公开(公告)号：US07518231B2

公开(公告)日：2009-04-14

申请号：US11203861

申请日：2005-08-15

申请人： James Dietz ,  Petros Negussu ,  Thoai Thai Le

发明人： James Dietz ,  Petros Negussu ,  Thoai Thai Le

IPC分类号： H01L23/12

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package comprising at least a first die and a second die, wherein each die comprises an integrated circuit (IC) disposed thereon. Each of the first die and the second die comprise a plurality of contact pads coupled with the respective IC. The contact pads on the first IC comprise a first mode pad coupled to a first device formed on the first die, and the contact pads on the second IC comprise a second mode pad coupled to a second device formed on the second die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first and second mode are selected based on the relative position of the first and second die.

摘要翻译： 一种包括至少第一管芯和第二管芯的多芯片封装，其中每个管芯包括设置在其上的集成电路（IC）。 第一管芯和第二管芯中的每一个包括与相应的IC耦合的多个接触焊盘。 第一IC上的接触焊盘包括耦合到形成在第一裸片上的第一器件的第一模式焊盘，并且第二IC上的接触焊盘包括耦合到形成在第二裸片上的第二器件的第二模式焊盘。 第一模式焊盘耦合到第一电位并使第一器件以第一模式工作。 第二模式焊盘耦合到第二电位并使第二装置在第二模式下操作。 基于第一和第二管芯的相对位置来选择第一和第二模式。

公开(公告)号：US20070035007A1

公开(公告)日：2007-02-15

申请号：US11203861

申请日：2005-08-15

申请人： James Dietz ,  Petros Negussu ,  Thoai Le

发明人： James Dietz ,  Petros Negussu ,  Thoai Le

IPC分类号： H01L23/12

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package comprises a first die comprising a first integrated circuit and a second die comprising a second integrated circuit. A first plurality of contact pads disposed on the first die are coupled to the first integrated circuit, wherein the first plurality of contact pads comprises a first mode pad coupled to a first device formed on the first die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. A second plurality of contact pads disposed on the second die are coupled to the second integrated circuit. The second plurality of contact pads comprises a second mode pad coupled to a second device formed on the second die. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first mode and the second mode are selected based on the relative position of the first die and the second die.

摘要翻译： 多芯片封装包括包括第一集成电路的第一管芯和包括第二集成电路的第二管芯。 设置在第一裸片上的第一组多个接触焊盘耦合到第一集成电路，其中第一组多个接触焊盘包括耦合到形成在第一裸片上的第一器件的第一模式焊盘。 第一模式焊盘耦合到第一电位并使第一器件以第一模式工作。 设置在第二管芯上的第二多个接触焊盘被耦合到第二集成电路。 第二多个接触焊盘包括耦合到形成在第二管芯上的第二器件的第二模式焊盘。 第二模式焊盘耦合到第二电位，并使第二装置在第二模式下操作。 第一模式和第二模式基于第一模具和第二模具的相对位置来选择。

公开(公告)号：US08555705B2

公开(公告)日：2013-10-15

申请号：US13171434

申请日：2011-06-28

申请人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, Jr.

发明人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, Jr.

IPC分类号： G01N33/487

CPC分类号： G01N33/00 ,  F17C11/00 ,  G01F15/063 ,  G01F22/02 ,  G01F23/0076 ,  G01M3/32 ,  G01M3/3236 ,  G06Q10/087 ,  G06Q30/04 ,  G06Q50/04 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/10 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K1/185 ,  H05K3/4602 ,  H05K2203/0165 ,  H05K2203/085 ,  H05K2203/1469 ,  Y02P90/30 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/53183 ,  H01L2224/45099

摘要： A monitoring system for monitoring fluid in a fluid supply vessel during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor and display operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.

