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    Composition for protective coating material
    3.
    发明授权
    Composition for protective coating material 失效
    保护涂层材料的组成

    公开(公告)号：US4645688A

    公开(公告)日：1987-02-24

    申请号：US679460

    申请日：1984-12-07

    申请人： Daisuke Makino ,  Hidetaka Sato ,  Hiroshi Suzuki ,  Shun-ichiro Uchimura ,  Hiroshi Suzuki

    发明人： Daisuke Makino ,  Hidetaka Sato ,  Hiroshi Suzuki ,  Shun-ichiro Uchimura ,  Hiroshi Suzuki

    IPC分类号： C08G73/10 ,  C08G77/54 ,  H01B3/30 ,  H01B3/46 ,  H01L23/29 ,  B05D5/12

    CPC分类号： C08G77/54 ,  C08G73/1042 ,  C08G73/106 ,  H01B3/303 ,  H01B3/46 ,  H01L23/296 ,  H01L2924/0002

    摘要： There are disclosed a composition for protective coating material, preferably for a protective coating material of a semiconductor device which is constituted of principal elements of a semiconductor memory element, an encapsulating layer containing an inorganic material for encapsulating said element and a layer of a cured protective coating material arranged between said memory element and said encapsulating layer, which is composed of a polyamide acid obtained by the reaction of a diaminosiloxane, an organic diamine containing no silicon and an organic tetrabasic acid dianhydride, and a semiconductor device having a layer of a cured protective coating material composed of a polyimide-silicone copolymer obtained by dehydrating ring closure of the above-mentioned polyamide acid.

    摘要翻译： 公开了一种用于保护涂层材料的组合物，优选用于半导体器件的保护涂层材料，其由半导体存储元件的主要元件，包含用于封装所述元件的无机材料的封装层和固化保护层 布置在所述存储元件和所述封装层之间的涂料，其由通过二氨基硅氧烷，不含硅的有机二胺和有机四元酸二酐反应获得的聚酰胺酸和具有固化的层的半导体器件 由通过上述聚酰胺酸脱水闭环得到的聚酰亚胺 - 硅氧烷共聚物构成的保护涂料。

    Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings
    4.
    发明授权
    Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings 失效
    具有硅氧烷键的聚酰胺酸的制造方法和具有硅氧烷键和异吲哚喹啉二酮环的聚酰亚胺的制造方法

    公开(公告)号：US4847358A

    公开(公告)日：1989-07-11

    申请号：US86892

    申请日：1987-08-18

    申请人： Mitsumasa Kojima ,  Takayuki Saito ,  Toul Kikuchi ,  Shun-ichiro Uchimura ,  Hidetaka Satou ,  Daisuke Makino

    发明人： Mitsumasa Kojima ,  Takayuki Saito ,  Toul Kikuchi ,  Shun-ichiro Uchimura ,  Hidetaka Satou ,  Daisuke Makino

    IPC分类号： C08G73/10

    CPC分类号： C08G73/106

    摘要： There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:(a) a tetracarboxylic dianhydride having at least one siloxane bond of the formula: ##STR1## wherein R represents a monovalent hydrocarbon group and m is an integer of 1 or more;(b) a diamine; and(c) a diaminoamide compound of the formula (II): ##STR2## wherein Ar represents an aromatic residue, Y represents SO.sub.2 or CO, and one amino group and Y--YNH.sub.2 are positioned in ortho-position to each other,and optinal presence of(d) an aromatic tetracarboxylic dianhydride;with the total amount of the diamine and the diaminoamide compound and the total amount of the tetracarboxylic dianhydride of the formula (I) and the aromatic tetracarboxylic dianhydride optionally contained being substantially equal moles;and a process for producing a polyimide having at least one siloxane bond and at least one isoindoloquinazolinedione ring, which comprises further heating the resulting polyamide acid to dehydration ring closure.

    摘要翻译： 公开了一种制备具有至少一个硅氧烷键的聚酰胺酸的方法，该方法包括进行以下反应：（a）具有至少一个具有下式的硅氧烷键的四羧酸二酐：其中R表示 一价烃基，m为1以上的整数， （b）二胺; 和（c）式（II）的二氨基酰胺化合物：其中Ar表示芳族残基，Y表示SO 2或CO，一个氨基和Y-YNH 2彼此相邻位置 ，和（d）芳族四羧酸二酐的选择性存在; 二胺和二氨基酰胺化合物的总量和式（I）的四羧酸二酐和任选地含有的芳族四羧酸二酐的总量基本相等; 以及生产具有至少一个硅氧烷键和至少一个异吲哚喹啉二酮环的聚酰亚胺的方法，其包括进一步将所得聚酰胺酸加热至脱水闭环。

    Resin encapsulated semiconductor device
    8.
    发明授权
    Resin encapsulated semiconductor device 失效
    树脂封装半导体器件

    公开(公告)号：US4758875A

    公开(公告)日：1988-07-19

    申请号：US266198

    申请日：1981-05-22

    申请人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

    发明人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

    IPC分类号： C08G73/00 ,  C08G73/10 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/28 ,  H01L29/34

    CPC分类号： H01L21/312 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025

    摘要： Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: ##STR1## wherein R is an aliphatic or aromatic group; R.sub.1 and R.sub.2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF.sub.3 ; and R.sub.3 to R.sub.6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.

    摘要翻译： 公开了一种树脂封装的半导体存储器件，其包括半导体存储元件，封装存储元件的封装以及介于该存储元件与封装之间的由防水芳香族聚酰亚胺聚合物制成的α-阵列屏蔽层，芳族聚酰亚胺聚合物 饱和吸水率为1％以下。 聚酰亚胺聚合物作为具有以下重复单元的聚合物被列举：其中R是脂族或芳族基团; R1和R2独立地为氢原子，具有1至4个碳原子的烷基或CF 3; R 3〜R 6独立地为氢原子，卤原子或碳原子数为1〜4的烷基。 本发明还涉及使用低吸水性的芳族聚酰亚胺聚合物作为绝缘层或钝化膜的树脂封装的半导体器件。

    Image forming apparatus
    10.
    发明授权
    Image forming apparatus 有权
    图像形成装置

    公开(公告)号：US08159515B2

    公开(公告)日：2012-04-17

    申请号：US12541771

    申请日：2009-08-14

    申请人： Daisuke Makino

    发明人： Daisuke Makino

    IPC分类号： B41J2/435

    CPC分类号： G03G15/5037 ,  G03G15/5033

    摘要： An image forming apparatus includes an image forming unit, an exposure unit, a detection unit, a storage unit, and a control unit. The image forming unit includes a photosensitive member on which an electrostatic latent image is formed. The exposure unit exposes the photosensitive member. The detection unit detects that a reference position disposed on the photosensitive member has reached a predetermined position. The storage unit stores correction data for correcting unevenness of potential characteristic in the photosensitive member. The control unit controls an exposure intensity of the exposure unit at each position on the photosensitive member based on the correction data.

    摘要翻译： 图像形成装置包括图像形成单元，曝光单元，检测单元，存储单元和控制单元。 图像形成单元包括其上形成有静电潜像的感光构件。 曝光单元使感光构件露出。 检测单元检测设置在感光构件上的基准位置已经到达预定位置。 存储单元存储用于校正感光构件中的电位特性不均匀的校正数据。 控制单元基于校正数据控制感光构件上的每个位置处的曝光单元的曝光强度。