公开(公告)号：US20160020160A1

公开(公告)日：2016-01-21

申请号：US14337977

申请日：2014-07-22

申请人： International Business Machines Corporation

发明人： Daniel J. BUVID ,  Eric J. CAMPBELL ,  Tyler JANDT ,  Joseph KUCZYNSKI

IPC分类号： H01L23/31 ,  H01L23/367

CPC分类号： H01L23/3107 ,  H01L23/29 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L23/367 ,  H01L23/373 ,  H01L23/44 ,  H01L23/473 ,  H01L23/564 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05009 ,  H01L2224/11821 ,  H01L2224/11823 ,  H01L2224/11826 ,  H01L2224/11827 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/742 ,  H01L2224/8192 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/181 ,  H05K1/0203 ,  H05K7/20236 ,  H05K2201/064 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/01048 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.

摘要翻译： 公开了采用具有疏水涂层的半导体芯片的器件以及相关的冷却方法。 器件可以包括通过电接触元件电耦合到衬底的至少一个半导体管芯。 在操作期间，半导体管芯和电接触元件产生热量。 通过向半导体管芯和电接触元件施加疏水涂层，可以使用冷却流体来直接冷却半导体管芯和电接触元件，以将这些部件保持在温度范围内并且没有电短路和腐蚀。 以这种方式，半导体管芯和相关联的电接触元件可以被冷却以避免产生有害的局部热点和温度敏感的半导体性能问题。

公开(公告)号：US20190178883A1

公开(公告)日：2019-06-13

申请号：US16280564

申请日：2019-02-20

申请人： International Business Machines Corporation

发明人： Daniel J. BUVID ,  Eric J. CAMPBELL ,  Sarah K. CZAPLEWSKI ,  Christopher W. STEFFEN

IPC分类号： G01N33/543 ,  G01N33/558

摘要： According to an embodiment, a method of producing (e.g., making) a membrane for detecting toxic shock syndrome toxins includes depositing a second antibody on a first zone of the membrane. The second antibody is reactive with an antibody complex to cause a first indication. The antibody complex includes a first antibody coupled to a TSST-1 antigen. The method also includes depositing a third antibody on a second zone of the membrane. The third antibody is reactive with a fourth antibody to cause a second indication.

公开(公告)号：US20180050256A1

公开(公告)日：2018-02-22

申请号：US15241319

申请日：2016-08-19

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Daniel J. BUVID ,  Eric J. CAMPBELL ,  Sarah K. CZAPLEWSKI ,  Christopher W. STEFFEN

IPC分类号： A63B71/06 ,  G06T19/00 ,  G06F3/00 ,  G06T13/40 ,  A63B22/02 ,  A63B24/00

CPC分类号： A63B71/0622 ,  A63B22/02 ,  A63B24/0087 ,  A63B2022/0271 ,  A63B2071/0638 ,  A63B2071/0647 ,  A63B2220/30 ,  A63B2220/51 ,  A63B2220/80 ,  G06F3/005 ,  G06T13/40 ,  G06T19/00 ,  G06T19/006

摘要： Embodiments herein describe techniques for operating an omnidirectional treadmill, the techniques include receiving VR (virtual reality) topographical information comprising a VR environment, and displaying the VR environment to a user wearing a headset. VR topographical information includes information about VR elements in front of the user in the VR environment relative to a facing direction of the user in the VR environment. The method includes sending topographical signals to active elements in an omnidirectional treadmill based upon the VR topographical information where the omnidirectional treadmill permits the user to move along at least two perpendicular directions of motion on a surface of the omnidirectional treadmill. The techniques include activating the active elements, based upon the VR topographical signals, to physically simulate the VR elements in the VR topographical information on the surface by at least one of expanding or contracting the active elements.

公开(公告)号：US20160381830A1

公开(公告)日：2016-12-29

申请号：US14751039

申请日：2015-06-25

申请人： International Business Machines Corporation

发明人： Daniel J. BUVID ,  Eric J. CAMPBELL ,  Tyler JANDT ,  Joseph KUCZYNSKI

IPC分类号： H05K7/20

CPC分类号： H05K7/20618 ,  H05K7/20718 ,  H05K7/20836

摘要： Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

公开(公告)号：US20160378124A1

公开(公告)日：2016-12-29

申请号：US14751046

申请日：2015-06-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Daniel J. BUVID ,  Eric J. CAMPBELL ,  Tyler JANDT ,  Joseph KUCZYNSKI

IPC分类号： G05D7/06 ,  G05D23/19 ,  H05K7/20

CPC分类号： H05K7/20836 ,  G05D23/192 ,  G06F1/20 ,  H05K7/20181 ,  H05K7/20727

摘要： Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

摘要翻译： 本公开的实施例一般涉及电子设备的热管理和调节。 微流体通道用于主动地改变表面的空气动力学，其可以允许将表面纹理从平面改变为凸起或凹凸，或从开放到闭合的能力。 表面纹理的变化影响流过或超过表面的流体流动，从而允许对表面进行热调节。 热调节系统还通过其上具有多个活动穿孔的涂层或层来进一步控制通过电子装置的流体流动。 主动穿孔可以打开和关闭以增加和减少到系统的空气入口，以帮助平衡系统中的背压并将气流重定向到更敏感的系统部件。 主动穿孔可以根据位置和系统部件利用率单独打开和/或关闭。