摘要:
A multi-chip package includes a substrate having first and second substrate pads, ball pads electrically connected to the first and second substrate pads, a first chip attached on the substrate and having first chip pads flip-chip bonded to the first substrate pads, and a second chip attached on the first chip and having second chip pads wire-bonded to the second substrate pads. The second chip may have overhang portions. Solder balls may be formed on the ball pads and act as external connection terminals. A support member may be interposed between the first chip and the second chip to support the overhang portions of the second chip.
摘要:
A die bonding apparatus may include a bond head providing a heating function. The bond head may include a die collet for picking up a semiconductor chip when performing a die bonding process. The die collet may heat the semiconductor chip by using heat transmitted from the bond head when picking up the chip. The die collet may also provide a heating function for heating the chip.
摘要:
A method of manufacturing a multi-stack package that ensures easy application of a solder paste or a flux. The method includes forming a first package comprising a first substrate on which bumps are arranged and a second package comprising a second substrate on which electrode pads corresponding to the bumps are arranged, applying a solder paste on the bumps of the first package, and electrically connecting the bumps of the first package and the electrode pads of the second package.