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公开(公告)号：US4810048A
公开(公告)日：1989-03-07
申请号：US788258
申请日：1985-10-17
申请人： Hideki Asano , Shuji Eguchi , Seikichi Tanno , Yoshiaki Okabe , Noriaki Taketani , Masanori Nemoto , Tuneo Narusawa , Yoshimitsu Mihara , Yukihiko Takada
发明人： Hideki Asano , Shuji Eguchi , Seikichi Tanno , Yoshiaki Okabe , Noriaki Taketani , Masanori Nemoto , Tuneo Narusawa , Yoshimitsu Mihara , Yukihiko Takada
IPC分类号： H05K7/04 , G02B6/12 , G11B33/02 , G11B33/12 , H05K1/00 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/30
CPC分类号： G11B33/12 , G02B6/12004 , G11B33/02 , H05K1/0284 , H05K1/0274 , H05K1/0393 , H05K1/056 , H05K1/18 , H05K2201/09045 , H05K2201/09118 , H05K2203/1327 , H05K3/301
摘要： This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.
摘要翻译： 本发明包括具有安装有机械部件的基座的统一电路，并且涉及设置有衬底和埋置在衬底中和/或扩散在衬底表面上的电路的机械部件安装底盘。
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公开(公告)号：US4728557A
公开(公告)日：1988-03-01
申请号：US375584
申请日：1982-05-06
申请人： Hideki Asano , Morimichi Umino , Masanori Nemoto
发明人： Hideki Asano , Morimichi Umino , Masanori Nemoto
CPC分类号： B29C45/14344 , Y10T428/24331 , Y10T428/24347
摘要： A molded part including a metal plate formed with a plurality of through holes, a plurality of resin portions connected to a resin filled in the through holes and protruding on opposite sides of the metal plate, the resin portions having a planar cross section larger than a cross section of the through holes, and a plurality of resin components each integrally formed with one of the resin portions. The resin components are secured in place on the metal plate separate from and independent of each other by virtue of residual thermal stress produced by the difference in the coefficient of thermal expansion between the resin portions and the metal plate in such a manner that a radially oriented residual thermal stress in each resin portion is symmetrical with respect to a center axis of one of the resin components.
摘要翻译： 一种模制部件，包括形成有多个通孔的金属板，多个树脂部分连接到填充在通孔中并在金属板的相对侧上突出的树脂，树脂部分具有大于 通孔的横截面，以及与树脂部中的一个一体形成的多个树脂部件。 由于由树脂部分和金属板之间的热膨胀系数的差异产生的残余热应力，树脂部件被固定在金属板上的位置上并且彼此独立，使得径向定向 每个树脂部分中的残余热应力相对于一个树脂部件的中心轴对称。
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公开(公告)号：US4445159A
公开(公告)日：1984-04-24
申请号：US324670
申请日：1981-11-24
申请人： Masanori Nemoto , Hideki Asano
发明人： Masanori Nemoto , Hideki Asano
IPC分类号： G11B33/02 , B29C45/00 , G11B15/665 , G11B25/06 , G11B19/00 , B29F1/00 , G11B5/008 , G11B5/08
CPC分类号： G11B25/063 , B29C45/0025 , G11B15/6656
摘要： A chassis for video tape recorder molded integrally with a fiber-reinforced plastic composition is light in weight and can meet the requirements for attainment of high precision. It is possible to obtain a chassis with even higher precision and higher rigidity while preventing deformation with time as well as creep deformation, by properly selecting the components of the composition, the number and the position of the gates, and/or the reinforcing measures. In case of using glass fiber as the reinforcing fiber component of the composition, it is desirable to use the type in which 5% by weight or more of the whole glass fiber component is occupied by those glass fibers which have a length of over 1.0 mm and a diameter of 15 .mu.m or less.
