公开(公告)号：US07121721B2

公开(公告)日：2006-10-17

申请号：US10481761

申请日：2002-06-18

申请人： Henning Hauenstein ,  Markus Baur

发明人： Henning Hauenstein ,  Markus Baur

IPC分类号： G01K7/00

CPC分类号： G01R31/275 ,  G01R31/2603 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and a method for measuring operating temperatures Tj of a component, particularly transient temperatures Tj in the breakdown region of the component 2 during a breakdown operation, are provided. The component temperature Tj at a point of time ti is ascertainable from a measurement of the breakdown voltage Ud and the breakdown current I of the component 2 at the specific point of time ti during the breakdown operation using a measuring device, by comparing the measurement data to reference measurement data recorded in advance.

摘要翻译： 提供了用于在击穿操作期间测量部件2的击穿区域中的部件的工作温度T SUB，特别是瞬态温度T SUB的装置和方法。 在时间点t 1上的元件温度T SUB可以通过测量击穿电压U D d和击穿电流I的击穿电流I来确定 通过将测量数据与预先记录的参考测量数据进行比较，使用测量装置在击穿操作期间的特定时间点t i i i处的部件2。

公开(公告)号：US20070273009A1

公开(公告)日：2007-11-29

申请号：US11751930

申请日：2007-05-22

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/495

CPC分类号： H01L23/3735 ,  H01L23/3121 ,  H01L23/3733 ,  H01L24/97 ,  H01L2224/73153 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2924/00

摘要： Two DBC wafers have patterned first conductive surfaces which receive a semiconductor die in sandwich fashion. Lead frame terminally extending into the package interior and are connected to the die terminals. The outer conductive surfaces of each of the wafers are available for two-sided cooling of the semiconductor.

摘要翻译： 两个DBC晶片具有以三明治方式接收半导体管芯的第一导电表面。 引线框架终端延伸到封装内部并连接到管芯端子。 每个晶片的外部导电表面可用于半导体的双面冷却。

公开(公告)号：US07573727B2

公开(公告)日：2009-08-11

申请号：US10514104

申请日：2003-01-10

申请人： Henning Hauenstein ,  Dirk Balszunat

发明人： Henning Hauenstein ,  Dirk Balszunat

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H01L23/488 ,  H01L23/49548 ,  H01L2924/0002 ,  H01L2924/00

摘要： A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal direction and having a contact region for mounting on a terminal region of the semiconductor component. In order to achieve a contacting system that can be manufactured inexpensively but can nevertheless carry high current densities, a connecting device is proposed whose contact region is embodied in structured fashion and flexibly with respect to stresses that extend in a terminal plane parallel to the terminal region.

摘要翻译： 一种用于将半导体部件接触至少一个其它部件的连接装置，所述连接装置包括沿纵向方向延伸的至少一个金属连接条，并具有用于安装在半导体部件的端子区域上的接触区域。 为了实现能够廉价制造但仍然能够承受高电流密度的接触系统，提出了一种连接装置，其接触区域以结构化的方式体现并且相对于平行于端子区域的端子平面中延伸的应力灵活地实现 。

公开(公告)号：US07567053B2

公开(公告)日：2009-07-28

申请号：US11650385

申请日：2007-01-05

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H02P27/04

CPC分类号： H02K11/33

摘要： The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

摘要翻译： 逆变器的电源开关与车辆的电动机械机械地集成，并且安装在电动机的端板上，并且在电动机a-c端子和逆变器a-c输出端子之间短连接。 Bond无线模块被采用。 逆变器的电子控制装置安装在远离变频器的主控板上，不受变频器产生的热和EMI的影响。

公开(公告)号：US20050225957A1

公开(公告)日：2005-10-13

申请号：US10514104

申请日：2003-01-10

申请人： Henning Hauenstein ,  Dirk Balszunat

发明人： Henning Hauenstein ,  Dirk Balszunat

IPC分类号： H01L23/488 ,  H01L23/495 ,  H05K1/11 ,  H05K1/14

CPC分类号： H01L23/488 ,  H01L23/49548 ,  H01L2924/0002 ,  H01L2924/00

摘要： A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal direction and having a contact region for mounting on a terminal region of the semiconductor component. In order to achieve a contacting system that can be manufactured inexpensively but can nevertheless carry high current densities, a connecting device is proposed whose contact region is embodied in structured fashion and flexibly with respect to stresses that extend in a terminal plane parallel to the terminal region.

