公开(公告)号：US08125090B2

公开(公告)日：2012-02-28

申请号：US12843934

申请日：2010-07-27

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20100289148A1

公开(公告)日：2010-11-18

申请号：US12843934

申请日：2010-07-27

申请人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao SOGA ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/15

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US08004075B2

公开(公告)日：2011-08-23

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20070246833A1

公开(公告)日：2007-10-25

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US09202622B2

公开(公告)日：2015-12-01

申请号：US13813174

申请日：2012-06-29

申请人： Koji Kai ,  Kazuki Houzan ,  Akira Nagai ,  Kazuhiro Suzuki

发明人： Koji Kai ,  Kazuki Houzan ,  Akira Nagai ,  Kazuhiro Suzuki

IPC分类号： B23K11/24 ,  H01F27/06 ,  H01F38/08 ,  B23K11/11 ,  H01F27/40

CPC分类号： H01F38/085 ,  B23K11/115 ,  B23K11/241 ,  B23K2101/18 ,  H01F2027/408

摘要： It is possible to control a welding in a high speed and a high precision large electric current, and consumption electric power is also reduced. In the welding transformer, a loop magnetic core 25, a wound primary coil 12, plural positive side coils 14 and plural negative side coils 16 that are alternately sandwiched between respective gaps 12a of the primary coil 12, are comprised. A coil is fixed on the other surface of a contact base member 62. On the other surface of the contact base member 62, a first connection polar board 44 is electrically connected to a positive side electric conductor 30 through the first connection polar board 44. A negative side coil 16 is electrically connected to a negative side electric conductor 32. The connecting part of the positive side coil 14 and the negative side coil 16 is electrically connected to the third connection polar board 48. By sandwiching a thin insulation layer 31, a positive side electric conductor 30, a rectifying device 18 and a first polar board 34 are arranged on one side; A negative side electric conductor 32, a rectifying device 20 and a second polar board 36 are arranged on the other side; and the first polar board 34 and the second polar board 36 are electrically connected to a third polar board 38. It is possible to use by combining plural units and by connecting an output side in parallel in a small size and a large capacity.

摘要翻译： 可以高速，高精度的大电流控制焊接，消耗电力也降低。 在焊接变压器中，包括交替夹在初级线圈12的相应间隙12a之间的环形磁芯25，绕组初级线圈12，多个正侧线圈14和多个负侧线圈16。 线圈固定在接触基底构件62的另一个表面上。在接触基底构件62的另一个表面上，第一连接极板44通过第一连接极板44电连接到正侧电导体30。 负极侧线圈16与负极侧导体32电连接。正极侧线圈14与负极侧线圈16的连接部与第3连接极板48电连接。通过夹持薄层绝缘层31， 正侧导电体30，整流装置18和第一极板34一侧配置; 负侧导电体32，整流装置20和第二极板36配置在另一侧。 并且第一极板34和第二极板36电连接到第三极板38.可以通过组合多个单元并且通过以小尺寸和大容量并联连接输出侧来使用。

公开(公告)号：US09076256B2

公开(公告)日：2015-07-07

申请号：US13578952

申请日：2011-03-09

申请人： Hiroyuki Ishige ,  Kazuhiro Suzuki ,  Akira Miyashita

发明人： Hiroyuki Ishige ,  Kazuhiro Suzuki ,  Akira Miyashita

IPC分类号： G06K9/36 ,  G06T19/00 ,  G06T7/00 ,  G06F3/01

CPC分类号： G06T19/006 ,  G06F3/011 ,  G06T7/73

摘要： An information processing apparatus that acquires first posture information corresponding to the information processing apparatus and a first distance coordinate corresponding to the information processing apparatus, and second posture information corresponding to another information processing apparatus and a second distance coordinate corresponding to the another information processing apparatus. The information processing apparatus then calculates an object's position in a virtual space based on the first and second posture information and the first and second distance coordinates.

摘要翻译： 一种信息处理装置，其获取与所述信息处理装置对应的第一姿态信息和与所述信息处理装置对应的第一距离坐标，以及与所述另一信息处理装置对应的第二姿势信息和与所述另一信息处理装置对应的第二距离坐标。 信息处理装置然后基于第一和第二姿势信息以及第一和第二距离坐标来计算物体在虚拟空间中的位置。

公开(公告)号：US09005500B2

公开(公告)日：2015-04-14

申请号：US12970672

申请日：2010-12-16

申请人： Michimasa Ote ,  Takashi Gonda ,  Junya Ishida ,  Kenro Takizawa ,  Kazuhiro Suzuki ,  Yuzo Morioka

发明人： Michimasa Ote ,  Takashi Gonda ,  Junya Ishida ,  Kenro Takizawa ,  Kazuhiro Suzuki ,  Yuzo Morioka