公开(公告)号：US06581623B1

公开(公告)日：2003-06-24

申请号：US09562300

申请日：2000-05-01

申请人： Kent Carpenter ,  James Dietz

发明人： Kent Carpenter ,  James Dietz

IPC分类号： F17C1304

CPC分类号： G05D7/0658 ,  B01D53/0454 ,  F17C9/00 ,  F17C13/02 ,  F17C13/045 ,  F17C2205/0142 ,  F17C2205/0146 ,  F17C2205/0323 ,  F17C2205/0326 ,  F17C2205/0329 ,  F17C2223/0123 ,  F17C2223/038 ,  F17C2227/042 ,  F17C2250/032 ,  F17C2250/034 ,  F17C2250/0439 ,  F17C2250/0636 ,  F17C2265/06 ,  F17C2270/0518 ,  F17C2270/0545 ,  Y10T137/0324 ,  Y10T137/2569 ,  Y10T137/2579 ,  Y10T137/2594 ,  Y10T137/2657 ,  Y10T137/7759 ,  Y10T137/7761 ,  Y10T137/87249 ,  Y10T137/87539 ,  Y10T137/8803

摘要： An auto-switching sub-atmospheric pressure gas delivery system, for dispensing gas to a gas-consuming process unit, e.g., a semiconductor manufacturing tool, without the occurrence of pressure spikes or flow perturbations.

摘要翻译： 一种用于将气体分配到诸如半导体制造工具的耗气处理单元而不发生压力尖峰或流动扰动的自动切换次大气压气体输送系统。

公开(公告)号：US06302139B1

公开(公告)日：2001-10-16

申请号：US09356020

申请日：1999-07-16

申请人： James Dietz

发明人： James Dietz

IPC分类号： B08B9027

CPC分类号： F17C9/00 ,  B01D53/0454 ,  F17C13/02 ,  F17C13/045 ,  F17C2205/0146 ,  F17C2223/038 ,  F17C2227/0135 ,  F17C2227/044 ,  F17C2250/032 ,  F17C2250/034 ,  F17C2250/043 ,  F17C2250/0443 ,  F17C2250/072 ,  F17C2270/0518 ,  Y10T137/0419 ,  Y10T137/4259 ,  Y10T137/87249

摘要： An auto-switching sub-atmospheric pressure gas delivery system, for dispensing gas to a gas-consuming process unit, e.g., a semiconductor manufacturing tool. The gas delivery system uses a multiplicity of gas panels, wherein one panel is in active gas dispensing mode and supplying gas from a sub-atmospheric pressure gas source coupled to the flow circuitry of the panel. During the active gas dispensing operation in such panel, a second gas panel of the system undergoes purge, evacuation and fill transition to active gas dispensing condition, to permit switching to the second panel upon exhaustion of the sub-atmospheric pressure gas source coupled to the first gas panel without the occurrence of pressure spikes or flow perturbations.

摘要翻译： 一种用于将气体分配到诸如半导体制造工具的耗气处理单元的自动切换次大气压气体输送系统。 气体输送系统使用多个气体面板，其中一个面板处于主动气体分配模式并且从耦合到面板的流动回路的次级大气压气体源供应气体。 在这种面板中的活性气体分配操作期间，系统的第二气体面板经过吹扫，排空和填充过渡到活性气体分配条件，以便在连接到 第一个气体面板，没有发生压力尖峰或流动扰动。

公开(公告)号：US20100154835A1

公开(公告)日：2010-06-24

申请号：US12298727

申请日：2007-04-26

申请人： Frank Dimeo ,  James Dietz ,  Karl W. Olander ,  Robert Kaim ,  Steven Bishop ,  Jeffrey W. Neuner ,  Jose Arno ,  Paul J. Marganski ,  Joseph D. Sweeney ,  David Eldridge ,  Sharad Yedave ,  Oleg Byl ,  Gregory T. Stauf

发明人： Frank Dimeo ,  James Dietz ,  Karl W. Olander ,  Robert Kaim ,  Steven Bishop ,  Jeffrey W. Neuner ,  Jose Arno ,  Paul J. Marganski ,  Joseph D. Sweeney ,  David Eldridge ,  Sharad Yedave ,  Oleg Byl ,  Gregory T. Stauf

IPC分类号： B08B5/00

CPC分类号： C23C14/564 ,  C23C16/4405 ,  H01J37/32412 ,  H01J37/32862

摘要： A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas-phase reactive materials utilized comprise gaseous compounds such as XeF2, XeF4, XeF6, NF3, IF5, IF7, SF6, C2F6, F2, CF4, KrF2, Cl2, HCl, ClF3, ClO2, N2F4, N2F2, N3F, NFH2, NH2F, HOBr, Br2, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, COF2, HF, C2HF5, C2H2F4, C2H3F3, C2H4F2, C2H5F, C3F6, and organochlorides such as COCl2, CCl4, CHCl3, CH2Cl2 and CH3Cl.

