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    Light emitting device, light emitting device package, and lighting system
    5.
    发明授权
    Light emitting device, light emitting device package, and lighting system 有权
    发光装置，发光装置封装和照明系统

    公开(公告)号：US08471241B2

    公开(公告)日：2013-06-25

    申请号：US13049126

    申请日：2011-03-16

    申请人： Kwang Ki Choi ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    发明人： Kwang Ki Choi ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    IPC分类号： H01L33/06

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/385 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.

    摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。 发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。 导电层设置在发光结构层的下方。 接合层设置在导电层下方。 支撑构件设置在接合层下方。 第一衬垫设置在支撑构件的下方。 第二垫片设置在支撑构件的下方距离第一垫片一定距离处。 第一电极连接在第一导电类型半导体层和第一焊盘之间。 第二电极连接在接合层和第二焊盘之间。

    Light emitting device and light emitting device package having the same
    6.
    发明授权
    Light emitting device and light emitting device package having the same 有权
    发光器件和具有该发光器件的发光器件封装

    公开(公告)号：US08421112B2

    公开(公告)日：2013-04-16

    申请号：US12986592

    申请日：2011-01-07

    申请人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    发明人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    IPC分类号： H01L31/0224

    CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.

    摘要翻译： 公开了一种发光器件和具有该发光器件的发光器件封装。 发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。