公开(公告)号：US20170025377A1

公开(公告)日：2017-01-26

申请号：US15121855

申请日：2015-02-26

申请人： COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

发明人： Paul GONDCHARTON ,  Lamine BENAISSA ,  Bruno IMBERT ,  Hubert MORICEAU

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/83 ,  H01L21/185 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0381 ,  H01L2224/03845 ,  H01L2224/05073 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/2745 ,  H01L2224/2755 ,  H01L2224/27845 ,  H01L2224/29147 ,  H01L2224/80055 ,  H01L2224/80357 ,  H01L2224/8083 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/8092 ,  H01L2224/80948 ,  H01L2224/83895 ,  H01L2225/06524 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01008 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01017 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2924/049 ,  H01L2924/00012

摘要： A method for producing a structure by direct bonding of two elements, the method including: production of the elements to be assembled and assembly of the elements. The production of the elements to be assembled includes: deposition on a substrate of a TiN layer by physical vapor deposition, and deposition of a copper layer on the TiN layer. The assembly of the elements includes: polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, bringing the surfaces into contact, and storing the structure at atmospheric pressure and at ambient temperature.

摘要翻译： 一种用于通过直接粘合两个元件来生产结构的方法，所述方法包括：生产要组装的元件和元件的组装。 要组装的元件的生产包括：通过物理气相沉积在TiN层的衬底上沉积，并且在TiN层上沉积铜层。 元件的组装包括：抛光意图接触的铜层的表面，使得它们具有小于1nm RMS的粗糙度和亲水性，使表面接触，并将结构储存在大气压和 环境温度。

公开(公告)号：US09922953B2

公开(公告)日：2018-03-20

申请号：US15121855

申请日：2015-02-26

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Paul Gondcharton ,  Lamine Benaissa ,  Bruno Imbert ,  Hubert Moriceau

IPC分类号： H01L21/00 ,  H01L21/47 ,  H01L21/44 ,  H01L23/00 ,  H01L21/18 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/83 ,  H01L21/185 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0381 ,  H01L2224/03845 ,  H01L2224/05073 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/2745 ,  H01L2224/2755 ,  H01L2224/27845 ,  H01L2224/29147 ,  H01L2224/80055 ,  H01L2224/80357 ,  H01L2224/8083 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/8092 ,  H01L2224/80948 ,  H01L2224/83895 ,  H01L2225/06524 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01008 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01017 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2924/049 ,  H01L2924/00012

摘要： A method for producing a structure by direct bonding of two elements, the method including: production of the elements to be assembled and assembly of the elements. The production of the elements to be assembled includes: deposition on a substrate of a TiN layer by physical vapor deposition, and deposition of a copper layer on the TiN layer. The assembly of the elements includes: polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, bringing the surfaces into contact, and storing the structure at atmospheric pressure and at ambient temperature.

公开(公告)号：US09698072B2

公开(公告)日：2017-07-04

申请号：US14925159

申请日：2015-10-28

申请人： International Business Machines Corporation

发明人： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

公开(公告)号：US09373559B2

公开(公告)日：2016-06-21

申请号：US14197280

申请日：2014-03-05

申请人： International Business Machines Corporation

发明人： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

摘要翻译： 本发明一般涉及倒装芯片技术，更具体地说，涉及一种用于减少内部封装应力，改善粘合性能以及通过使用沉积在翻盖的不同区域中的多于一个底部填充材料来降低倒装芯片封装中的热阻的方法和结构 芯片接口。 根据一个实施方案，公开了一种在界面的内部区域中形成第一底部填充物的方法，使得界面的外围区域保持开放，并且在周边区域中形成第二底部填充物。

公开(公告)号：US09142532B2

公开(公告)日：2015-09-22

申请号：US14397038

申请日：2013-04-24

申请人： Tadatomo Suga ,  BONDTECH CO., LTD.

