公开(公告)号：US4571822A

公开(公告)日：1986-02-25

申请号：US557005

申请日：1983-12-01

申请人： Hiroshi Saito ,  Hiromasa Okayasu ,  Shinichi Tsuyuki ,  Takeshi Kawana ,  Takao Mifune ,  Masanori Yoshizaki

发明人： Hiroshi Saito ,  Hiromasa Okayasu ,  Shinichi Tsuyuki ,  Takeshi Kawana ,  Takao Mifune ,  Masanori Yoshizaki

IPC分类号： H02K15/06

CPC分类号： H02K15/068 ,  H02K15/0031 ,  Y10T29/49009 ,  Y10T29/53161

摘要： A method of and apparatus for inserting coils into slots formed in the stator core of a dynamoelectric machine such as an electric motor, with the stator core having open type slots each of which cooperates with blades of the apparatus for guiding the coil and a stripper for forcing the coil out of the blades. A closed space has a volume sufficient to avoid any disorder of coil wire layers when the coil is received by the closed space. After placing the coils in the closed spaces, the coils are pushed into the respective slots and, as desired, the coils are further compressed until the coil wires assume a non-circular cross-section. By so doing, it is possible to remarkably increase the space factor of each slot.

摘要翻译： 一种用于将线圈插入形成在诸如电动机的电动机的定子芯中的槽中的方法和装置，其中定子芯具有开口型槽，每个定子芯与用于引导线圈的装置的叶片配合，以及用于 迫使线圈从叶片中推出。 闭合空间具有足够的体积，以避免当线圈被封闭空间接收时线圈线层的任何紊乱。 在将线圈放置在封闭空间中之后，线圈被推入相应的槽中，并且根据需要，线圈被进一步压缩，直到线圈线呈非圆形横截面。 通过这样做，可以显着增加每个槽的空间因子。

公开(公告)号：US4520965A

公开(公告)日：1985-06-04

申请号：US520196

申请日：1983-08-04

申请人： Kazuo Kimura ,  Yukinori Taneda ,  Shinichi Tsuyuki ,  Shun Suzuki ,  Yoshio Hashimoto ,  Shinichi Sakamoto

发明人： Kazuo Kimura ,  Yukinori Taneda ,  Shinichi Tsuyuki ,  Shun Suzuki ,  Yoshio Hashimoto ,  Shinichi Sakamoto

IPC分类号： H02K15/09 ,  H02K15/095

CPC分类号： H02K15/095 ,  H02K15/09 ,  Y10T29/49012

摘要： An electric wire is wound as coil turns in slots in electric rotating machinery component such as a stator or an armature. The wire as it is supplied from a nozzle or flyer is guided by movable formers into successive layers of coil turns in the slots without forming an unwanted dead space in the slots. The formers are moved in radial increments to provide successive spaces in the slots for allowing the successive coil turn layers to be neatly laid in the spaces.

摘要翻译： 当线圈转动在诸如定子或衔铁的电动旋转机械部件的槽中时，缠绕电线。 从喷嘴或传单提供的电线由可移动的成形器引导到槽中的连续的线圈匝中，而不会在槽中形成不想要的死区。 成形器以径向增量移动以在槽中提供连续的空间，以允许将连续的线圈转动层整齐地放置在空间中。

公开(公告)号：US06642734B1

公开(公告)日：2003-11-04

申请号：US09707020

申请日：2000-11-06

申请人： Shinichi Tsuyuki ,  Toshiaki Ogura

发明人： Shinichi Tsuyuki ,  Toshiaki Ogura

IPC分类号： G01R3128

CPC分类号： G01R31/31924 ,  G01R31/31917

摘要： When performing supply and measurement of various signals on n=8 semiconductor IC devices under test DUT1-DUT8 using m=3 substrates 10-30, reference voltages of the devices under test DUT1-DUT3 are input to the substrate 10, reference voltages of the devices under test DUT4-DUT6 are input to the substrate 20, and reference voltages of the devices under test DUT7 and 8 are input to the substrate 30. The reference voltages input to each substrate 10-30 are averaged. The mean voltages made in each substrate are further connected to each other, and a reference voltage is made using three substrates 10-30. The reference voltage is used as a reference voltage for voltage generating circuits 11-31. The reference voltage having no variation among each substrate is set even if the number of semiconductor IC devices under test is increased and the whole equipment becomes large.