摘要翻译： 一种用于将半导体部件接触至少一个其它部件的连接装置，所述连接装置包括沿纵向方向延伸的至少一个金属连接条，并具有用于安装在半导体部件的端子区域上的接触区域。 为了实现能够廉价制造但仍然能够承受高电流密度的接触系统，提出了一种连接装置，其接触区域以结构化的方式体现并且相对于平行于端子区域的端子平面中延伸的应力灵活地实现 。

公开(公告)号：US20080018290A1

公开(公告)日：2008-01-24

申请号：US11650385

申请日：2007-01-05

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H02P27/04

CPC分类号： H02K11/33

摘要： The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

摘要翻译： 逆变器的电源开关与车辆的电动机械机械地集成，并且安装在电动机的端板上，并且在电动机a-c端子和逆变器a-c输出端子之间短连接。 Bond无线模块被采用。 逆变器的电子控制装置安装在远离变频器的主控板上，不受变频器产生的热和EMI的影响。

公开(公告)号：US20070182008A1

公开(公告)日：2007-08-09

申请号：US11619742

申请日：2007-01-04

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/52

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/39 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32503 ,  H01L2224/73153 ,  H01L2224/83101 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/29099

摘要： A substrate on which a silicon device is mounted in accordance with an embodiment of the present invention includes a plurality of protrusions extending upward from a top surface of the substrate and a solder layer formed on the top of the substrate such that the plurality of protrusions extends through the solder layer and a top portion of each protrusion of the plurality of protrusions is stamped down to be level with a top surface of the solder layer such that the silicon device is supported on the plurality of protrusions when placed on the substrate. The protrusions are preferably gouged up from the surface of the substrate with a needle like tool. A stamper tool is used to stamp the protrusions down to their desired height such that they are properly positioned to support the silicon device. The solder layer may be a solder pre-form or may be a layer of solder paste. The solder layer is heated to form liquid solder to bond the substrate and the silicon device, however, the protrusions support the silicon device to prevent movement thereof when the solder is in liquid form.

摘要翻译： 根据本发明的实施例，其上安装有硅器件的衬底包括从衬底的顶表面向上延伸的多个突起和形成在衬底的顶部上的焊料层，使得多个突起延伸 通过焊料层和多个突起中的每个突起的顶部被压下以与焊料层的顶表面平齐，使得硅器件在放置在衬底上时被支撑在多个突起上。 优选地，用针状工具从该基板的表面向上突出突起。 压模工具用于将突起压印至其期望的高度，使得它们被适当地定位以支撑硅器件。 焊料层可以是焊料预形式，或者可以是一层焊膏。 焊料层被加热以形成液体焊料以结合衬底和硅器件，然而，当焊料为液体形式时，突起支撑硅器件以防止其移动。

公开(公告)号：US20070138651A1

公开(公告)日：2007-06-21

申请号：US11641270

申请日：2006-12-19

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/48

CPC分类号： H01L23/62 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/367 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L28/20 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32503 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73153 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83139 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction.

摘要翻译： 半导体器件封装由DBC形成，其中将薄的MOS和/或二极管管芯焊接到上导电层中的蚀刻凹陷的底部。 在DBC的绝缘层中的通孔填充有导电材料以形成电阻分路。 多个包装可以形成在DBC卡中，并且可以单独地或以群集形式分离。 单个包装以各种阵列安装在支撑DBC板和散热器上。 集成电路可以安装在组件上并连接到管芯，用于控制管芯导电。

公开(公告)号：US09102242B2

公开(公告)日：2015-08-11

申请号：US11888812

申请日：2007-08-02

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H02P1/24 ,  B60L15/20 ,  B60L11/18 ,  B60K1/00

CPC分类号： B60L15/20 ,  B60K2001/003 ,  B60L11/1872 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/705 ,  Y02T10/7275

摘要： The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

公开(公告)号：US20070241393A1

公开(公告)日：2007-10-18

申请号：US11786388

申请日：2007-04-11

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L29/76

CPC分类号： H01L25/072 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/73153 ,  H01L2224/732 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01L2224/83 ,  H01L2924/00

摘要： A power semiconductor package that includes at least two semiconductor devices electrically coupled to one another through a common metallic web.

摘要翻译： 一种功率半导体封装，其包括通过公共金属网而彼此电耦合的至少两个半导体器件。