Process for producing single crystal silicon wafers
    2.
    发明授权
    Process for producing single crystal silicon wafers 失效
    制造单晶硅片的工艺

    公开(公告)号:US07077901B2

    公开(公告)日:2006-07-18

    申请号:US10402214

    申请日:2003-03-31

    IPC分类号: C30B19/02

    CPC分类号: C30B19/12 C30B19/02 C30B29/06

    摘要: A process for producing a single crystal silicon wafer, comprising the steps of forming a porous layer on a single crystal silicon substrate comprising a silicon whose concentration of mass number 28 silicon isotope is less than 92.5% on an average; dissolving a starting silicon whose concentration of mass number 28 silicone isotope whose mass number is more than 98% on an average in a melt for liquid-phase epitaxy until said starting silicon becomes to be a supersaturated state in said melt under reductive atmosphere maintained at high temperature: immersing said single crystal silicon substrate in said melt to grow a single crystal silicon layer on the surface of said porous layer of said single crystal silicon substrate; and peeling said single crystal silicon layer from a portion of said porous layer.

    摘要翻译: 一种制造单晶硅晶片的方法,包括以下步骤:在单晶硅衬底上形成多孔层,该单晶硅衬底包含平均浓度为28%硅同位素的硅的浓度小于92.5%的硅; 将其质量数为28的硅同位素的质量数大于98%的起始硅溶解在用于液相外延的熔体中,直到所述起始硅在所述熔体中在还原气氛保持在高温下变为过饱和状态为止 温度:将所述单晶硅衬底浸入所述熔体中以在所述单晶硅衬底的所述多孔层的表面上生长单晶硅层; 以及从所述多孔层的一部分剥离所述单晶硅层。

    Separating apparatus, separating method, and method of manufacturing semiconductor substrate
    3.
    发明授权
    Separating apparatus, separating method, and method of manufacturing semiconductor substrate 失效
    分离装置,分离方法和制造半导体衬底的方法

    公开(公告)号:US06609446B1

    公开(公告)日:2003-08-26

    申请号:US09495847

    申请日:2000-02-01

    IPC分类号: B23B2710

    摘要: When a bonded substrate stack prepared by bonding a first substrate in which a single-crystal Si layer is formed on a porous layer, and an insulating layer is formed on the single-crystal Si layer to a second substrate is to be separated at the porous layer, serrate defects at the peripheral portion of the separated substrates are prevented. A fluid is ejected from an ejection nozzle (112) and injected into the porous layer of a bonded substrate stack (30) while rotating the bonded substrate stack (30) about an axis (C) in a direction (R), thereby separating the bonded substrate stack (30) into two substrates at the porous layer. When the peripheral portion of the bonded substrate stack (30) is to be separated, the ejection nozzle (112) is located within a range (B).

    摘要翻译: 当在多晶层上形成单晶Si层的第一衬底与第二衬底之间形成绝缘层而制备的键合衬底叠层在多孔 可以防止分离的基板的周边部分的层,锯齿状缺陷。 从喷嘴(112)喷射流体并将其注入到键合衬底叠层(30)的多孔层中,同时使键合衬底叠层(30)绕轴线(C)沿方向(R)旋转,从而将 键合衬底叠层(30)在多孔层上形成两个衬底。 当键合衬底叠层(30)的周边部分被分离时,喷嘴(112)位于范围(B)内。

    Method and apparatus for producing photoelectric conversion device
    4.
    发明授权
    Method and apparatus for producing photoelectric conversion device 失效
    光电转换装置的制造方法及装置

    公开(公告)号:US06391743B1

    公开(公告)日:2002-05-21

    申请号:US09401775

    申请日:1999-09-22

    IPC分类号: H01L2130

    摘要: There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.

    摘要翻译: 公开了一种制造光电转换装置的方法,包括以下步骤:形成包括第一和第二半导体层的半导体衬底,其间具有分离层; 将支撑基板接合到与分离层侧表面相对的第二半导体层的表面,以形成键合衬底; 通过分离层分离第一和第二半导体层; 以及在所述第二半导体层中制造光电转换器件,其中当将所述半导体衬底和所述支撑衬底彼此接合时,至少一部分形成在所述键合衬底中,其中所述半导体衬底和所述支撑衬底的至少一部分端部和 支撑基板不与另一个基板接合,并且流体相对于键合衬底的侧表面喷射,从而分离第一和第二半导体层。 该方法可以以高产率分离粘合的基片,从而以低的生产成本提供高质量的光电转换装置。

    Method for preparing a semiconductor device
    6.
    发明授权
    Method for preparing a semiconductor device 失效
    半导体器件的制备方法

    公开(公告)号:US06025243A

    公开(公告)日:2000-02-15

    申请号:US257294

    申请日:1994-06-09

    摘要: A deposited film formation method comprises the steps of:(a) feeding a gas of an organometallic compound containing molybdenum atom and hydrogen gas onto a substrate having an electron donative surface; and(b) maintaining the temperature of the electron donative surface within the range of the decomposition temperature of the organometallic compound or lower and 800.degree. C. or lower to form a molybdenum film on the electron donative surface.