摘要翻译： 在使用m = 3衬底10-30的n = 8个被测试DUT1-DUT8的半导体IC器件上进行各种信号的供给和测量时，被测器件DUT1-DUT3的参考电压被输入到衬底10，参考电压 被测器件DUT4-DUT6被输入到衬底20，并且被测器件DUT7和8的参考电压被输入到衬底30.输入到每个衬底10-30的参考电压被平均。 在每个衬底中制造的平均电压进一步彼此连接，并且使用三个衬底10-30制成参考电压。 参考电压用作电压产生电路11-31的参考电压。 即使被测半导体IC器件的数量增加，整个设备变大，也设定各基板之间没有变化的基准电压。

公开(公告)号：US07491894B2

公开(公告)日：2009-02-17

申请号：US11085342

申请日：2005-03-21

申请人： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

发明人： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

IPC分类号： H05K1/16

CPC分类号： H05K1/141 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0218 ,  H05K1/056 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.

摘要翻译： 本发明的混合集成电路器件包括：具有经过绝缘处理的正面的电路板; 形成在所述电路板的前表面上的导电图案; 电路元件放置在导电图案上的期望位置并电连接到导电图案; 以及多个引线固定到导电图案并被引导到外部。 引导到外部的引线的端部在与电路板的前表面的平面不同的平面中大致平行于电路板延伸。

公开(公告)号：US07078797B2

公开(公告)日：2006-07-18

申请号：US10813137

申请日：2004-03-29

申请人： Takeshi Suzuki ,  Kazushige Osumi ,  Junichi Ichihashi ,  Toshiyuki Iimura ,  Shinichi Tsuyuki

发明人： Takeshi Suzuki ,  Kazushige Osumi ,  Junichi Ichihashi ,  Toshiyuki Iimura ,  Shinichi Tsuyuki

IPC分类号： H01L23/48

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0231 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4046 ,  H05K3/44 ,  H05K2201/09554 ,  H05K2201/09772 ,  H05K2201/10287 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a metal substrate provided with an insulating layer on a surface thereof, a conductive pattern formed on a surface of the insulating layer, a semiconductor element fixed onto the conductive pattern, a lead as external connecting means fixed to the conductive pattern in the periphery of the metal substrate, and a contact portion for electrically connecting the conductive pattern electrically connected to the semiconductor element to the metal substrate in the vicinity of the semiconductor element.

摘要翻译： 提供了一种混合集成电路器件，其可以更有效地稳定被配置为高速操作的电路。 本实施例的混合集成电路器件包括在其表面上设置有绝缘层的金属基板，形成在绝缘层的表面上的导电图案，固定到导电图案上的半导体元件，固定的外部连接装置的引线 涉及金属基板周边的导电图案，以及用于将与半导体元件电连接的导电图案与半导体元件附近的金属基板电连接的接触部。

公开(公告)号：US20050213308A1

公开(公告)日：2005-09-29

申请号：US11085342

申请日：2005-03-21

申请人： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

发明人： Takeshi Suzuki ,  Toshiyuki Ilmura ,  Kazushige Osumi ,  Shinichi Tsuyuki

IPC分类号： H01L25/18 ,  H01L23/50 ,  H01L25/04 ,  H01L25/16 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K7/06

CPC分类号： H05K1/141 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0218 ,  H05K1/056 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.

摘要翻译： 本发明的混合集成电路器件包括：具有经过绝缘处理的正面的电路板; 形成在所述电路板的前表面上的导电图案; 电路元件放置在导电图案上的期望位置并电连接到导电图案; 以及多个引线固定到导电图案并被引导到外部。 引导到外部的引线的端部在与电路板的前表面的平面不同的平面中大致平行于电路板延伸。