Schottky tunneling device
    1.
    发明授权
    Schottky tunneling device 失效
    肖特基隧道装置

    公开(公告)号:US5962893A

    公开(公告)日:1999-10-05

    申请号:US586277

    申请日:1996-01-16

    摘要: An n-semiconductor layer is arranged on a low-resistance n-substrate. A drain electrode is in ohmic contact with the n-substrate. A source electrode forms a Schottky junction with the n-semiconductor layer. A gate electrode is arranged adjacent to the source electrode on the n-semiconductor layer through a gate insulating film. When a voltage is applied to the gate electrode to lower the Schottky barrier height at the interface between the source electrode and the n-semiconductor layer, electrons are injected from the source electrode into the n-semiconductor layer, and a current flows in the semiconductor device. A diffusion layer which prevents a decrease in manufacturing time is not required to form in the n-semiconductor layer, and a channel which causes an increase in ON state voltage is not present.

    摘要翻译: 在低电阻n衬底上设置n半导体层。 漏电极与n衬底欧姆接触。 源电极与n半导体层形成肖特基结。 栅极通过栅极绝缘膜与n型半导体层上的源电极相邻设置。 当向栅电极施加电压以降低源电极和n半导体层之间的界面处的肖特基势垒高度时,电子从源电极注入到n半导体层中,并且电流在半导体 设备。 不需要在n半导体层中形成防止制造时间的降低的扩散层,并且不存在导致ON状态电压增加的沟道。

    Insulated-gate thyristor
    3.
    发明授权
    Insulated-gate thyristor 失效
    绝缘栅晶闸管

    公开(公告)号:US06236069B1

    公开(公告)日:2001-05-22

    申请号:US09102360

    申请日:1998-06-23

    IPC分类号: H01L2974

    摘要: Disclosed herein is an insulated-gate thyristor comprising a base layer of a first conductivity type, having first and second major surfaces, a first main-electrode region of the first conductivity type, formed in the first major surface of the base layer, a second main-electrode region of a second conductivity type, formed in the second major surface of the base layer, at least a pair of grooves extending from the first main-electrode region into the base layer, and opposing each other and spaced apart by a predetermined distance, insulated gate electrodes formed within the grooves, and a turn-off insulated-gate transistor structure for releasing carriers of the second conductivity type from the base layer.

    摘要翻译: 本文公开了一种绝缘栅极晶闸管,其包括第一导电类型的基极层,具有第一和第二主表面,形成在基底层的第一主表面中的第一导电类型的第一主电极区域,第二导电类型的第二主表面 形成在基底层的第二主表面的第二导电类型的主电极区域,至少一对从第一主电极区域延伸到基底层中并且彼此相对并间隔开预定的凹槽 距离,形成在沟槽内的绝缘栅电极,以及用于从基层释放第二导电类型的载流子的关断绝缘栅晶体管结构。

    Insulated-gate thyristor
    4.
    发明授权
    Insulated-gate thyristor 失效
    绝缘栅晶闸管

    公开(公告)号:US5464994A

    公开(公告)日:1995-11-07

    申请号:US291754

    申请日:1994-08-16

    摘要: Disclosed herein is an insulated-gate thyristor comprising a base layer of a first conductivity type, having first and second major surfaces, a first main-electrode region of the first conductivity type, formed in the first major surface of the base layer, a second main-electrode region of a second conductivity type, formed in the second major surface of the base layer, at least a pair of grooves extending from the first main-electrode region into the base layer, and opposing each other and spaced apart by a predetermined distance, insulated gate electrodes formed within the grooves, and a turn-off insulated-gate transistor structure for releasing carriers of the second conductivity type from the base layer.

