公开(公告)号：US20120315051A1

公开(公告)日：2012-12-13

申请号：US13578841

申请日：2011-12-16

申请人： Hiroyasu Oomori ,  Daisuke Kawase ,  Hiromi Kurashima

发明人： Hiroyasu Oomori ,  Daisuke Kawase ,  Hiromi Kurashima

IPC分类号： H04B10/02

CPC分类号： H05K9/0058 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/4292

摘要： An optical transceiver that reduces the EMI radiation leaked therefrom is disclosed. The optical transceiver includes a top cover and the bottom base to form a cavity into which a TOSA, a ROSA, and a circuit are set. The top cover provides a combed structure in a rear portion thereof, where the combed structure has a plurality of fins with a distance preferably less that quarter wavelength λ/4 of the noise wavelength to be reduced. The combed structure operates as a short stub for the electromagnetic wave traveling longitudinally in the cavity.

摘要翻译： 公开了一种降低从其泄漏的EMI辐射的光收发器。 光收发器包括顶盖和底部基座，以形成一个空腔，TOSA，ROSA和电路被设置在该腔中。 顶盖在其后部提供梳理结构，其中精梳结构具有多个翅片，其优选地距离噪声波长的四分之一波长λ/ 4要减小一些。 精梳结构作为用于在空腔中纵向行进的电磁波的短截线。

公开(公告)号：US09042722B2

公开(公告)日：2015-05-26

申请号：US13578841

申请日：2011-12-16

申请人： Hiroyasu Oomori ,  Daisuke Kawase ,  Hiromi Kurashima

发明人： Hiroyasu Oomori ,  Daisuke Kawase ,  Hiromi Kurashima

IPC分类号： H04B10/08 ,  H04B17/00 ,  H04B13/02 ,  H04B10/00 ,  H05K9/00 ,  G02B6/42

CPC分类号： H05K9/0058 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/4292

摘要： An optical transceiver that reduces the EMI radiation leaked therefrom is disclosed. The optical transceiver includes a top cover and the bottom base to form a cavity into which a TOSA, a ROSA, and a circuit are set. The top cover provides a combed structure in a rear portion thereof, where the combed structure has a plurality of fins with a distance preferably less that quarter wavelength λ/4 of the noise wavelength to be reduced. The combed structure operates as a short stub for the electromagnetic wave traveling longitudinally in the cavity.

摘要翻译： 公开了一种降低从其泄漏的EMI辐射的光收发器。 光收发器包括顶盖和底部基座，以形成一个空腔，TOSA，ROSA和电路被设置在该腔中。 顶盖在其后部提供梳理结构，其中精梳结构具有多个翅片，其优选地距离噪声波长的四分之一波长λ/ 4要减小一些。 精梳结构作为用于在空腔中纵向行进的电磁波的短截线。

公开(公告)号：US20100289148A1

公开(公告)日：2010-11-18

申请号：US12843934

申请日：2010-07-27

申请人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/15

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US08125090B2

公开(公告)日：2012-02-28

申请号：US12843934

申请日：2010-07-27

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20110187933A1

公开(公告)日：2011-08-04

申请号：US13013400

申请日：2011-01-25

申请人： Daisuke Kawase ,  Makiko Mori ,  Osamu Sagano

发明人： Daisuke Kawase ,  Makiko Mori ,  Osamu Sagano

IPC分类号： H04N5/21

CPC分类号： H04N5/21

摘要： An image display apparatus of the present invention includes: a display panel; a signal processing unit which corrects an input video signal using correction parameters, and outputs the corrected video signal to the display panel; a power supply unit which supplies voltage to the display panel; a storage unit which stores the correction parameters; and a control unit, which, at startup of the image display apparatus, executes boosting processing for boosting voltage supplied from the power supply unit to the display panel up to a voltage required for driving the display panel in stages, and transfer processing for transferring the correction parameters from the storage unit to the signal processing unit, wherein the transfer processing is processing for intermittently transferring the correction parameters using a period when boosting is not performed in the boosting processing.

摘要翻译： 本发明的图像显示装置包括：显示面板; 信号处理单元，其使用校正参数校正输入视频信号，并将校正后的视频信号输出到显示面板; 向显示面板供给电压的电源单元; 存储单元，存储校正参数; 以及控制单元，其在图像显示装置的启动时执行用于将从电源单元提供给显示面板的电压升压至分级驱动显示面板所需的电压的升压处理，以及用于传送 从存储单元到信号处理单元的校正参数，其中传送处理是使用在升压处理中不执行升压的时段间歇地传送校正参数的处理。

公开(公告)号：US5736753A

公开(公告)日：1998-04-07

申请号：US521548

申请日：1995-08-30

申请人： Toshiyuki Ohno ,  Yohsuke Inoue ,  Daisuke Kawase ,  Yuzo Kozono ,  Takaya Suzuki ,  Tsutomu Yatsuo

发明人： Toshiyuki Ohno ,  Yohsuke Inoue ,  Daisuke Kawase ,  Yuzo Kozono ,  Takaya Suzuki ,  Tsutomu Yatsuo

IPC分类号： H01L21/04 ,  H01L29/24 ,  H01L29/78 ,  H01L29/808 ,  H01L31/0312 ,  H01L29/74 ,  H01L29/861

CPC分类号： H01L29/7802 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/7801 ,  H01L29/7813 ,  H01L29/8083

摘要： To provide a field-effect transistor having a large power conversion capacity and its fabrication method by decreasing the leakage current between the source and the drain of a semiconductor device made of hexagonal-system silicon carbide when the gate voltage of the semiconductor device is turned off and also decreasing the electrical resistance of the semiconductor device when the gate voltage of the semiconductor device is turned on. The main current path of the field-effect transistor is formed so that the current flowing between the source and the drain of, for example, a field-effect transistor flows in the direction parallel with the {0001} plane and a channel forming plane is parallel with the {1120} plane. �Selected Drawing!FIG. 1

摘要翻译： 为了提供具有大的功率转换能力的场效应晶体管及其制造方法，当半导体器件的栅极电压被关断时，通过减小由六方晶系碳化硅制成的半导体器件的源极和漏极之间的漏电流 并且当半导体器件的栅极电压导通时也降低半导体器件的电阻。 形成场效应晶体管的主电流路径，使得在例如场效应晶体管的源极和漏极之间流动的电流沿与{0001}平面平行的方向流动，沟道形成面为 与{1120}平面平行。 [所选图]

公开(公告)号：US08004075B2

公开(公告)日：2011-08-23

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20070246833A1

公开(公告)日：2007-10-25

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。