公开(公告)号：US10338325B1

公开(公告)日：2019-07-02

申请号：US15995559

申请日：2018-06-01

Applicant: International Business Machines Corporation

Inventor： Barnim Alexander Janta-Polczynski ,  Tymon Barwicz ,  Elaine Cyr ,  Nicolas Boyer ,  Marie-Claude Paquet ,  Richard D. Langlois ,  Paul Francis Fortier

IPC: G02B6/42 ,  G02B6/02

Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.

公开(公告)号：US20170196089A1

公开(公告)日：2017-07-06

申请号：US15466442

申请日：2017-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H05K3/30 ,  H01R4/02

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US10368441B2

公开(公告)日：2019-07-30

申请号：US15928874

申请日：2018-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R13/405 ,  H01R43/24 ,  H05K1/18 ,  H01R12/51 ,  H01R43/20 ,  H05K3/30 ,  H01R12/70 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US09627784B1

公开(公告)日：2017-04-18

申请号：US14955466

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R12/51 ,  H01R43/24 ,  H05K1/18 ,  H01R43/20 ,  H05K3/30 ,  H01R13/405

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US20180213645A1

公开(公告)日：2018-07-26

申请号：US15928874

申请日：2018-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H05K3/30 ,  H01R4/02

CPC classification number: H05K1/18 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US09698072B2

公开(公告)日：2017-07-04

申请号：US14925159

申请日：2015-10-28

Applicant: International Business Machines Corporation

Inventor： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC: H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

公开(公告)号：US20160049345A1

公开(公告)日：2016-02-18

申请号：US14925159

申请日：2015-10-28

Applicant: International Business Machines Corporation

Inventor： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

公开(公告)号：US20150255312A1

公开(公告)日：2015-09-10

申请号：US14197280

申请日：2014-03-05

Applicant: International Business Machines Corporation

Inventor： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC: H01L21/56 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

Abstract translation: 本发明一般涉及倒装芯片技术，更具体地说，涉及一种用于减少内部封装应力，改善粘合性能以及通过使用沉积在翻盖的不同区域中的多于一个底部填充材料来降低倒装芯片封装中的热阻的方法和结构 芯片接口。 根据一个实施方案，公开了一种在界面的内部区域中形成第一底部填充物的方法，使得界面的外围区域保持开放，并且在周边区域中形成第二底部填充物。

公开(公告)号：US20130122661A1

公开(公告)日：2013-05-16

申请号：US13736627

申请日：2013-01-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Marie-Claude Paquet ,  Wolfgang Sauter ,  Timothy D. Sullivan

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/743 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00

Abstract: Underfill flow guide structures and methods of using the same are provided with a module. In particular the underfill flow guide structures are integrated with a substrate and are configured to prevent air entrapment from occurring during capillary underfill processes.

Abstract translation: 底部填充流动引导结构及其使用方法具有模块。 特别地，底部填充流动引导结构与基底一体化并且被构造成防止在毛细管底部填充过程期间发生空气滞留。

公开(公告)号：US10750615B2

公开(公告)日：2020-08-18

申请号：US16423565

申请日：2019-05-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H01R12/51 ,  H01R43/20 ,  H05K3/30 ,  H01R12/70 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.