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    Resin encapsulated semiconductor device
    1.
    发明授权
    Resin encapsulated semiconductor device 失效
    树脂封装半导体器件

    公开(公告)号：US4758875A

    公开(公告)日：1988-07-19

    申请号：US266198

    申请日：1981-05-22

    申请人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

    发明人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

    IPC分类号： C08G73/00 ,  C08G73/10 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/28 ,  H01L29/34

    CPC分类号： H01L21/312 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025

    摘要： Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: ##STR1## wherein R is an aliphatic or aromatic group; R.sub.1 and R.sub.2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF.sub.3 ; and R.sub.3 to R.sub.6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.

    摘要翻译： 公开了一种树脂封装的半导体存储器件，其包括半导体存储元件，封装存储元件的封装以及介于该存储元件与封装之间的由防水芳香族聚酰亚胺聚合物制成的α-阵列屏蔽层，芳族聚酰亚胺聚合物 饱和吸水率为1％以下。 聚酰亚胺聚合物作为具有以下重复单元的聚合物被列举：其中R是脂族或芳族基团; R1和R2独立地为氢原子，具有1至4个碳原子的烷基或CF 3; R 3〜R 6独立地为氢原子，卤原子或碳原子数为1〜4的烷基。 本发明还涉及使用低吸水性的芳族聚酰亚胺聚合物作为绝缘层或钝化膜的树脂封装的半导体器件。

    Composition for protective coating material
    4.
    发明授权
    Composition for protective coating material 失效
    保护涂层材料的组成

    公开(公告)号：US4645688A

    公开(公告)日：1987-02-24

    申请号：US679460

    申请日：1984-12-07

    申请人： Daisuke Makino ,  Hidetaka Sato ,  Hiroshi Suzuki ,  Shun-ichiro Uchimura ,  Hiroshi Suzuki

    发明人： Daisuke Makino ,  Hidetaka Sato ,  Hiroshi Suzuki ,  Shun-ichiro Uchimura ,  Hiroshi Suzuki

    IPC分类号： C08G73/10 ,  C08G77/54 ,  H01B3/30 ,  H01B3/46 ,  H01L23/29 ,  B05D5/12

    CPC分类号： C08G77/54 ,  C08G73/1042 ,  C08G73/106 ,  H01B3/303 ,  H01B3/46 ,  H01L23/296 ,  H01L2924/0002

    摘要： There are disclosed a composition for protective coating material, preferably for a protective coating material of a semiconductor device which is constituted of principal elements of a semiconductor memory element, an encapsulating layer containing an inorganic material for encapsulating said element and a layer of a cured protective coating material arranged between said memory element and said encapsulating layer, which is composed of a polyamide acid obtained by the reaction of a diaminosiloxane, an organic diamine containing no silicon and an organic tetrabasic acid dianhydride, and a semiconductor device having a layer of a cured protective coating material composed of a polyimide-silicone copolymer obtained by dehydrating ring closure of the above-mentioned polyamide acid.

    摘要翻译： 公开了一种用于保护涂层材料的组合物，优选用于半导体器件的保护涂层材料，其由半导体存储元件的主要元件，包含用于封装所述元件的无机材料的封装层和固化保护层 布置在所述存储元件和所述封装层之间的涂料，其由通过二氨基硅氧烷，不含硅的有机二胺和有机四元酸二酐反应获得的聚酰胺酸和具有固化的层的半导体器件 由通过上述聚酰胺酸脱水闭环得到的聚酰亚胺 - 硅氧烷共聚物构成的保护涂料。

    Image forming apparatus
    7.
    发明授权
    Image forming apparatus 有权
    图像形成装置

    公开(公告)号：US08159515B2

    公开(公告)日：2012-04-17

    申请号：US12541771

    申请日：2009-08-14

    申请人： Daisuke Makino

    发明人： Daisuke Makino

    IPC分类号： B41J2/435

    CPC分类号： G03G15/5037 ,  G03G15/5033

    摘要： An image forming apparatus includes an image forming unit, an exposure unit, a detection unit, a storage unit, and a control unit. The image forming unit includes a photosensitive member on which an electrostatic latent image is formed. The exposure unit exposes the photosensitive member. The detection unit detects that a reference position disposed on the photosensitive member has reached a predetermined position. The storage unit stores correction data for correcting unevenness of potential characteristic in the photosensitive member. The control unit controls an exposure intensity of the exposure unit at each position on the photosensitive member based on the correction data.

    摘要翻译： 图像形成装置包括图像形成单元，曝光单元，检测单元，存储单元和控制单元。 图像形成单元包括其上形成有静电潜像的感光构件。 曝光单元使感光构件露出。 检测单元检测设置在感光构件上的基准位置已经到达预定位置。 存储单元存储用于校正感光构件中的电位特性不均匀的校正数据。 控制单元基于校正数据控制感光构件上的每个位置处的曝光单元的曝光强度。

    Electronic parts board and method of producing the same
    8.
    发明授权
    Electronic parts board and method of producing the same 失效
    电子零件板及其制造方法

    公开(公告)号：US07728710B2

    公开(公告)日：2010-06-01

    申请号：US10541459

    申请日：2004-02-05

    申请人： Shinji Mizuno ,  Koji Mitsui ,  Katsutoshi Yanoshita ,  Shinichi Suzuki ,  Takashi Shinoki ,  Kazutaka Nakagome ,  Naoki Fukuda ,  Kozo Morita ,  Daisuke Makino

    发明人： Shinji Mizuno ,  Koji Mitsui ,  Katsutoshi Yanoshita ,  Shinichi Suzuki ,  Takashi Shinoki ,  Kazutaka Nakagome ,  Naoki Fukuda ,  Kozo Morita ,  Daisuke Makino

    IPC分类号： H01C10/32

    CPC分类号： B29C45/1418 ,  B29C45/14467 ,  B29C45/14639 ,  B29L2031/3406 ,  H01C10/32 ,  H01C10/48 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/0014 ,  H05K3/0058 ,  Y10T29/49082 ,  Y10T428/24917

    摘要： An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.

