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公开(公告)号:US07306791B2
公开(公告)日:2007-12-11
申请号:US10317011
申请日:2002-12-11
CPC分类号: A61K38/1833 , Y10S514/97
摘要: The present invention provides methods of preventing and/or treating multiple organ failure comprising the step of administering a therapeutically effective amount of agent comprising tumor cytotoxic factor-II (TCF-II) or hepatocyte growth factor (HGF). Methods of the present invention will be useful for preventing and/or treating the development of multiple organ failure resulting from burn, disseminated intravascular coagulation (DIC), circulatory failure, hemorrhagic shock, infectious disease, acute pancreatitis, ischemic disorder, hepatorenal syndrome, gastrointestinal hemorrhage, nutritional metabolic failure, terminal cancer, acquired immunodeficiency syndrome (AIDS), deterioration of systemic conditions due to radiation affection, and cachexia.
摘要翻译: 本发明提供了预防和/或治疗多器官衰竭的方法,包括施用治疗有效量的包含肿瘤细胞因子-II(TCF-II)或肝细胞生长因子(HGF)的药剂的步骤。 本发明的方法可用于预防和/或治疗由烧伤,弥漫性血管内凝血(DIC),循环衰竭,出血性休克,感染性疾病,急性胰腺炎,缺血性障碍,肝肾综合征,胃肠道引起的多器官功能衰竭的发展 出血,营养代谢失败,终末期癌症,获得性免疫缺陷综合征(AIDS),由辐射影响导致的系统性病症恶化和恶病质。
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公开(公告)号:US06306827B1
公开(公告)日:2001-10-23
申请号:US09194326
申请日:1998-11-24
申请人: Masahiko Kinosaki , Hiromi Ogawa , Hiroaki Masunaga , Fumie Kobayashi , Kyoji Yamaguchi , Kanji Higashio
发明人: Masahiko Kinosaki , Hiromi Ogawa , Hiroaki Masunaga , Fumie Kobayashi , Kyoji Yamaguchi , Kanji Higashio
IPC分类号: A61K3816
CPC分类号: C07K14/4753 , A61K38/00 , C07K14/52
摘要: A preventative and/or therapeutic agent to treat and/or prevent organ failure due to mercury exposure, contains as the active ingredient a mutant tumor cytotoxic factor protein (TCF-II). The therapeutic agent comprises a mutant TCF-II protein according to SEQ ID NO. 2 in which amino acid residues Arg-Lys-Arg-Arg have been replaced by Ala-Ala-Ala-Ala, or in which amino acids Lys-Ile-Lys-Thr-Lys-Lys have been replaced by Ala-Ile-Ala-Thr-Ala-Ala (SEQ ID NO. 3).
摘要翻译: 用于治疗和/或预防由于汞暴露引起的器官衰竭的预防和/或治疗剂含有突变型肿瘤细胞毒性因子(TCF-II)作为活性成分。 治疗剂包含根据SEQ ID NO:1的突变型TCF-II蛋白。 2,其中氨基酸残基Arg-Lys-Arg-Arg已被Ala-Ala-Ala-Ala替代,或其中氨基酸Lys-Ile-Lys-Thr-Lys-Lys已被Ala-Ile-Ala -Thr-Ala-Ala(SEQ ID NO.3)。
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公开(公告)号:US4761325A
公开(公告)日:1988-08-02
申请号:US762310
申请日:1985-08-02
申请人: Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
发明人: Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
IPC分类号: C03C10/00 , C04B35/14 , C04B35/16 , C04B35/18 , C04B35/632 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/46 , B32B3/00
CPC分类号: H05K3/4667 , C03C10/0009 , H01L21/4857 , H01L21/4867 , H01L23/15 , H05K1/0306 , H05K3/46 , H05K3/4629 , C03C2214/04 , C03C2214/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , H05K2203/086 , H05K2203/088 , H05K2203/1126 , H05K3/1291 , H05K3/4611 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.
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公开(公告)号:US5015314A
公开(公告)日:1991-05-14
申请号:US469739
申请日:1990-01-19
申请人: Hitoshi Suzuki , Hiromitsu Yokoyama , Mineharu Tsukada , Hiromi Ogawa , Nobuo Kamehara , Koichi Niwa
发明人: Hitoshi Suzuki , Hiromitsu Yokoyama , Mineharu Tsukada , Hiromi Ogawa , Nobuo Kamehara , Koichi Niwa
摘要: A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition.The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.