摘要翻译： 用于与纤维增强塑料组合物整体成型的录像机的底盘重量轻，可以满足达到高精度的要求。 通过适当地选择组合物的组分，门的数量和位置以及/或加强措施，可以获得具有更高精度和更高刚度的底盘，同时防止随时间变形和蠕变变形。 在使用玻璃纤维作为组合物的增强纤维成分的情况下，优选使用长度超过1.0mm的玻璃纤维占据整个玻璃纤维成分的5重量％以上的类型 直径为15μm以下。
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4.发明授权Auxiliary float of floating structure and method for remodeling floating structure 有权浮动结构辅助浮标和重构浮动结构的方法公开(公告)号：US08025020B2
公开(公告)日：2011-09-27
申请号：US12308739
申请日：2007-07-05
IPC分类号： B63B35/44
摘要： To provide the auxiliary float of a floating structure which can prolong the lifetime of the floating structure by reducing external force acting on the brace and can be used even at very deep water by increasing buoyancy, and to provide a remodeling method of the floating structure.The auxiliary float (11) comprises two floats (12) coupled, respectively, to lower portions of two lower hulls (1) constituting a floating structure, two main coupling members (13) for coupling the floats (12) to each other, and four sub-coupling members (14) for coupling the main coupling member (13) and the float (12). The auxiliary float (11) is produced in advance and the floating structure is mounted on the auxiliary float (11), and then the lower hull (1) and the float (12) are connected, thus remodeling the floating structure.
摘要翻译： 为了提供浮动结构的辅助浮体，其可以通过减小作用在支架上的外力来延长浮动结构的寿命，并且甚至可以通过增加浮力而在非常深的水中使用，并且提供浮动结构的重塑方法。 辅助浮子（11）包括分别耦合到构成浮动结构的两个下部船体（1）的下部的两个浮子（12），用于将浮体（12）彼此连接的两个主联接构件（13），以及 用于联接主联接构件（13）和浮子（12）的四个子联接构件（14）。 辅助浮子（11）预先生产，浮动结构安装在辅助浮子（11）上，然后连接下船体（1）和浮子（12），从而重新构造浮动结构。
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5.发明申请Auxiliary float of floating structure and method for remodeling floating structure 有权浮动结构辅助浮标和重构浮动结构的方法公开(公告)号：US20090183666A1
公开(公告)日：2009-07-23
申请号：US12308739
申请日：2007-07-05
IPC分类号： B63B35/44
摘要： ProblemsTo provide the auxiliary float of a floating structure which can prolong the lifetime of the floating structure by reducing external force acting on the brace and can be used even at very deep water by increasing buoyancy, and to provide a remodeling method of the floating structure.Means for Solving ProblemsThe auxiliary float (11) comprises two floats (12) coupled, respectively, to lower portions of two lower hulls (1) constituting a floating structure, two main coupling members (13) for coupling the floats (12) to each other, and four sub-coupling members (14) for coupling the main coupling member (13) and the float (12). The auxiliary float (11) is produced in advance and the floating structure is mounted on the auxiliary float (11), and then the lower hull (1) and the float (12) are connected, thus remodeling the floating structure.
摘要翻译： 问题为了提供浮动结构的辅助浮体，其可以通过减小作用在支架上的外力来延长浮动结构的寿命，并且甚至可以通过增加浮力而在非常深的水中使用，并且提供浮动结构的重塑方法 。 用于解决问题的手段辅助浮子（11）包括分别联接到构成浮动结构的两个下部船体（1）的下部的两个浮子（12），用于将浮子（12）连接到 以及用于联接主联接构件（13）和浮子（12）的四个子联接构件（14）。 辅助浮子（11）预先生产，浮动结构安装在辅助浮子（11）上，然后连接下船体（1）和浮子（12），从而重新构造浮动结构。
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6.发明授权
公开(公告)号：US5849460A
公开(公告)日：1998-12-15
申请号：US895576
申请日：1997-07-16
IPC分类号： G03F7/038 , C08G59/00 , C08G59/16 , C08G59/18 , C08L9/02 , C08L63/00 , H05K1/00 , H05K3/00 , H05K3/36 , H05K3/46 , G03F7/028
CPC分类号： G03F7/0385 , H05K3/4676 , H05K2201/0133 , H05K3/0023
摘要： A photosensitive resin composition for use in manufacture of multi-layer circuit boards with connecting holes between layers is disclosed. The resin composition has excellent adhesion with a plating metal, resolution, photo-curing, thermosetting, thermal resistance, and is capable of being developed using an alkaline solution or an aqueous solution containing a non-halogen based organic solvent as the developing solution. The resin composition comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reactant of a carboxylic acid added to an acrylonitrile-butadiene rubber and an epoxy resin, a photo-polymerization initiator and a thermosetting agent. This reactant facilitates a high density pattern of connecting holes for circuit boards of the layered type.