    摘要翻译： 电子部件基板（1-1）具有安装在绝缘基体（10）上的绝缘基体（10）和柔性电路基板（20）。 柔性电路板（20）是其上设置有端子图案（29）的合成树脂膜和表面与滑块滑动接触的导体图案（25）。 绝缘基座（10）是合成树脂模制件。 柔性电路板（20）被嵌入成型到绝缘基座（10）。 电子部件基板（1-1）通过制备柔性电路板（20）和具有空腔（C1）的第一和第二模具部件（41,45）制成，其形状对应于电子部件的外部形状 基板（1-1）。 然后，柔性电路板（20）容纳在第一和第二模具构件（41,45）之间的空腔（C1）中，并且空腔（C1）填充有熔融模制树脂。 在模制树脂固化之后，移除第一和第二模具构件（41,45）。

    Method for manufacturing a ceramic stack
    9.
    发明申请
    Method for manufacturing a ceramic stack 审中-公开
    制造陶瓷叠层的方法

    公开(公告)号：US20070289690A1

    公开(公告)日：2007-12-20

    申请号：US11808977

    申请日：2007-06-14

    申请人： Eturo Yasuda ,  Noriaki Kihara ,  Hirokatsu Mukai ,  Daisuke Makino

    发明人： Eturo Yasuda ,  Noriaki Kihara ,  Hirokatsu Mukai ,  Daisuke Makino

    IPC分类号： C03B29/00

    CPC分类号： B32B18/00 ,  C04B35/632 ,  C04B35/64 ,  C04B35/645 ,  C04B2235/9607 ,  C04B2235/9615 ,  C04B2237/343

    摘要： A method for manufacturing a ceramic stack is provided, which can suppress distortion, separation, cracking and the like that may be caused in plural types of ceramic sheets after being stacked and baked for integration. The method includes a step of obtaining a relation between volume rates of organic materials contained in the ceramic sheets and baking shrinkages of the sheets, resulting from baking the sheets at a predetermined temperature, a step of selecting a volume rate of organic materials for each of the ceramic sheets based on the relation obtained at the previous step, so that all the sheets may have substantially the same baking shrinkage as desired, a step of forming the plural types of ceramic sheets based on the volume rate selected at the previous step, and a step of stacking and baking for integration the plural types of ceramic sheets to fabricate a ceramic stack.

    摘要翻译： 提供了一种制造陶瓷堆叠的方法，其可以抑制在堆叠和烘烤一体化之后可能在多种类型的陶瓷片中引起的变形，分离，开裂等。 该方法包括获得陶瓷片中所含的有机材料的体积率与片材的烘烤收缩率之间的关系的步骤，其是在预定温度下对片材进行烘烤而得到的步骤，选择有机材料的体积比为 基于上述步骤获得的关系，使得所有的片材可以具有基本上相同的烘烤收缩率，基于在前一步骤选择的体积率形成多种陶瓷片材的步骤，以及 堆叠和烘烤用于整合多种类型的陶瓷片以制造陶瓷叠层的步骤。

    Structure of gas sensor element to provide enhanced measurement accuracy
    10.
    发明申请
    Structure of gas sensor element to provide enhanced measurement accuracy 审中-公开
    气体传感器元件结构，提高测量精度

    公开(公告)号：US20070084723A1

    公开(公告)日：2007-04-19

    申请号：US11580305

    申请日：2006-10-13

    申请人： Keigo Mizutani ,  Daisuke Makino ,  Kazunori Suzuki

    发明人： Keigo Mizutani ,  Daisuke Makino ,  Kazunori Suzuki

    IPC分类号： G01N27/26

    CPC分类号： G01N27/4075

    摘要： A gas sensor element is designed to determine the concentration of a selected component contained in gas and includes a sensor cell. The sensor cell is equipped with two electrodes one of which is exposed to a gas chamber into which the gas flows from outside the gas sensor element. The electrodes connect with leads extending to external terminals exposed to the atmospheric air. One of the leads connecting with one of the electrodes exposed to the gas chamber is made of material which includes a mixture of a metallic composition and a ceramic composition and contains 7% or less by weight of the ceramic composition based on a total weight of the mixture. This results in a decrease in porosity of the lead, which reduces the intrusion of oxygen gas into the gas chamber, thereby enhancing the accuracy in determining the concentration of the selected component of the gas.

    摘要翻译： 设计气体传感器元件以确定气体中包含的选定组分的浓度并且包括传感器单元。 传感器单元配备有两个电极，其中一个电极暴露于气体从气体传感器元件外部流动的气体室中。 电极连接到延伸到暴露于大气中的外部端子的引线。 与暴露于气室的电极之一连接的引线中的一个由包括金属组合物和陶瓷组合物的混合物的材料制成，并且基于所述陶瓷组合物的总重量含有7重量％或更少的陶瓷组合物 混合物。 这导致铅的孔隙率降低，这减少了氧气进入气室的侵入，从而提高了确定气体选定组分浓度的准确性。