发明人： Tadatomo Suga ,  Akira Yamauchi

IPC分类号： H01L21/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  B23K31/02 ,  B23K37/00 ,  B23K37/04 ,  H01L21/66 ,  H01L25/10 ,  H01L23/10 ,  H01L21/683

CPC分类号： H01L25/0652 ,  B23K31/02 ,  B23K37/00 ,  B23K37/0408 ,  B23K2101/40 ,  H01L21/6836 ,  H01L22/10 ,  H01L23/10 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/74 ,  H01L24/742 ,  H01L24/743 ,  H01L24/75 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0384 ,  H01L2224/03845 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06134 ,  H01L2224/0615 ,  H01L2224/06177 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/09181 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13009 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14134 ,  H01L2224/1415 ,  H01L2224/14177 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27009 ,  H01L2224/2755 ,  H01L2224/27823 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75283 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/7598 ,  H01L2224/80003 ,  H01L2224/8001 ,  H01L2224/80013 ,  H01L2224/80065 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80143 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/8022 ,  H01L2224/8023 ,  H01L2224/80447 ,  H01L2224/8083 ,  H01L2224/80907 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81065 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/8123 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/83002 ,  H01L2224/8301 ,  H01L2224/83013 ,  H01L2224/83048 ,  H01L2224/83051 ,  H01L2224/83065 ,  H01L2224/83091 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83136 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/8322 ,  H01L2224/8323 ,  H01L2224/83234 ,  H01L2224/83355 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2224/83894 ,  H01L2224/83907 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2224/80 ,  H01L2224/83 ,  H01L2924/00

摘要： [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.[Solution] A method for bonding plural chips each having a chip-side-bond-surface having metal regions to a substrate having plural bond portions has the step (S1) of subjecting the metal regions of the chip-side-bond-surface to surface activating treatment and hydrophilizing treatment; the step (S2) of subjecting the bond portions of the substrate to surface activating treatment and hydrophilizing treatment; the step (S3) of fitting the chips subjected to the surface activating treatment and the hydrophilizing treatment onto the corresponding bond portions of the substrate subjected to the surface activating treatment and the hydrophilizing treatment to bring the metal regions of the chips into contact with the bond portions of the substrate; and the step (S4) of heating the resultant structure, which includes the substrate, and the chips fitted onto the substrate.

摘要翻译： [问题]提供了一种将芯片有效地接合到晶片上以建立电连接并提高芯片和晶片之间或芯片之间的机械强度的技术，该芯片是在树脂和其它不期望的残留物的状态下彼此层压的芯片 不保留在它们之间的结合界面上。 [解决方案]将具有金属区域的具有芯片侧接合面的多个芯片接合到具有多个结合部的基板的方法具有将芯片侧接合面的金属区域 表面活化处理和亲水处理; 对所述基板的所述接合部进行表面活化处理和亲水化处理的工序（S2） 将经过表面活化处理和亲水化处理的芯片装配到经过表面活化处理的基板的相应接合部分和亲水化处理上以使芯片的金属区域与键接触的步骤（S3） 基板的一部分; 以及加热包括基板的所得结构和安装在基板上的芯片的步骤（S4）。

公开(公告)号：US5891366A

公开(公告)日：1999-04-06

申请号：US765071

申请日：1996-12-27

申请人： Werner Gruenwald ,  Ralf Haug ,  Thomas Burkhart ,  Martin Mennig ,  Helmut Schmidt ,  Monika Schneider

发明人： Werner Gruenwald ,  Ralf Haug ,  Thomas Burkhart ,  Martin Mennig ,  Helmut Schmidt ,  Monika Schneider

IPC分类号： C04B35/46 ,  C04B35/468 ,  C09J9/02 ,  C09J201/00 ,  C09J201/04 ,  H01B1/22 ,  H01B3/12 ,  H01G4/12 ,  H01L21/60 ,  H01R11/01 ,  H05K3/32 ,  B32B31/26 ,  B32B31/28

CPC分类号： H05K3/323 ,  C04B35/468 ,  C09J9/02 ,  C23C18/14 ,  H01G4/1227 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2755 ,  H01L2224/278 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10674 ,  H05K2203/107

摘要： An anisotropically conducting adhesive includes a thermoplastic base material; and particles which include metal particles and metal ions, which are electrically conductive, and which are finely distributed within the thermoplastic base material below a percolation threshold, wherein the particles are enriched in certain regions under the influence of exposure to at least one of light and heat. A process for producing an anisotropically conducting adhesive includes providing a material comprised of thermoplastic base material in which electrically conductive particles including metal particles and metal ions are dispersed; and exposing the material to at least one of light and heat in predetermined regions in a targeted manner so that a targeted local heating occurs in the exposed regions and an increased mobility of the metal particles and metal ions occurs which is effective to provide a plurality of anisotropically electrically conductive paths having an enriched amount of the electrically conductive particles compared to that of adjacent regions, wherein the metal ions contribute to the formation of the plurality of anisotropically electrically conductive paths by undergoing reduction from the metal ion to the metal.

