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    PRINTED WIRING BOARD
    1.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20150257261A1

    公开(公告)日：2015-09-10

    申请号：US14640502

    申请日：2015-03-06

    Applicant: IBIDEN CO., LTD.

    Inventor： Katsutoshi KITAGAWA

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/11 ,  H01L23/498 ,  H01L23/367

    CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/032 ,  H05K1/115 ,  H05K1/18 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0335 ,  H05K2201/096

    Abstract: A printed wiring board includes a multilayer core substrate, a first buildup layer formed on the multilayer core substrate and including an interlayer insulation layer and a conductive layer, a second buildup layer formed on the multilayer core substrate and including an interlayer resin insulation layer and a conductive layer, and an end-surface through hole conductor formed on side surfaces of the first and second buildup layers and core substrate such that the through hole conductor connects the conductive layers of the first and second buildup layers. The core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer, a first insulation layer between the first and middle conductive layers and a second insulation layer between the second and middle conductive layers, and the middle conductive layer is connected to the through-hole conductor and has thickness greater than thicknesses of the first and second conductive layers.

    Abstract translation: 印刷电路板包括：多层芯基板，形成在所述多层芯基板上并具有层间绝缘层和导电层的第一累积层，形成在所述多层芯基板上的第二累积层，其包括层间树脂绝缘层和 导电层和形成在第一和第二堆积层和芯基板的侧表面上的端表面通孔导体，使得通孔导体连接第一和第二堆积层的导电层。 芯基板包括第一导电层，中间导电层，第二导电层，第一和中间导电层之间的第一绝缘层和第二和中间导电层之间的第二绝缘层，并且中间导电层被连接 并且具有大于第一和第二导电层的厚度的厚度。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    2.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：US20150257268A1

    公开(公告)日：2015-09-10

    申请号：US14640577

    申请日：2015-03-06

    Applicant: IBIDEN CO., LTD.

    Inventor： Katsutoshi KITAGAWA ,  Tomoya Sawamura

    IPC: H05K1/11

    CPC classification number: H05K3/4608 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/007 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0338 ,  H01L2924/00

    Abstract: A printed wiring board includes a core substrate, and a buildup layer formed on the core substrate and including an interlayer resin insulation layer and a conductive layer. The core substrate includes a metal core, a first insulation layer on first surface of the metal core, a first conductive layer on the first insulation layer, a second insulation layer on second surface of the metal core, and a second conductive layer on the second insulation layer, the metal core has a penetrating hole penetrating from the first surface to the second surface and a resin portion filling the penetrating hole, the resin portion includes resin material from the first insulation layer, the core substrate has a through-hole conductor formed in the resin portion through the metal core, the interlayer resin insulation layer has a core material, and the first insulation layer does not have a core material.

    Abstract translation: 印刷电路板包括芯基板和形成在芯基板上并包括层间树脂绝缘层和导电层的堆积层。 芯基板包括金属芯，金属芯的第一表面上的第一绝缘层，第一绝缘层上的第一导电层，金属芯的第二表面上的第二绝缘层，第二绝缘层的第二导电层 所述金属芯具有从所述第一表面到所述第二表面贯穿的贯穿孔，以及填充所述贯通孔的树脂部，所述树脂部包括来自所述第一绝缘层的树脂材料，所述芯基板具有形成为通孔导体 在通过金属芯的树脂部中，层间树脂绝缘层具有芯材，第一绝缘层不具有芯材。

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