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公开(公告)号:US4642148A
公开(公告)日:1987-02-10
申请号:US738658
申请日:1985-05-28
申请人: Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
发明人: Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
IPC分类号: C03C10/00 , C04B35/14 , C04B35/16 , C04B35/18 , C04B35/632 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/46 , B32B31/06
CPC分类号: H05K3/4667 , C03C10/0009 , H01L21/4857 , H01L21/4867 , H01L23/15 , H05K1/0306 , H05K3/46 , H05K3/4629 , C03C2214/04 , C03C2214/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , H05K2203/086 , H05K2203/088 , H05K2203/1126 , H05K3/1291 , H05K3/4611 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.
摘要翻译: 一种制造多层陶瓷电路板的方法,包括以下步骤:形成由铜基糊料和玻璃 - 陶瓷层的图案组成的多层结构,所述玻璃陶瓷层由10%至75%重量的α - 氧化铝,20%至60%重量的可结晶或不可结晶的玻璃,其可以在低于铜的熔点的温度下烧结,以及5%至70%重量的石英玻璃,基于玻璃的总重量 - 陶瓷,与含有可热解聚树脂的粘合剂共混; 在除去热可解聚树脂的温度下,在分压为0.005〜0.3个大气压的含有水蒸气的惰性气氛中预热多层结构体; 在低于铜熔点的温度下,在不含水蒸气的惰性气氛中烧成多层结构,烧结玻璃陶瓷。
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公开(公告)号:US5506721A
公开(公告)日:1996-04-09
申请号:US170346
申请日:1993-12-23
CPC分类号: G02F1/0134 , G02F1/11
摘要: In an external modulator for optical communication, a piezoelectric element section is formed by laminating a lower electrode, a piezoelectric thin film and an upper electrode in this order on one surface of a substantially flat substrate which has substantially the same acoustic impedance as the clad layer of a single mode optical fiber to be disposed on the substrate. At least one single mode optical fiber is disposed on the other surface of the substrate on the upper electrode, and the single mode optical fiber is at least partly coated with a material having an acoustic impedance substantially equal to that of the clad layer in a place in which the single mode optical fiber is disposed.
摘要翻译: PCT No.PCT / JP93 / 00148 Sec。 371日期:1993年12月23日 102(e)日期1993年12月23日PCT提交1993年2月5日PCT公布。 公开号WO93 / 22706 日期:11月11日,在光通信用外部调制器中,通过在基本上平坦的基板的一个表面上依次层叠下电极,压电薄膜和上电极来形成压电元件部, 与要设置在基板上的单模光纤的包层相同的声阻抗。 至少一个单模光纤设置在上电极上的基板的另一个表面上,并且单模光纤至少部分地涂覆有在一个地方具有基本上等于覆层的声阻抗的材料 其中设置单模光纤。
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公开(公告)号:US5461209A
公开(公告)日:1995-10-24
申请号:US187940
申请日:1994-01-27
申请人: Mitsuyasu Yamada , Yuji Kojyo , Masaharu Imahara , Hiroshi Endo , Yasuko Natsume , Hiromi Ogawa , Yoshiteru Kondo , Hideharu Nakagami , Hitoshi Kawaguchi
发明人: Mitsuyasu Yamada , Yuji Kojyo , Masaharu Imahara , Hiroshi Endo , Yasuko Natsume , Hiromi Ogawa , Yoshiteru Kondo , Hideharu Nakagami , Hitoshi Kawaguchi
CPC分类号: F16B33/02 , B23K35/0288
摘要: A stud which is automatically fed so as to welded stably and properly, has a large electric contact surface with the collet, facilitates clip attachment, and maintains the engagement firmly after the attachment of the clip. A stud 1 extends upwardly into a rod-like form which is threaded on its periphery, and includes a welding tip at the lower end thereof for welding to a base member such as a panel so as to be used in mounting a member to be attached on the base member. The stud 1 is formed to be short in overall length and its welding tip is formed as a flange 4 whose diameter is larger than that of the rod-like body. A crest 6 of the screw 3 is formed flat. An upper flank angle 8 of the screw is formed large while a lower flank angle 10 of it is formed small. An edge 12 of an upper end 11 of the stud is chamfered.
