公开(公告)号：US08255866B2

公开(公告)日：2012-08-28

申请号：US13085432

申请日：2011-04-12

申请人： Han-Long Chen ,  Shi-Piao Luo ,  Cheng-Hsien Lee ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Han-Long Chen ,  Shi-Piao Luo ,  Cheng-Hsien Lee ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： G06F17/50

CPC分类号： G06F17/5081

摘要： A computing device and a method involves selection of one or more transmission lines from a printed circuit board (PCB) layout file, reading a transmission line from the one or more selected transmission lines, and determining neighboring anti-pads of the read transmission line in the PCB layout file. The computing device and method further determine an actual distance between the read transmission line and a neighboring anti-pad. If the actual distance is less than a preset standard distance, the computing device and method determine that the read transmission line and the neighboring anti-pad do not satisfy design requirements, and highlight the read transmission line and the neighboring anti-pad, to prompt a user to amend design of the read transmission line and the neighboring anti-pad.

摘要翻译： 计算装置和方法包括从印刷电路板（PCB）布局文件中选择一条或多条传输线，从一条或多条所选传输线读取传输线，以及确定读传输线的相邻抗焊盘 PCB布局文件。 计算设备和方法进一步确定读取传输线与相邻反焊盘之间的实际距离。 如果实际距离小于预设的标准距离，则计算设备和方法确定读取传输线路和相邻的反焊盘不满足设计要求，并突出显示读取传输线路和相邻的反焊盘，以提示 用户修改读取传输线的设计和相邻的反焊盘。

公开(公告)号：US08402423B2

公开(公告)日：2013-03-19

申请号：US13244625

申请日：2011-09-25

申请人： Zheng Shan ,  Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Zheng Shan ,  Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： G06F17/50 ,  G06F9/455

CPC分类号： G06F17/5077

摘要： In a method for verifying a printed circuit board (PCB) layout using a computing device, a PCB simulation file is obtained from a storage device of the computing device, and a PCB image is displayed on a display device according to the PCB simulation file. The PCB image includes multiple signal lines and switching voltage regulator nodes (SVRN). A SVRN to be checked is selected from the PCB image, and all signal lines around the SVRN are searched. The method calculates a layout distance between the selected SVRN and each of the searched signal lines, and generates a graphical window interface to position a signal line whose layout distance is equal to or less than the minimum distance. The method further modifies the layout of the positioned signal line to satisfy a layout design specification by increasing the layout distance to the minimum distance.

摘要翻译： 在使用计算装置验证印刷电路板（PCB）布局的方法中，从计算装置的存储装置获得PCB模拟文件，并且根据PCB仿真文件在显示装置上显示PCB图像。 PCB图像包括多个信号线和开关电压调节器节点（SVRN）。 从PCB图像中选择要检查的SVRN，并搜索SVRN周围的所有信号线。 该方法计算所选择的SVRN与所搜索的信号线之间的布局距离，并且生成图形窗口界面以定位其布局距离等于或小于最小距离的信号线。 该方法通过将布局距离增加到最小距离来进一步修改定位信号线的布局以满足布局设计规范。

公开(公告)号：US08255864B2

公开(公告)日：2012-08-28

申请号：US12961908

申请日：2010-12-07

申请人： Jia-Lu Ye ,  Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Jia-Lu Ye ,  Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  G06F2217/82

摘要： A computing device and a method selects a signal transmission line from a circuit board, computes an actual length of each line segment of the selected signal transmission line, and computes an actual distance between each line segment of the selected signal transmission line and a corresponding line segment of each neighboring signal transmission line. If each actual length is less than or equal to a corresponding reference length and each actual distance is more than or equal to a corresponding reference distance, the device and method determines a design of the selected signal transmission line satisfies the design standards. Otherwise, if any actual length is more than a corresponding reference length, or if any actual distance is less than a corresponding reference distance, the device and method determines the design of the signal transmission line does not satisfy the design standards.

摘要翻译： 计算装置和方法从电路板选择信号传输线，计算所选择的信号传输线的每个线段的实际长度，并且计算所选信号传输线的每个线段与对应线之间的实际距离 每个相邻信号传输线的段。 如果每个实际长度小于或等于对应的参考长度，并且每个实际距离大于或等于相应的参考距离，则设备和方法确定所选信号传输线的设计满足设计标准。 否则，如果任何实际长度大于相应的参考长度，或者如果任何实际距离小于相应的参考距离，则设备和方法确定信号传输线的设计不符合设计标准。

公开(公告)号：US08243466B2

公开(公告)日：2012-08-14

申请号：US12872652

申请日：2010-08-31

申请人： Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Shi-Piao Luo ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： H05K7/00

CPC分类号： H05K1/0245 ,  H05K1/0243

摘要： A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout.

摘要翻译： 印刷电路板包括第一层和第二层，控制芯片，焊盘和几个电子元件。 可以选择性地施加接合焊盘以以简单的布局将第一层和第二层以及控制芯片与任何电子元件互连。

公开(公告)号：US08247704B2

公开(公告)日：2012-08-21

申请号：US12503680

申请日：2009-07-15

申请人： Chia-Nan Pai ,  Han-Long Chen ,  Ning Li ,  Shou-Kuo Hsu

发明人： Chia-Nan Pai ,  Han-Long Chen ,  Ning Li ,  Shou-Kuo Hsu

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/0239 ,  H05K1/0245 ,  H05K1/0295 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09254 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

摘要： A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.