    摘要翻译: 沉积膜形成方法包括以下步骤:(a)将含有钼原子和氢气的有机金属化合物的气体供给到具有给电子表面的基板上; 和(b)将供电表面的温度保持在有机金属化合物的分解温度范围内或更低至800℃或更低,以在电子给体表面上形成钼膜。

    Method and apparatus for processing composite member
    7.
    发明授权
    Method and apparatus for processing composite member 失效
    复合材料加工方法及装置

    公开(公告)号:US06979629B2

    公开(公告)日:2005-12-27

    申请号:US10678146

    申请日:2003-10-06

    摘要: A detection apparatus for detecting a feature portion of a composite member having a structure in which a first member having a separation layer inside is brought into tight contact with a second member. The composite member has, as the feature portion, a portion at which a peripheral edge of the first member projects outside a peripheral edge of the second member. The apparatus includes a shift detection section which detects a shift between the peripheral edge of the first member and the peripheral edge of the second member along an outer periphery of the composite member and a determination section which determines the feature portion on the basis of a detection result by the shift detection section.

    摘要翻译: 一种用于检测复合构件的特征部分的检测装置,其具有其中具有内部具有分离层的第一构件与第二构件紧密接触的结构。 复合构件具有作为特征部分的第一构件的周缘突出到第二构件的周边边缘的部分。 该装置包括:移动检测部,其沿着复合部件的外周检测第一部件的周缘与第二部件的周缘之间的移动;判定部,其基于检测来决定特征部 由移位检测部分产生。

    Method of manufacturing semiconductor wafer method of using and utilizing the same
    9.
    发明授权
    Method of manufacturing semiconductor wafer method of using and utilizing the same 失效
    使用和利用半导体晶片方法的方法

    公开(公告)号:US06656271B2

    公开(公告)日:2003-12-02

    申请号:US09453539

    申请日:1999-12-03

    IPC分类号: C30B2518

    摘要: A process for manufacturing a semiconductor wafer which has superior suitability for mass production and reproducibility. The process comprises the steps of preparing a first member which has a monocrystalline semiconductor layer on a semiconductor substrate with a separation layer arranged therebetween with a semiconductor wafer as the raw material, transferring the monocrystalline semiconductor layer onto a second member which comprises a semiconductor wafer after separating the monocrystalline semiconductor layer through the separation layer, and smoothing the surface of the semiconductor substrate after the transferring step so as to be used as a semiconductor wafer for purposes other than forming the first and second members.

    摘要翻译: 一种半导体晶片的制造方法,其具有优异的批量生产和再现性的适用性。 该方法包括以下步骤:在半导体衬底上制备具有单晶半导体层的第一构件,其间分隔层以半导体晶片为原料,将单晶半导体层转移到第二构件上,该第二构件包括半导体晶片 通过分离层分离单晶半导体层,并且在转印步骤之后使半导体衬底的表面平滑,以便用作除了形成第一和第二构件之外的目的的半导体晶片。

    Sample processing system
    10.
    发明授权
    Sample processing system 失效
    样品处理系统

    公开(公告)号:US06629539B1

    公开(公告)日:2003-10-07

    申请号:US09434663

    申请日:1999-11-05

    IPC分类号: B08B302

    CPC分类号: H01L21/67196 Y10S134/902

    摘要: This invention is to provide a processing system suitable for manufacturing, e.g., an SOI substrate. A processing system includes a turntable on which holding mechanisms for holding bonded substrate stacks are mounted at a substantially equal angular interval, a driving mechanism for pivoting the turntable through a predetermined angle to move the bonded substrate stacks or separated substrates held by said holding mechanisms to operation positions and a centering apparatus, separating apparatus, and cleaning/drying apparatus for processing the bonded substrate stacks or separated substrates at the operation positions.

    摘要翻译: 本发明提供一种适于制造例如SOI衬底的处理系统。 一种处理系统,包括转盘,保持键合衬底叠层的保持机构以其间隔大致相等的方式安装在其上,用于使转台枢转预定角度的驱动机构,以将由所述保持机构保持的键合衬底叠层或分离的衬底移动到 操作位置和用于在操作位置处理键合衬底叠层或分离的衬底的定心装置,分离装置和清洁/干燥装置。