摘要翻译: 自动进给以稳定焊接的螺柱与夹头具有大的电接触表面,便于夹子附接,并且在夹子的附接之后牢固地保持接合。 螺柱1向上延伸成在其周边上螺纹的杆状形式,并且在其下端包括用于焊接到诸如面板的基座构件的焊接尖端,以便用于安装待附接的构件 在基座上。 螺柱1形成为总长度短,其焊头形成为直径大于杆状体的直径的凸缘4。 螺钉3的顶部6形成为平坦的。 螺杆的上侧面角8形成较大,同时其下侧翼角10形成得较小。 螺柱的上端11的边缘12被倒角。
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公开(公告)号:US4739683A
公开(公告)日:1988-04-26
申请号:US001429
申请日:1987-01-08
申请人: Hiromi Ogawa
发明人: Hiromi Ogawa
CPC分类号: B23D15/06 , B23D15/005 , Y10T83/4751 , Y10T83/4763 , Y10T83/8742 , Y10T83/8773
摘要: A turning arm has an inverted U-shape and is supported for rotational movement by two pairs of horizontally disposed crank shafts. A lower cutter holder supporting base is mounted for movement only in the direction feeding of material to be cut. A turning table is rotatably mounted on an upper surface of the base for rotation about a substantially vertical axis, and an upper cutter holder having an upper cutter is rotatably mounted on the turning arm above the lower cutter holder for rotation about the substantially vertical axis. The upper cutter and lower cutter are constrained to move together in the horizontal feed direction, while the upper cutter is permitted to reciprocate vertically relative to the lower cutter.
摘要翻译: 旋转臂具有倒U形并且被两对水平布置的曲柄轴支撑为旋转运动。 安装下刀架保持器支撑底座仅仅沿着要切割的材料的方向进给运动。 旋转台可旋转地安装在基座的上表面上,用于围绕基本垂直的轴线旋转,并且具有上切割器的上刀具保持器可旋转地安装在下切刀架上方的转臂上,以围绕基本上垂直的轴线旋转。 上切割器和下切割器被限制为在水平进给方向上一起移动,同时允许上切割器相对于下切割器垂直地往复运动。
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公开(公告)号:US4679320A
公开(公告)日:1987-07-14
申请号:US801783
申请日:1985-11-26
申请人: Yoshihiko Imanaka , Hiromi Ogawa , Mineharu Tsukada , Etsuro Udagawa , Kazuaki Kurihara , Hiromitsu Yokoyama , Nobuo Kamehara
发明人: Yoshihiko Imanaka , Hiromi Ogawa , Mineharu Tsukada , Etsuro Udagawa , Kazuaki Kurihara , Hiromitsu Yokoyama , Nobuo Kamehara
IPC分类号: C04B35/622 , C04B35/632 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/46 , H01K3/22
CPC分类号: H01L21/4867 , H05K1/0306 , H05K1/092 , Y10T29/49144 , Y10T29/49158
摘要: A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.
摘要翻译: 一种用于制造具有铜的多层陶瓷电路板的方法,包括以下步骤:通过将包含100重量份的玻璃陶瓷颗粒,5至20重量份的热解聚树脂粘合剂,2至10重量份的浆料 重量份的增塑剂和至多2重量份的脂肪酸环氧乙烷加合物类型的脱氯剂。 玻璃陶瓷包含20至70重量%的氧化铝和30至80重量%的SiO 2 -B 2 O 3玻璃。 该方法还包括以下步骤:在生片上形成通孔,在生片上丝网印刷铜膏,并层压生片,由此形成多层结构,并在不可氧化的气氛中烧结多层结构。
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公开(公告)号:US4346516A
公开(公告)日:1982-08-31
申请号:US252214
申请日:1981-04-08
申请人: Kishio Yokouchi , Hiromi Ogawa , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa , Kyohei Murakawa
发明人: Kishio Yokouchi , Hiromi Ogawa , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa , Kyohei Murakawa
IPC分类号: H05K3/46 , H01L21/48 , H01L23/15 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/00 , H05K3/36
CPC分类号: H05K3/4046 , H01L21/486 , H01L21/4867 , H01L23/15 , H01L23/5384 , H01L2224/11003 , H01L2224/11005 , H01L2224/1132 , H01L2224/11334 , H05K1/0306 , H05K1/092 , H05K2201/0382 , H05K2201/10234 , H05K2203/0195 , H05K3/4611 , H05K3/4629 , Y10T29/49153 , Y10T29/49694
摘要: A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.
摘要翻译: 一种形成陶瓷电路基板的方法,允许安装高集成度密度的半导体元件。 该方法通过形成金属导电球以连接上层和下层的导电布线图案,提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板,其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。
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