摘要翻译： PCT No.PCT / DE95 / 00769 Sec。 371日期1996年12月27日第 102（e）日期1996年12月27日PCT归档1995年6月16日PCT公布。 公开号WO96 / 00969 日期1996年1月11日各向异性导电粘合剂包括热塑性基材; 以及包括金属颗粒和金属离子的颗粒，它们是导电的，并且在渗透阈值以下精细地分布在热塑性基材内部，其中颗粒在暴露于光和 热。 制造各向异性导电粘合剂的方法包括提供由热塑性基材构成的材料，其中分散有金属颗粒和金属离子的导电颗粒; 并且以目标方式将材料暴露于预定区域中的光和热中的至少一种，使得在暴露区域中发生目标局部加热，并且发生金属颗粒和金属离子的增加的迁移率，这有助于提供多个 各向异性导电路径具有与相邻区域相比富集的导电颗粒的量，其中金属离子有助于通过从金属离子还原成金属来形成多个各向异性导电路径。

公开(公告)号：US20230215852A1

公开(公告)日：2023-07-06

申请号：US18073398

申请日：2022-12-01

申请人： LG Display Co., Ltd.

发明人： Byonghoo Kim ,  DaeHeung Lee ,  JuHyuk Kim ,  Aram Sohn ,  Sumin Lee

IPC分类号： H01L25/16 ,  H01L23/00

CPC分类号： H01L25/167 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27515 ,  H01L2224/2755 ,  H01L2224/27502 ,  H01L2224/2747 ,  H01L2224/29018 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2924/12041

摘要： Embodiments of the present disclosure relate to a display device and a method of manufacturing the same. More specifically, there may be provided includes a display device including an adhesive layer which includes a first portion and a second portion, wherein the first portion has higher adhesion than the second portion, and the second portion has lower adhesion than the first portion and includes high refractive particles so that a manufacturing process is simplified, and a method of manufacturing the same.

公开(公告)号：US20180277510A1

公开(公告)日：2018-09-27

申请号：US15813676

申请日：2017-11-15

申请人： International Business Machines Corporation

发明人： ERIC J. CAMPBELL ,  SARAH K. CZAPLEWSKI ,  ELIN LABRECK ,  JENNIFER I. PORTO

IPC分类号： H01L23/00 ,  C09K5/10 ,  H01L23/373 ,  H01L23/367

CPC分类号： H01L24/83 ,  C09K5/10 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2755 ,  H01L2224/2783 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83874 ,  H01L2224/83986 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/1434 ,  H01L2924/20211 ,  H01L2924/20212 ,  H01L2924/20213 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0625

摘要： A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

公开(公告)号：US20160049345A1

公开(公告)日：2016-02-18

申请号：US14925159

申请日：2015-10-28

申请人： International Business Machines Corporation

发明人： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498

CPC分类号： H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

公开(公告)号：US20150255312A1

公开(公告)日：2015-09-10

申请号：US14197280

申请日：2014-03-05

申请人： International Business Machines Corporation

发明人： Peter J. Brofman ,  Marie-Claude Paquet ,  Julien Sylvestre

IPC分类号： H01L21/56 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L23/3142 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2732 ,  H01L2224/2755 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83947 ,  H01L2224/83951 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.

摘要翻译： 本发明一般涉及倒装芯片技术，更具体地说，涉及一种用于减少内部封装应力，改善粘合性能以及通过使用沉积在翻盖的不同区域中的多于一个底部填充材料来降低倒装芯片封装中的热阻的方法和结构 芯片接口。 根据一个实施方案，公开了一种在界面的内部区域中形成第一底部填充物的方法，使得界面的外围区域保持开放，并且在周边区域中形成第二底部填充物。