公开(公告)号：US10025432B2

公开(公告)日：2018-07-17

申请号：US14128442

申请日：2012-06-20

申请人： Hiroaki Kishioka ,  Mayumi Kishioka ,  Tomohide Banba ,  Mitsuru Honjo ,  Naoki Nagaoka ,  Kazumasa Igarashi ,  Yuki Hasegawa ,  Hiroshi Wada ,  Yuki Tsubaki ,  Tomotake Nashiki

发明人： Hiroaki Kishioka ,  Tomohide Banba ,  Mitsuru Honjo ,  Naoki Nagaoka ,  Kazumasa Igarashi ,  Yuki Hasegawa ,  Hiroshi Wada ,  Yuki Tsubaki ,  Tomotake Nashiki

IPC分类号： G06F3/044 ,  C09J133/08 ,  G02F1/1333 ,  H03K17/96 ,  B32B7/12 ,  B23B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  C09J7/24 ,  H01L27/32

摘要： Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.

公开(公告)号：US08837873B2

公开(公告)日：2014-09-16

申请号：US13413853

申请日：2012-03-07

申请人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

发明人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/26

CPC分类号： G02B6/4202 ,  G02B6/4231 ,  Y10T29/4914

摘要： Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

摘要翻译： 提供了一种光电混合基板及其制造方法。 光波导单元包括突出部分，其突出部分设置在下包层和外包层中的至少一个的部分处，并且突出部分相对于芯的透光表面定位并形成在预定位置。 电路单元包括具有嵌合孔的弯曲部分，突出部分配合并具有光学元件。 装配孔相对于光学元件定位并形成在预定位置。 光波导单元和电路单元在突出部分配合到装配孔中以形成光电混合板的状态下彼此耦合。

公开(公告)号：US08350159B2

公开(公告)日：2013-01-08

申请号：US12731173

申请日：2010-03-25

申请人： Tetsuya Oosawa ,  Naoyuki Tanaka ,  Mitsuru Honjo

发明人： Tetsuya Oosawa ,  Naoyuki Tanaka ,  Mitsuru Honjo

IPC分类号： H05K1/00 ,  H05K1/09 ,  H05K1/03 ,  H05K7/00 ,  G11B21/16 ,  G11B5/48

CPC分类号： H05K3/10 ,  G11B5/484 ,  G11B5/486 ,  H05K1/025 ,  H05K1/028 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/055 ,  Y10T156/1002 ,  Y10T156/1034

摘要： A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

摘要翻译： 在绝缘层上形成基极绝缘层，在基底绝缘层上形成写入布线迹线和读取布线迹线。 写入布线迹线和读取布线迹线形成在基底绝缘层的主体区域上，并且写入布线迹线形成在基底绝缘层的辅助区域上。 基底绝缘层沿弯曲部弯曲。 这将使写入布线轨迹位于写入布线轨迹的上方。

公开(公告)号：US08227699B2

公开(公告)日：2012-07-24

申请号：US12019661

申请日：2008-01-25

申请人： Mitsuru Honjo

发明人： Mitsuru Honjo

IPC分类号： H05K1/03

CPC分类号： H05K1/0218 ,  H05K1/0216 ,  H05K1/162 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09727

摘要： A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

摘要翻译： 印刷电路板包括基底绝缘层，第一至第三信号线，第一覆盖绝缘层和导电层。 在第一至第三信号线中形成宽部分。 第一覆盖绝缘层设置在基底绝缘层上以覆盖宽部分。 导电层设置在第一覆盖绝缘层上，以覆盖宽部分上方的部分。

公开(公告)号：US08017874B2

公开(公告)日：2011-09-13

申请号：US12388953

申请日：2009-02-19

申请人： Mitsuru Honjo ,  Katsutoshi Kamei

发明人： Mitsuru Honjo ,  Katsutoshi Kamei

IPC分类号： H05K1/00

CPC分类号： H05K1/0248 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/0969

摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.

摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成写入布线迹线上方的写入布线。 在第二绝缘层上一定距离地在写入布线迹线的一侧上形成接地迹线。 在第二绝缘层上形成第三绝缘层，以覆盖布线迹线和接地迹线。 在悬挂体的写入配线轨迹的下方的区域形成有开口部。

公开(公告)号：US20050115066A1

公开(公告)日：2005-06-02

申请号：US10992009

申请日：2004-11-19

申请人： Mitsuru Honjo ,  Toshiki Naito

发明人： Mitsuru Honjo ,  Toshiki Naito

IPC分类号： H05K3/24 ,  H05K3/06 ,  H05K3/10 ,  H05K3/02

CPC分类号： H05K3/108 ,  H05K3/062 ,  H05K2201/0347 ,  H05K2203/0542 ,  H05K2203/0597 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A production method of a wired circuit board that can prevent corrosion of a first thin metal film inwardly of a conductor layer, which is due to the forming of an undercut portion caused by a skirt portion of a plating resist, to prevent the peeling of a wiring circuit pattern. An insulating base layer 1 is prepared, first, and, then, a first thin metal film 2 is formed on the insulating base layer 1. Then, a plating resist 3 is formed in a reversal pattern to a wiring circuit pattern 4 on the first thin metal film 2, and a conductor layer 6 is formed in the wiring circuit pattern 4 on the first thin metal film 2 exposed form the plating resist 3. Thereafter, the plating resist 3 is removed and, then, a second thin metal film 8 is formed on the conductor layer 6 and first thin metal film 2. Thereafter, the second thin metal film 8 is removed. Then, all portions of the first thin metal layer 2, except portions thereof where the conductor layer 6 is formed, are removed. The flexible wired circuit board is produced by the processes described above.

