摘要:
A memory circuit according to an embodiment includes: a first transistor including a first source/drain electrode, a second source/drain electrode, and a first gate electrode; a second transistor including a third source/drain electrode connected to the second source/drain electrode, a fourth source/drain electrode, and a second gate electrode; a third transistor and a fourth transistor forming an inverter circuit, the third transistor including a fifth source/drain electrode, a sixth source/drain electrode, and a third gate electrode connected to the second source/drain electrode, the fourth transistor including a seventh source/drain electrode connected to the sixth source/drain electrode, an eighth source/drain electrode, and a fourth gate electrode connected to the second source/drain electrode; and an output terminal connected to the sixth source/drain electrode. At least one of the third transistor and the fourth transistor is a spin MOSFET, and an output of the inverter circuit is sent from the output terminal.
摘要:
A random number generator circuit includes: an element generating and outputting physical random numbers; a digitizing circuit digitizing the physical random numbers to output a random number sequence tested by a testing circuit; and an error correcting code circuit including a shift register having the random number sequence input thereto, a multiplier multiplying the stored random number sequence by an error-correcting-code generating matrix, and a selector switch outputting one of an output of the shift register and an output of the multiplier in accordance with a test result obtained by the testing circuit. The error correcting code circuit outputs the output of the multiplier as a corrected random number sequence from the selector switch when the result of a test conducted by the testing circuit indicates a rejection. The testing circuit tests the corrected random number sequence when the result of the test indicates a rejection.
摘要:
An aspect of the present embodiment, there is provided a nonvolatile programmable logic switch including a first memory cell transistor, a second memory cell transistor, a pass transistor and a first substrate electrode applying a substrate voltage to the pass transistor, wherein a writing voltage is applied to the first wiring, a first voltage is applied to one of a second wiring and a third wiring and a second voltage which is lower than the first voltage is applied to the other of the second wiring and the third wiring, and the first substrate voltage which is higher than the second voltage and lower than the first voltage is applied to a well of the pass transistor, when data is written into the first memory cell transistor or the second memory cell transistor.
摘要:
The objective is to provide a random number generating device having a smaller circuit size and a smaller value of output bias. The random number generating device includes a pair of first and second current paths arranged in parallel with each other, and a pair of first and second fine particles, which can mutually exchange charges, and are located in the vicinity of the first and second current paths.
摘要:
In a three-dimensional integrated circuit apparatus 80 in which a first wafer 101 and a second wafer 102 having respective integrated circuits according to an embodiment are directly bonded, the second wafer 102 is provided with a through hole 10 aligned with a via 5a of the first wafer 101 by use of an alignment marker of the first wafer 101, and connected to the via 5a. The surrounding of the through hole 10 is provided with an insulating film 8.
摘要:
According to one embodiment, a switch device includes a first switching unit provided on a base substance. The first switching unit includes a first supporting electrode, a first beam, a first contact point electrode, a first floating conductive layer and a first control electrode. The first supporting electrode is fixed to the base. The first beam includes a first holding part and a first movable part. The first holding part is fixed to the base. The first movable part has one end connected to the first holding part. The first contact point electrode is fixed to the base and faces the first movable part. The first floating conductive layer is fixed to the first movable part via a first insulating part and stores a charge. The first control electrode is fixed to the base and faces the first floating conductive layer.
摘要:
According to one embodiment, a semiconductor integrated circuit includes first and second inverters, a first transistor which has a gate connected to a word line, a source connected to a first bit line, and a drain connected to an input terminal of the second inverter, a second transistor which has a gate connected to the word line, a source connected to a second bit line, and a drain connected to an input terminal of the first inverter, a first variable resistive element which has a first terminal connected to the drain of the first transistor, and a second terminal connected to an output terminal of the first inverter, and a second variable resistive element which has a first terminal connected to the drain of the second transistor, and a second terminal connected to an output terminal of the second inverter.
摘要:
According to one embodiment, a cache system includes a tag memory includes a volatile memory device, the tag memory includes ways and storing a tag for each line, a data memory includes a nonvolatile memory device including sense amplifiers for reading data, the data memory includes ways and storing data for each line, a comparison circuit configured to compare a tag included in an address supplied from an external with a tag read from the tag memory, and a controller configured to turn off a power of a sense amplifier for a way which is not accessed based on a comparison result of the comparison circuit.
摘要:
In one embodiment, there is provided a semiconductor integrated circuit that includes: a first inverter; a second inverter; a first transistor, wherein one end of the first transistor is connected to a first bit line and the other end of the first transistor is connected to a first input terminal of the first inverter; a first element group including second transistors, wherein one end of the first element group is connected to a first output terminal of the first inverter and the other end of the first element group is connected to a second bit line; and a second element group including third transistors and a magnetoresistive element whose magnetic resistance is varied. The second element group is disposed between the second output terminal of the second inverter and a first terminal or disposed between the first transistor and the first terminal.
摘要:
A manufacturing method of a semiconductor device includes preparing a first semiconductor substrate having a first integrated circuit formed therein and including a plurality of first through substrate vias, and a second semiconductor substrate having a second integrated circuit formed therein and including a plurality of second through substrate vias, forming a solid-electrolytic layer on an upper surface of the first semiconductor substrate, mounting the second semiconductor substrate on the solid-electrolytic layer such that a lower surface of the second semiconductor substrate comes into contact with the solid-electrolytic layer, and applying a voltage between the plurality of first through substrate vias and the plurality of second through substrate vias, to form in the solid-electrolytic layer a plurality of connection electrodes, which are respectively connecting the plurality of second through substrate vias adjacent to the plurality of first through substrate vias to the plurality of first through substrate vias.