IPC分类号： B29C47/10 ,  B29C47/94 ,  B29C47/92 ,  B29C47/00 ,  B29C47/88 ,  C08J5/18 ,  C08L79/08 ,  H01G4/18 ,  H01G13/00 ,  B29C47/14 ,  B29K79/00 ,  B29K105/00

CPC分类号： B29C47/10 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/1072 ,  B29C47/14 ,  B29C47/8845 ,  B29C47/886 ,  B29C47/92 ,  B29C2947/92152 ,  B29C2947/922 ,  B29C2947/92228 ,  B29C2947/92238 ,  B29C2947/92285 ,  B29C2947/92342 ,  B29C2947/92438 ,  B29C2947/92447 ,  B29C2947/9259 ,  B29C2947/92923 ,  B29K2079/085 ,  B29K2105/256 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H01G4/18 ,  H01G13/00 ,  Y10T428/24355

摘要： When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.

摘要翻译： 当通过挤出机挤出熔融树脂时，将简单的聚醚酰亚胺树脂从T型模头7的唇部7a熔融挤出，并且模制简单的聚醚酰亚胺树脂的膜。 然后将成型材料切换成包括聚醚酰亚胺树脂和氟树脂的树脂组合物，然后将树脂组合物的膜从T模具7连续地挤出和模塑。已经用简单的薄膜8a覆盖 聚醚酰亚胺树脂，在T型模​​7的唇部7a的流路面上，与中心部分形成有与膜8a亲和的聚醚酰亚胺树脂和氟树脂的树脂组合物层8b。

公开(公告)号：US08742527B2

公开(公告)日：2014-06-03

申请号：US13416290

申请日：2012-03-09

申请人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L21/00 ,  H01L31/0232

CPC分类号： H01L27/14605 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.

摘要翻译： 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

公开(公告)号：US08690186B2

公开(公告)日：2014-04-08

申请号：US12877213

申请日：2010-09-08

申请人： Kazuyoshi Kuroki ,  Satoshi Iijima ,  Kazuhiro Suzuki

发明人： Kazuyoshi Kuroki ,  Satoshi Iijima ,  Kazuhiro Suzuki

IPC分类号： B60R21/231 ,  B60R21/2338

CPC分类号： B62J27/00 ,  B60R21/231 ,  B60R21/233 ,  B60R2021/0048 ,  B60R2021/0088 ,  B60R2021/161 ,  B60R2021/23386

摘要： An airbag system is configured to fulfill its role on a saddle-ride type vehicle even when the vehicle collides with a side of a vehicle moving in a generally perpendicular direction. An embodiment of the airbag system includes an airbag which is configured to the inflated and fully upward from the vehicle front of a rider. The airbag includes a head part opposite to a rider's head during inflation and deployment, and a neck part which rises upward from the vehicle and toward the head part. The neck part has a width in a direction of vehicle width which is narrower than that of the head part. The neck part includes neckings curved inward in the direction of the vehicle width.

摘要翻译： 安全气囊系统被配置为即使当车辆与大致垂直的方向移动的车辆的一侧碰撞时也能够在骑乘式车辆上发挥其作用。 安全气囊系统的一个实施例包括一个气囊，其构造成从骑车人的车辆前方充气并完全向上。 安全气囊包括在充气和展开期间与骑手的头部相对的头部，以及从车辆向上升起并朝向头部的颈部。 颈部的车宽方向的宽度比头部的宽度窄。 颈部包括沿车宽方向向内弯曲的颈部。

公开(公告)号：US08415622B2

公开(公告)日：2013-04-09

申请号：US13414941

申请日：2012-03-08

申请人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

发明人： Kazuhiro Suzuki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Hideyuki Funaki ,  Hitoshi Yagi ,  Keita Sasaki ,  Honam Kwon ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno

IPC分类号： H01L25/00

CPC分类号： H01L27/14618 ,  G01J5/024 ,  H01L27/1461 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14649 ,  H01L2924/0002 ,  H01L2924/00

摘要： An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit.

摘要翻译： 根据实施例的红外成像元件包括：包括硅第一基板的堆叠结构的半导体基板和第一绝缘膜，在第一基板的表面上设置有第一空腔; 红外线检测单元，设置在所述半导体基板中，并且包括分别设置在所述第一空腔上的检测单元，每个所述检测单元具有二极管和第二绝缘膜，所述第一绝缘膜将入射红外线转换成加热， 由所述第一绝缘膜获得的电信号;第三绝缘膜，其具有与所述第二绝缘膜的顶面相比位于距所述半导体基板更远的距离的顶面; 以及设置在所述第三绝缘膜上的第二基板。 在第二基板和红外线检测单元之间形成第二空腔。