    摘要翻译: 本文公开了一种绝缘栅极晶闸管,其包括第一导电类型的基极层,具有第一和第二主表面,形成在基底层的第一主表面中的第一导电类型的第一主电极区域,第二导电类型的第二主表面 形成在基底层的第二主表面的第二导电类型的主电极区域,至少一对从第一主电极区域延伸到基底层中并且彼此相对并间隔开预定的凹槽 距离,形成在沟槽内的绝缘栅电极,以及用于从基层释放第二导电类型的载流子的关断绝缘栅晶体管结构。

    Semiconductor device and method of manufacturing the same
    5.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US07238576B2

    公开(公告)日:2007-07-03

    申请号:US10403122

    申请日:2003-04-01

    IPC分类号: H01L21/336

    摘要: A semiconductor device comprises a drain layer of first conductivity type, drift layers of first and second conductivity types on the drain layer, an insulating film between the drift layers and contacting the drift layers, a first base layer of second conductivity type on a surface of the drift layer of first conductivity type, a source layer of first conductivity type selectively provided on a surface of the first base layer of second conductivity type, a gate insulating film on the first base layer of second conductivity type between the source layer and the drift layer, a gate electrode on the gate insulating film, a second base layer of second conductivity type on a surface of the drift layer, a first main electrode on the drain layer, and a second main electrode on the source layer, the first base layer and the second base layer.

    摘要翻译: 半导体器件包括第一导电类型的漏极层,漏极层上的第一和第二导电类型的漂移层,漂移层之间的绝缘膜和与漂移层接触的第二导电类型的第一基底层, 第一导电类型的漂移层,选择性地设置在第二导电类型的第一基极层的表面上的第一导电类型的源极层,在源极层和漂移体之间的第二导电类型的第一基极层上的栅极绝缘膜 栅极绝缘膜上的栅电极,漂移层的表面上的第二导电类型的第二基极层,漏极层上的第一主电极和源极层上的第二主电极,第一基极层 和第二基层。

    High withstand voltage semiconductor device
    6.
    发明授权
    High withstand voltage semiconductor device 失效
    高耐压半导体器件

    公开(公告)号:US5969400A

    公开(公告)日:1999-10-19

    申请号:US614340

    申请日:1996-03-12

    摘要: A semiconductor device includes a first semiconductor layer of a first conductivity type having first and second main surfaces, a second semiconductor layer of a second conductivity type selectively formed on the first main surface of the first semiconductor layer, the second semiconductor layer including a first region having a relatively high injection efficiency and a second region having a relatively low injection efficiency and the first region being surrounded by the second region, a third semiconductor layer of the first conductivity type formed on the second main surface of the first semiconductor layer, a first electrode selectively formed on the second semiconductor layer of the second conductivity type and connected to at least the first region, and a second electrode formed on the third semiconductor layer of the first conductivity type.

    摘要翻译: 半导体器件包括具有第一和第二主表面的第一导电类型的第一半导体层,选择性地形成在第一半导体层的第一主表面上的第二导电类型的第二半导体层,第二半导体层包括第一区域 具有相对较高的注入效率和具有相对低的注入效率的第二区域,并且第一区域被第二区域包围,形成在第一半导体层的第二主表面上的第一导电类型的第三半导体层,第一 电极选择性地形成在第二导电类型的第二半导体层上并连接到至少第一区域,第二电极形成在第一导电类型的第三半导体层上。

    Semiconductor device
    8.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US09029869B2

    公开(公告)日:2015-05-12

    申请号:US13034264

    申请日:2011-02-24

    摘要: One embodiment of a semiconductor device includes: a silicon carbide substrate including first and second principal surfaces; a first-conductive-type silicon carbide layer on the first principal surface; a second-conductive-type first silicon carbide region at a surface of the first silicon carbide layer; a first-conductive-type second silicon carbide region at the surface of the first silicon carbide region; a second-conductive-type third silicon carbide region at the surface of the first silicon carbide region; a second-conductive-type fourth silicon carbide region formed between the first silicon carbide region and the second silicon carbide region, and having an impurity concentration higher than that of the first silicon carbide region; a gate insulator; a gate electrode formed on the gate insulator; an inter-layer insulator; a first electrode connected to the second silicon carbide region and the third silicon carbide region; and a second electrode on the second principal surface.

