-10-07

申请人： Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

发明人： Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

IPC分类号： H05K3/22 ,  H05K1/14

CPC分类号： H05K3/321 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T29/49004 ,  H01L2924/00

摘要： A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.

摘要翻译： 公开了一种用于创建模块化电子组件的制造方法和制造系统。 制造系统300可以相对于印刷电子基板112的接触垫204定位印刷电子部件模块102的接触端子202.制造系统300可以使用导电粘合剂连接将接触端子202连接到接触垫204 116。