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    ADHESIVE FILM, MULTILAYER PRINTED WIRING BOARD USING ADHESIVE FILM, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    6.
    发明申请
    ADHESIVE FILM, MULTILAYER PRINTED WIRING BOARD USING ADHESIVE FILM, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 审中-公开
    胶粘膜，使用粘合膜的多层印刷布线板以及制造多层印刷线路板的方法

    公开(公告)号：US20140199533A1

    公开(公告)日：2014-07-17

    申请号：US14128935

    申请日：2012-07-06

    申请人： Masaharu Matsuura ,  Nobuyuki Ogawa ,  Hiroaki Fujita ,  Hiroyuki Fukai

    发明人： Masaharu Matsuura ,  Nobuyuki Ogawa ,  Hiroaki Fujita ,  Hiroyuki Fukai

    IPC分类号： H05K1/03 ,  C09J7/02 ,  C09J11/04 ,  H05K3/00

    CPC分类号： H05K1/0306 ,  C08G59/5086 ,  C09J7/20 ,  C09J11/04 ,  C09J163/00 ,  H05K3/0064 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/2848

    摘要： An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.

    摘要翻译： 根据本发明的粘合膜包括层间绝缘层的树脂组合物层（层A），热固性树脂组合物层（B层）和支撑膜（层C），层C，层A ，并且层B按顺序排列。 层A是含有比表面积为20m 2 / g以上的热固性树脂（a1）和无机填料（b1），热固性树脂（a1）与无机填料的质量比 （b1）在30:1〜2:1的范围内。 层B含有在低于40℃的温度下处于固态的热固性树脂组合物，但在40℃以上但低于140℃的温度下熔融。因此，根据 本发明可以解决激光工艺之后的问题以及激光工艺之后的去除污泥工艺，并且即使在具有光滑表面粗糙化状态的层间绝缘层上也可以形成具有高粘合强度的导体层。

    COOLING DEVICE WITH A PLURALITY OF FIN PITCHES
    7.
    发明申请
    COOLING DEVICE WITH A PLURALITY OF FIN PITCHES 审中-公开
    冷却装置与大量的煎饼

    公开(公告)号：US20130112373A1

    公开(公告)日：2013-05-09

    申请号：US13698639

    申请日：2011-05-18

    申请人： Hiroyuki Fukai ,  Nobuyuki Hashimoto ,  Hiroshi Yamada ,  Masami Ikeda ,  Mamoru Shimada

    发明人： Hiroyuki Fukai ,  Nobuyuki Hashimoto ,  Hiroshi Yamada ,  Masami Ikeda ,  Mamoru Shimada

    IPC分类号： F28D1/00

    CPC分类号： F28D1/00 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  F28F3/022 ,  F28F2215/04 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/2039 ,  H01L2924/00

    摘要： It is an object to provide a cooling device with an increased leeward cooling capacity without increasing the number of heat radiation fins to be installed and the amount of cooling air.The cooling device comprises a heat-receiving block thermally connected to a heat-generating element and heat radiation fin groups having a plurality of fins thermally connected to the heat-receiving block. A flow of cooling air is set in the direction parallel to the heat-receiving block. The plurality of heat radiation fin groups are arranged in tandem along the flow direction of the cooling air. Of the plurality of the heat radiation fin groups, the fin pitch of the heat radiation fin group arranged on the windward side of the cooling air is larger than the fin pitch of the heat radiation fin group arranged on the leeward side of the cooling air.

    摘要翻译： 本发明的目的是提供具有增加的背风冷却能力的冷却装置，而不增加要安装的散热片的数量和冷却空气的量。 冷却装置包括热连接到发热元件的热​​接收块和具有热连接到热接收块的多个翅片的散热翅片组。 在与受热块平行的方向上设置冷却空气流。 多个散热翅片组沿着冷却空气的流动方向排成一列。 在多个散热片组中，布置在冷却空气的迎风侧的散热片组的翅片间距大于布置在冷却空气的背风侧的散热翅片组的翅片间距。