中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.03 seconds)

    FLEX-RIGID WIRING BOARD
    1.
    发明申请
    FLEX-RIGID WIRING BOARD 有权
    FLEX-RIGID接线板

    公开(公告)号：US20160095207A1

    公开(公告)日：2016-03-31

    申请号：US14865061

    申请日：2015-09-25

    Applicant: IBIDEN CO., LTD.

    Inventor： Hirotaka TANIGUCHI ,  Dongdong WANG ,  Michimasa TAKAHASHI

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/4691 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/0323 ,  H05K2201/096

    Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.

    Abstract translation: 挠性刚性布线板包括柔性基板，位于柔性基板的第一侧上的第一非柔性基板，位于柔性基板第二侧上的第二非柔性基板，第一绝缘层 柔性基板和第一和第二非柔性基板的表面以及层压在柔性基板的第二表面上的第二绝缘层以及第一和第二非柔性基板。 第一和第二绝缘层中的每一个具有暴露柔性基板的一部分的开口部分，使得柔性基板的该部分形成连接非柔性刚性部分的柔性部分，并且第一和第二非柔性基板包括热 散热部分包括具有高于第一和第二绝缘层的热导率的导热性的散热材料。

    FLEX-RIGID WIRING BOARD
    2.
    发明申请
    FLEX-RIGID WIRING BOARD 审中-公开
    FLEX-RIGID接线板

    公开(公告)号：US20160066429A1

    公开(公告)日：2016-03-03

    申请号：US14837143

    申请日：2015-08-27

    Applicant: IBIDEN CO., LTD.

    Inventor： Hirotaka TANIGUCHI ,  Dongdong WANG ,  Michimasa TAKAHASHI

    IPC: H05K1/18 ,  H05K1/14

    CPC classification number: H05K1/0278 ,  H05K1/0281 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4688 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1184 ,  H05K2203/308

    Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.

    Abstract translation: 挠性刚性布线板包括柔性基材结构，从柔性基材结构的相对端延伸的刚性基材结构，嵌入刚性基材结构中的电子部件，层压在第一表面上的第一堆积层 柔性基材结构和刚性基材结构，并具有暴露柔性基材结构的曝光部分，以及层压在柔性基材结构和刚性基材结构的第二表面上的第二堆积层，并具有露出柔性基体 材料结构。 第一和第二积层形成为使得由第一和第二积聚层的暴露部分暴露的柔性基底材料结构形成可弯曲部分，并且刚性基底材料结构和第一和第二积聚层形成不可弯曲部分 连接到可弯曲部分。

    COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD
    4.
    发明申请
    COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD 有权
    组合接线板和制造组合接线板的方法

    公开(公告)号：US20150085461A1

    公开(公告)日：2015-03-26

    申请号：US14492424

    申请日：2014-09-22

    Applicant: IBIDEN CO., LTD.

    Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI

    IPC: H05K7/10 ,  H05K3/36

    CPC classification number: H05K3/368 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/1484 ,  Y10T29/49126

    Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

    Abstract translation: 一种组合布线板的制造方法，包括：准备多个布线基板，分别准备具有容纳基板的开口部的金属框架，将所述基板分别放置在所述框架的开口部中，并在所述框架内形成多个压接部， 塑性变形使得板的侧壁结合到框架中的开口部分的侧壁。 板的制备包括形成板的侧壁，使得当板被定位在框架的开口部分中时，板的侧壁相对于开口的侧壁形成宽空间部分和窄空间部分 框架中的部分和卷曲部分的形成包括产生变形，使得框架中的开口部分的侧壁在板的宽空间部分之前邻接板的窄空间部分。

    COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD
    5.
    发明申请
    COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD 有权
    组合接线板和制造组合接线板的方法

    公开(公告)号：US20140133111A1

    公开(公告)日：2014-05-15

    申请号：US14077563

    申请日：2013-11-12

    Applicant: IBIDEN CO., LTD.

    Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI

    IPC: H05K1/14 ,  H05K3/00

    CPC classification number: H05K3/00 ,  H05K3/0097 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2203/0169 ,  H05K2203/167 ,  Y10T29/49124

    Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.

    Abstract translation: 一种组合布线板的制造方法，其特征在于，具备：具有容纳开口部的金属框架，将金属框架的容纳开口部配置布线基板，使金属框架发生塑性变形，使布线基板的侧壁成为 连接到金属框架的侧壁在金属框架的容纳开口部分内。

    COMBINED WIRING BOARD
    6.
    发明申请
    COMBINED WIRING BOARD 有权
    组合接线板

    公开(公告)号：US20140133110A1

    公开(公告)日：2014-05-15

    申请号：US14076586

    申请日：2013-11-11

    Applicant: IBIDEN CO., LTD.

    Inventor： Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

    IPC: H05K1/02

    CPC classification number: H05K1/0271 ,  H05K1/14 ,  H05K1/183 ,  H05K3/0097 ,  H05K2201/068 ,  H05K2201/09145 ,  H05K2201/209 ,  H05K2203/0169

    Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.

    Abstract translation: 组合电路板具有多个片状部件，每个部件包括布线板和具有容纳开口部分的框架部件，并且将多个部件保持在容纳开口部分中，使得每个零件部件在外部固定到框架部件 每个零件的边缘。 框架部件在平面方向上具有比多个部件在平面方向上的热膨胀系数高的热膨胀系数。

    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD
    7.
    发明申请
    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD 有权
    FLEX-RIGID接线板及制造柔性线接线板的方法

    公开(公告)号：US20150114689A1

    公开(公告)日：2015-04-30

    申请号：US14522742

    申请日：2014-10-24

    Applicant: IBIDEN Co., Ltd.

    Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI ,  Takashi KARIYA

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

    CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

    Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.

    Abstract translation: 挠性刚性布线板包括柔性基板，非柔性基板，定位成使得非柔性基板在柔性基板的水平方向上延伸;形成在柔性和非柔性基板的第一表面上的第一布线层 嵌入在所述柔性和非柔性基板的第二表面中的第二布线层，覆盖所述柔性和非柔性基板的所述第一表面的第一绝缘层，并且具有暴露柔性基板的第一表面的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二表面的第二绝缘层，并且具有露出柔性基板的第二表面的一部分的开口。 第一布线层包括在柔性和非柔性基板的第一表面上的非嵌入布线，并且第二布线层包括在柔性和非柔性基板的第二表面中的嵌入布线。

    METHOD FOR MANUFACTURING WIRING SUBSTRATE
    9.
    发明申请
    METHOD FOR MANUFACTURING WIRING SUBSTRATE 有权

    公开(公告)号：US20230063719A1

    公开(公告)日：2023-03-02

    申请号：US17822265

    申请日：2022-08-25

    Applicant: IBIDEN CO., LTD.

    Inventor： Michimasa TAKAHASHI ,  Hideyuki GOTO ,  Kiyohiro ISHIKAWA ,  Ayami OHNO

    IPC: H05K3/00 ,  H05K1/11 ,  H05K3/04 ,  H05K3/02 ,  H05K3/26

    Abstract: A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.

Patent Agency Ranking