摘要翻译： 一种布线电路板的制造方法，其能够防止由电镀抗蚀剂的裙部形成的底切部形成导体层内部的第一薄金属膜的腐蚀，防止剥离 布线电路图案。 首先制备绝缘基底层1，然后在绝缘基底层1上形成第一薄金属膜2。 然后，以与第一薄金属膜2上的布线电路图案4相反的方式形成电镀抗蚀剂3，并且在布线电路图案4中形成导体层6，第一薄金属膜2暴露于镀层 抗拒3。 此后，除去电镀抗蚀剂3，然后在导体层6和第一薄金属膜2上形成第二薄金属膜8。 此后，去除第二薄金属膜8。 然后，除去第一薄金属层2的除了形成导体层6的部分之外的所有部分。 柔性布线电路板通过上述工艺制造。

公开(公告)号：US08644655B2

公开(公告)日：2014-02-04

申请号：US13407009

申请日：2012-02-28

申请人： Yuichi Tsujita ,  Masayuki Hodono ,  Akiko Nagafuji ,  Masami Inoue ,  Ryusuke Naito ,  Mitsuru Honjo

发明人： Yuichi Tsujita ,  Masayuki Hodono ,  Akiko Nagafuji ,  Masami Inoue ,  Ryusuke Naito ,  Mitsuru Honjo

IPC分类号： G02B6/12

CPC分类号： H05K1/181 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4257 ,  H05K1/0284 ,  H05K2201/09063 ,  H05K2201/10121 ,  Y02P70/611 ,  Y10T29/49124

摘要： Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

摘要翻译： 提供了一种光电混合板，其不需要光波导单元的芯和电路单元的光学元件的对准操作，并且其批量生产率优异，并且其制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元，电路单元耦合到光波导单元。 光波导单元包括突出部分，其突出设置在下包层和外包层中的至少一个的部分处，并且相对于芯的透光表面定位并形成在预定位置。 电路单元包括嵌合孔，突出部分配合在该孔中，并且相对于光学元件定位并形成在预定位置。

公开(公告)号：US08138427B2

公开(公告)日：2012-03-20

申请号：US12611985

申请日：2009-11-04

申请人： Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

发明人： Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

IPC分类号： H05K1/11

CPC分类号： H05K3/4685 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

摘要： A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

摘要翻译： 印刷电路板和制造印刷电路板的方法，包括第一和第二写入布线图案，第一线的端部和第一写入布线图案的第二条线的末端布置在第三线的两侧 的第二写入布线图案。 圆形连接部设置在第一线和第二线的端部。 分别在连接部分上方的盖绝缘层的部分形成通孔。 例如，由铜制成的第一连接层形成为填充覆盖绝缘层的通孔。 例如，由铜构成的大致矩形的第二连接层形成为一体地覆盖连接层的上端。 这使得第一和第二线通过第一和第二连接层彼此电连接。

公开(公告)号：US08080740B2

公开(公告)日：2011-12-20

申请号：US12358671

申请日：2009-01-23

申请人： Mitsuru Honjo ,  Toshiki Naitou ,  Katsutoshi Kamei

发明人： Mitsuru Honjo ,  Toshiki Naitou ,  Katsutoshi Kamei

IPC分类号： H05K1/11

CPC分类号： H05K1/0218 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0237 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/0723 ,  H05K2201/09236

摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成接地层，以便位于布线迹线上方。 此外，在第二绝缘层上形成第三绝缘层以覆盖接地层。 在第三绝缘层上形成读取布线。 在第三绝缘层上形成第四绝缘层以覆盖布线迹线。

公开(公告)号：US20090106975A1

公开(公告)日：2009-04-30

申请号：US12345134

申请日：2008-12-29

申请人： Tadao Ookawa ,  Mitsuru Honjo ,  Takashi Oda

发明人： Tadao Ookawa ,  Mitsuru Honjo ,  Takashi Oda

IPC分类号： H05K3/10

CPC分类号： H05K3/22 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/108 ,  H05K3/281 ,  H05K3/381 ,  H05K3/386 ,  H05K3/388 ,  H05K2203/025 ,  H05K2203/095 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53504

摘要： A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

摘要翻译： 制备包括基底绝缘层和薄金属膜层（籽晶层）的多层结构。 在金属薄膜层的上表面上形成具有规定图案的电镀抗蚀剂层。 在通过电镀暴露的薄金属膜层上形成金属镀层。 然后，除去电镀抗蚀剂层，去除具有电镀抗蚀剂层的区域中的金属薄膜层。 以这种方式形成包括金属薄膜层和金属镀层的导电图案。 在没有导电图案的区域中的基底绝缘层的上表面进行粗糙化处理。 覆盖绝缘层形成在基底绝缘层和导电图案的上表面上。 这样，印刷电路板就完成了。