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    RESIN SHEET, METHOD OF PRODUCING THE SAME AND THROUGH-HOLE FORMING APPARATUS
    1.
    发明申请
    RESIN SHEET, METHOD OF PRODUCING THE SAME AND THROUGH-HOLE FORMING APPARATUS 审中-公开
    树脂片，其制造方法和通孔形成装置

    公开(公告)号：US20130029091A1

    公开(公告)日：2013-01-31

    申请号：US13546604

    申请日：2012-07-11

    申请人： Ichiro Suehiro

    发明人： Ichiro Suehiro

    IPC分类号： B28B1/48

    CPC分类号： B26F1/14 ,  Y10T428/24273

    摘要： A method of producing a resin sheet includes the steps of arranging a resin sheet between a substrate and a die opposed to the substrate, and forming a through-hole in the resin sheet to pass through the resin sheet in a pressing direction by relatively pressing the die against the substrate. The die includes a first protrusion protruding toward a downstream side in the pressing direction. A second protrusion protruding toward the downstream side in the pressing direction is formed on a peripheral edge portion of an end portion of the first protrusion on the downstream side in the pressing direction. An end portion of the second protrusion on the downstream side in the pressing direction is formed at an acute angle in sectional view along the pressing direction.

    摘要翻译： 制造树脂片的方法包括以下步骤：在与基板相对的基板和模具之间布置树脂片，并且在树脂片中形成通孔，以通过相对地按压 冲击基板。 模具包括朝向按压方向的下游侧突出的第一突起。 在按压方向的下游侧的第一突起的端部的周缘部形成有朝向按压方向的下游侧突出的第二突起。 沿按压方向的下游侧的第二突起的端部沿着按压方向以截面图形成锐角。

    Microlens array
    2.
    发明授权
    Microlens array 有权
    微透镜阵列

    公开(公告)号：US08021756B2

    公开(公告)日：2011-09-20

    申请号：US12547136

    申请日：2009-08-25

    申请人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

    发明人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

    IPC分类号： B32B9/04

    CPC分类号： B29D11/00365 ,  G02B1/041 ,  G02B3/0031 ,  Y10T428/31663 ,  C08L83/14

    摘要： The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

    摘要翻译： 本发明提供一种微透镜阵列，其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示 烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

    Encapsulating sheet for optical semiconductor
    7.
    发明授权
    Encapsulating sheet for optical semiconductor 失效
    光学半导体封装片

    公开(公告)号：US08558273B2

    公开(公告)日：2013-10-15

    申请号：US13153903

    申请日：2011-06-06

    申请人： Hirokazu Matsuda ,  Ichiro Suehiro

    发明人： Hirokazu Matsuda ,  Ichiro Suehiro

    IPC分类号： H01L33/00

    CPC分类号： H01L33/50 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10T428/24752 ,  H01L2924/00014

    摘要： The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.

    摘要翻译： 本发明涉及一种用于光学半导体的封装片，包括：含有荧光粉的含磷光体层; 以及包含树脂密封层的层压在所述含磷层上的包封树脂层，其中，所述含磷层的边缘在所述层叠表面上从所述密封树脂层的边缘突出，突出长度 的含磷层的厚度为封装树脂层的1〜10倍。

    Direct-type backlight
    10.
    发明授权
    Direct-type backlight 失效
    直接型背光

    公开(公告)号：US07290902B2

    公开(公告)日：2007-11-06

    申请号：US11105397

    申请日：2005-04-14

    申请人： Ichiro Suehiro ,  Yuji Hotta ,  Naoki Sadayori ,  Noriaki Harada ,  Kazuki Uawada

    发明人： Ichiro Suehiro ,  Yuji Hotta ,  Naoki Sadayori ,  Noriaki Harada ,  Kazuki Uawada

    IPC分类号： F21V7/00

    CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L2933/0091 ,  Y10S362/80

    摘要： The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.

    摘要翻译： 本发明提供一种直接型背光源，具有：具有至少一个树脂层的树脂密封构件，该树脂层具有形成在树脂密封构件的最外表面上的光反射部分; 由树脂密封构件密封的光学半导体元件; 以及同心地形成在树脂层的至少一个表面上的多个圆形光散射槽，其中中心的圆的面积和各个同心圆之间的面积基本相同。