摘要翻译： 公开了一种用于制造具有层之间的连接孔的多层电路板的感光性树脂组合物。 树脂组合物与电镀金属具有优异的粘附性，分辨率，光固化性，热固性，耐热性，并且可以使用碱性溶液或含有非卤素类有机溶剂的水溶液作为显影液进行显影。 树脂组合物包含光敏环氧树脂，热固性环氧树脂，加入到丙烯腈 - 丁二烯橡胶中的羧酸的反应物和环氧树脂，光聚合引发剂和热固性剂。 该反应物有助于分层型电路板的连接孔的高密度图案。
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公开(公告)号：US06306481B1
公开(公告)日：2001-10-23
申请号：US09337268
申请日：1999-06-22
申请人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
发明人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
IPC分类号： B32B310
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K3/4644 , H05K2201/0195 , H05K2201/0209 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220° C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要翻译： 具有分辨率在25-80μm的多层电路板和层之间的盲孔，盲孔通孔具有2.0-0.6范围内的纵横比，用于实现层之间的接近，其中绝缘 层之间具有盲孔的层具有150-220℃的玻璃化转变温度，并且使用环氧基感光性树脂组合物。 得到具有优选的分辨率和耐热性的感光性树脂组合物。 提供了一种多层电路板，其中在裸芯片安装工艺中的回流工艺，金线接合工艺和修补工艺的步骤中产生的热应力减小，并且导体布线的剥离和多层的变形 在加热过程中由机械应力引起的电路板被抑制。 因此，电子设备的尺寸和重量的减小是可能的。
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8.发明授权
公开(公告)号：US5914216A
公开(公告)日：1999-06-22
申请号：US896456
申请日：1997-07-18
申请人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
发明人： Satoru Amou , Masao Suzuki , Tokihito Suwa , Mineo Kawamoto , Akio Takahashi , Masanori Nemoto , Hiroyuki Fukai , Mitsuo Yokota , Shiro Kobayashi , Masashi Miyazaki
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K2201/0195 , H05K2201/0209 , H05K3/4644 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
摘要翻译： 具有25-80μm范围内分辨率的多层电路板和具有2.0-0.6范围内的纵横比的盲孔，以实现层之间的接近，其中所述层之间的绝缘层具有盲 通孔的玻璃化转变温度为150〜220℃，使用环氧基感光性树脂组合物。 得到具有优选的分辨率和耐热性的感光性树脂组合物。 提供一种多层电路板，其中在裸芯片安装工艺中在回流处理，金线接合工艺和修补工艺的步骤中产生的热应力减少，并且导体布线的剥离和多层的变形 在加热过程中由机械应力引起的电路板被抑制。 因此，电子设备的尺寸和重量的减小是可能的。
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公开(公告)号：US4352897A
公开(公告)日：1982-10-05
申请号：US103506
申请日：1979-12-14
申请人： Masatsugu Ogata , Hirokazu Takasaki , Masanori Nemoto , Toshikazu Narahara , Kenichi Hironaka , Tetuo Ishikawa
发明人： Masatsugu Ogata , Hirokazu Takasaki , Masanori Nemoto , Toshikazu Narahara , Kenichi Hironaka , Tetuo Ishikawa
摘要： A resin molded stator comprising a stator core and coils as major constituents at least parts of which are molded into one piece by a molding material, said molding material comprising (a) a low-shrink unsaturated polyester resin, (b) a filler having a particle size of 44 .mu. or less, and (c) a fibrous material having a length of 3 mm or less, in proportions of 15 to 40% by weight of the component (a) and 60 to 85% by weight of a total of the components (b) and (c), and a weight ratio of the component (b) to the component (c) being 3/1 to 30/1, is excellent in crack resistance, moisture resistance and insulating properties.
摘要翻译： 一种树脂模制定子，其包括定子芯和线圈作为主要成分，其至少一部分通过模制材料模制成一体，所述模制材料包括（a）低收缩不饱和聚酯树脂，（b）填料，其具有 粒径为44μm以下，（c）长度为3mm以下的纤维材料，以（a）成分的15〜40重量％的比例和60〜85重量％ 组分（b）和（c）以及组分（b）与组分（c）的重量比为3/1至30/1，具有优异的抗裂性，耐湿性和绝缘性。
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