摘要翻译： 母板互连装置包括顶层，底层，位于顶层上的第一和第三电子元件以及位于底层上的第二和第四电子元件。 顶层上的第一电子元件的第一端通过第一通孔连接到底层上的第二电子元件的第一端，并且顶层上的第三电子元件的第一端连接到 第四电子元件的第一端部具有第二通孔。 顶层上的两个电子元件的第二端连接到第一部分，底层上的两个电子元件的第二端连接到第二部分。

公开(公告)号：US08146048B2

公开(公告)日：2012-03-27

申请号：US12699839

申请日：2010-02-03

申请人： Han-Long Chen ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Han-Long Chen ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： G06F17/50

CPC分类号： G06F17/5068

摘要： A system and method for removing T-point elements with unused stubs from a printed circuit board (PCB) layout design obtains each signal line including one or more T-point elements in the PCB layout design, divides the obtained signal line into a plurality of lines according to the one or more T-point elements with unused stubs, and obtains properties of each of the plurality of lines. The system and method further deletes the original layout of the signal line and reconnects the plurality of lines according to the properties of each of the plurality of lines to generate a reconnected signal line, and outputs the reconnected signal line on a display device.

摘要翻译： 用于从印刷电路板（PCB）布局设计中去除具有未使用的短截线的T点元件的系统和方法获得在PCB布局设计中包括一个或多个T点元件的每条信号线，将获得的信号线分成多个 根据具有未使用短截线的一个或多个T点元素的线，并且获得多条线中的每一条的属性。 该系统和方法进一步删除信号线的原始布局，并根据多条线中的每条线路的属性重新连接多条线路，以产生重新连接的信号线，并将重新连接的信号线输出到显示设备上。

公开(公告)号：US08441327B2

公开(公告)日：2013-05-14

申请号：US12960321

申请日：2010-12-03

申请人： Hua-Li Zhou ,  Ming Wei ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Hua-Li Zhou ,  Ming Wei ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： H03H7/38

CPC分类号： H05K1/0245 ,  H05K2201/09727

摘要： A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C ⁢ ⁢ 1 × H × ( C ⁢ ⁢ 2 × H 0.8 ⁢ W 0 + T ) C ⁢ ⁢ 3 × ⅇ C ⁢ ⁢ 4 × S 0 H - 1 1 - C ⁢ ⁢ 3 × ⅇ C ⁢ ⁢ 4 × S H - 1.25 ⁢ T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=−0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.

摘要翻译： 印刷电路板包括绝缘层和附着到绝缘层的信号层。 信号层包括一对差动传输线。 差分传输线路的宽度W根据以下公式根据差分传输线路之间的空间S的变化而变化：W = C⁢1×H×（Cé2×H 0.8W 0 + T）C uch 3×ⅇC ud 4×S 0 H-1 1 -C⁢3×ⅇC ud 4×SH-1.25T在上式中，C1 = 7.475，C2 = 5.98，C3 = 0.48，C4 = -0.96，H是绝缘层的厚度，W0是差分传输线的原始宽度，S0是差动传输线之间的原始空间，T是各个差分传输线的厚度 差动传输线。

公开(公告)号：US08194412B2

公开(公告)日：2012-06-05

申请号：US12647395

申请日：2009-12-25

申请人： Hua-Li Zhou ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Hua-Li Zhou ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： H05K1/18 ,  H05K1/16 ,  H05K7/00

CPC分类号： H05K1/0253 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

摘要： A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8 ⁢ Wpad + 10 ⁢ T 0.8 ⁢ Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.

摘要翻译： 印刷电路板包括信号平面和参考平面。 信号平面包括焊盘，安装在焊盘上的无源元件以及通过焊盘与无源元件电连接的信号传输线。 参考平面为通过无源元件和信号传输线传输的信号提供返回路径。 在对应于无源元件的参考平面中定义空隙，以增加返回路径的长度。 垂直于信号传输线的第一轴的长度满足以下等式：W 1≈8Wpad+ 10T 0.8Wtrace + T，其中Wpad是焊盘的宽度，Wtrace是 传输线的宽度，T是焊盘的高度。

公开(公告)号：US08058557B2

公开(公告)日：2011-11-15

申请号：US11957416

申请日：2007-12-15

申请人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Chia-Nan Pai

发明人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Chia-Nan Pai

IPC分类号： H05K1/00

CPC分类号： H05K1/0245 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09672

摘要： An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.

摘要翻译： 示例性PCB包括第一参考层，第一信号层，第二信号层和第三信号层，第一差分对以边缘耦合结构布置在第一信号层中，并参考第一参考层 第一信号层和第二信号层之间的距离大于第一参考层和第一信号层之间的距离，第二差分对被布置在第二信号层中，第三信号层以广泛耦合结构 。 PCB具有传输线高密度布局。

公开(公告)号：US08633401B2

公开(公告)日：2014-01-21

申请号：US13217626

申请日：2011-08-25

申请人： Hua-Li Zhou ,  Chia-Nan Pai ,  Shou-Kuo Hsu

发明人： Hua-Li Zhou ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H05K1/0242 ,  H05K1/025 ,  H05K2201/09736 ,  Y02P70/611

摘要： A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.

摘要翻译： 垫包括第一配合部分和第二配合部分。 第一配合部分包括第一水平面和第一倾斜平面。 第二配合部分包括第二水平面和第二倾斜平面。 第一配合部分是能够连接到电线的铜箔。 第二配合部分由绝缘材料制成。 第一倾斜平面和第二倾斜平面结合在一起。