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23 条记录 (耗时 0.022 秒)

    Method of forming external electrode
    5.
    发明授权
    Method of forming external electrode 有权
    形成外部电极的方法

    公开(公告)号：US07458151B2

    公开(公告)日：2008-12-02

    申请号：US11288203

    申请日：2005-11-29

    申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

    发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

    IPC分类号： H01R43/00 ,  H05K3/30 ,  H01G2/20

    CPC分类号： H01L23/4828 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0781 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  Y10T29/49224

    摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

    摘要翻译： 本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。 为了实现该目的，根据本发明的形成外部电极的方法包括：通过从导电膏20涂覆构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 朝向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和分别邻近侧面30a和侧面30b的芯片30的底面上的电极部分301b连接的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

    Ceramic electronic component and method for producing same
    6.
    发明授权
    Ceramic electronic component and method for producing same 有权
    陶瓷电子部件及其制造方法

    公开(公告)号：US08254083B2

    公开(公告)日：2012-08-28

    申请号：US12851106

    申请日：2010-08-05

    申请人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

    发明人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

    IPC分类号： H01G4/06

    CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

    摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

    摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

    Terminal electrode forming apparatus and system for holding electronic components
    7.
    发明申请
    Terminal electrode forming apparatus and system for holding electronic components 有权
    用于保持电子部件的端子电极形成装置和系统

    公开(公告)号：US20050247407A1

    公开(公告)日：2005-11-10

    申请号：US11183751

    申请日：2005-07-19

    申请人： Ko Onodera ,  Satoshi Kurimoto

    发明人： Ko Onodera ,  Satoshi Kurimoto

    IPC分类号： H01L23/48 ,  H01G13/00 ,  B32B31/00

    CPC分类号： H01G13/006 ,  Y10S156/922 ,  Y10S156/941 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T156/11 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1707 ,  Y10T156/19 ,  Y10T156/1906

    摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

    摘要翻译： 本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低 从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低， 导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。

    External electrode forming method
    9.
    发明授权
    External electrode forming method 有权

    公开(公告)号：US07673382B2

    公开(公告)日：2010-03-09

    申请号：US11641911

    申请日：2006-12-20

    申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

    发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

    IPC分类号： H01C17/28

    CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

    摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

    Terminal electrode forming apparatus and system for holding electronic components
    10.
    发明授权
    Terminal electrode forming apparatus and system for holding electronic components 有权
    用于保持电子部件的端子电极形成装置和系统

    公开(公告)号：US07487815B2

    公开(公告)日：2009-02-10

    申请号：US11183751

    申请日：2005-07-19

    申请人： Ko Onodera ,  Satoshi Kurimoto

    发明人： Ko Onodera ,  Satoshi Kurimoto

    IPC分类号： B32B37/22 ,  B32B38/10

    CPC分类号： H01G13/006 ,  Y10S156/922 ,  Y10S156/941 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T156/11 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1707 ,  Y10T156/19 ,  Y10T156/1906

    摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

    摘要翻译： 本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低 从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低， 导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。