    摘要翻译: 半导体器件的一个实施例包括:包含第一和第二主表面的碳化硅衬底; 第一主表面上的第一导电型碳化硅层; 在所述第一碳化硅层的表面处的第二导电型第一碳化硅区域; 在第一碳化硅区域的表面处的第一导电型第二碳化硅区域; 在第一碳化硅区域的表面处的第二导电型第三碳化硅区域; 在第一碳化硅区域和第二碳化硅区域之间形成的杂质浓度高于第一碳化硅区域的第二导电型第四碳化硅区域; 栅极绝缘体; 形成在栅极绝缘体上的栅电极; 层间绝缘体; 连接到所述第二碳化硅区域和所述第三碳化硅区域的第一电极; 和在第二主表面上的第二电极。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US08569795B2

    公开(公告)日:2013-10-29

    申请号:US13217472

    申请日:2011-08-25

    摘要: A semiconductor device of an embodiment includes: a silicon carbide substrate including first and second principal surfaces; a first conductive-type first silicon carbide layer provided on the first principal surface of the silicon carbide substrate; a second conductive-type first silicon carbide region formed on a surface of the first silicon carbide layer; a first conductive-type second silicon carbide region formed on a surface of the first silicon carbide region; a second conductive-type third silicon carbide region formed on the surface of the first silicon carbide region; a gate insulating film continuously formed on the surfaces of the first silicon carbide layer, the first silicon carbide region, and the second silicon carbide region; a first electrode formed of silicon carbide formed on the gate insulating film; a second electrode formed on the first electrode; an interlayer insulating film for covering the first and second electrodes; a third electrode electrically connected to the second silicon carbide region and the third silicon carbide region; and a fourth electrode formed on the second principal surface of the silicon carbide substrate.

    摘要翻译: 实施例的半导体器件包括:碳化硅衬底,其包括第一和第二主表面; 设置在碳化硅衬底的第一主表面上的第一导电型第一碳化硅层; 形成在所述第一碳化硅层的表面上的第二导电型第一碳化硅区; 形成在所述第一碳化硅区域的表面上的第一导电型第二碳化硅区域; 形成在所述第一碳化硅区域的表面上的第二导电型第三碳化硅区域; 连续形成在所述第一碳化硅层,所述第一碳化硅区域和所述第二碳化硅区域的表面上的栅极绝缘膜; 形成在所述栅极绝缘膜上的由碳化硅形成的第一电极; 形成在第一电极上的第二电极; 用于覆盖第一和第二电极的层间绝缘膜; 电连接到第二碳化硅区域和第三碳化硅区域的第三电极; 以及形成在碳化硅衬底的第二主表面上的第四电极。

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20130137253A1

    公开(公告)日:2013-05-30

    申请号:US13705610

    申请日:2012-12-05

    IPC分类号: H01L21/04

    摘要: A semiconductor device includes: a silicon carbide substrate having first and second main surfaces; a first silicon carbide layer provided on the first main surface of the silicon carbide substrate; first silicon carbide regions formed on a surface of the first silicon carbide layer; second and third silicon carbide regions formed on respective surfaces of the first silicon carbide regions; a fourth silicon carbide region formed between facing first silicon carbide regions with the first silicon carbide layer therebetween; a gate insulating film formed continuously on surfaces of the first silicon carbide regions, the first silicon carbide layer, and the fourth silicon carbide region; a gate electrode formed on the gate insulating film; an interlayer insulating film covering the gate electrode; a first electrode electrically connected to the second and third silicon carbide regions; and a second electrode formed on the second main surface of the silicon carbide substrate.

    摘要翻译: 半导体器件包括:具有第一和第二主表面的碳化硅衬底; 设置在所述碳化硅衬底的所述第一主表面上的第一碳化硅层; 第一碳化硅区域形成在第一碳化硅层的表面上; 形成在第一碳化硅区域的相应表面上的第二和第三碳化硅区域; 形成在面对的第一碳化硅区域之间的第四碳化硅区域,其间具有第一碳化硅层; 在第一碳化硅区域,第一碳化硅层和第四碳化硅区域的表面上连续形成的栅极绝缘膜; 形成在栅极绝缘膜上的栅电极; 覆盖栅电极的层间绝缘膜; 电连接到第二和第三碳化硅区域的第一电极; 以及形成在碳化硅衬底的第二主表面上的第二电极。