摘要翻译： 一种清洁残留物的方法和装置，用于制造微电子装置中使用的半导体处理系统的组件。 为了有效地除去残留物，将组分与气相反应性材料接触足够的时间和足够的条件以至少部分地除去残余物。 当残留物和构成组分的材料不同时，气相反应性材料与残余物选择性反应，并与构成离子注入机的组分的材料具有最低的反应性。 当残留物和构成组分的材料相同时，气相反应性材料可以与残留物和组分部分反应。 使用的特别优选的气相反应性材料包括气态化合物如XeF 2，XeF 4，XeF 6，NF 3，IF 5，IF 7，SF 6，C 2 F 6，F 2，CF 4，KrF 2，Cl 2，HCl，ClF 3，ClO 2，N 2 F 4，N 2 F 2，N 3 F， ，NH2F，HOBr，Br2，C3F8，C4F8，C5F8，CHF3，CH2F2，CH3F，COF2，HF，C2HF5，C2H2F4，C2H3F3，C2H4F2，C2H5F，C3F6和有机氯化物，如COCl2，CCl4，CHCl3，CH2Cl2和CH3Cl。

公开(公告)号：US20050109399A1

公开(公告)日：2005-05-26

申请号：US10720357

申请日：2003-11-24

申请人： Michael Wodjenski ,  James Dietz

发明人： Michael Wodjenski ,  James Dietz

IPC分类号： B01D20060101 ,  F17C13/04 ,  G05D7/00

CPC分类号： F17C13/04 ,  F17C2205/0142 ,  F17C2205/0146 ,  F17C2205/0326 ,  F17C2205/0329 ,  F17C2205/0335 ,  F17C2205/0338 ,  F17C2223/033 ,  F17C2223/035 ,  F17C2223/036 ,  F17C2223/038 ,  F17C2227/0114 ,  F17C2227/044 ,  F17C2270/0518 ,  Y10T137/0396 ,  Y10T137/0419 ,  Y10T137/4259 ,  Y10T137/7043 ,  Y10T137/87877

摘要： A gas cabinet including an enclosure containing at least one gas supply vessel and flow circuitry coupled to the gas supply vessel(s). The flow circuitry is constructed and arranged to flow dispensed gas from an on-stream gas supply vessel to multiple sticks of the flow circuitry, with each of the multiple sticks being joined in gas flow communication to a respective gas-utilizing process unit. The flow circuitry is valved to enable sections of the flow circuitry associated with respective ones of the multiple sticks to be isolated from other sections of the flow circuitry, so that process gas can be flowed to one or more of the sticks, while other sticks are being evacuated and purged, or otherwise are closed to dispensed gas flow therethrough.

摘要翻译： 一种气柜，包括包含至少一个气体供应容器和耦合到气体供应容器的流动回路的外壳。 流动电路被构造和布置成将分配的气体从流动气体供应容器流动到流动电路的多个棒，其中每个多个棒以气体流动连通的方式连接到相应的气体利用处理单元。 流动电路是阀门，以使得与多个棒中的相应的一个杆相关联的流动回路的部分与流动回路的其它部分隔离，使得处理气体可以流到一个或多个棒，而其他棒是 被排空和吹扫，或以其他方式关闭以分配气体流过其中。

公开(公告)号：US6155289A

公开(公告)日：2000-12-05

申请号：US307650

申请日：1999-05-07

申请人： Kurt A. Carlsen ,  James McManus ,  James Dietz

发明人： Kurt A. Carlsen ,  James McManus ,  James Dietz

IPC分类号： G05D16/20 ,  G05D7/06

CPC分类号： G05D16/2013 ,  Y10T137/0396 ,  Y10T137/7724 ,  Y10T137/7759 ,  Y10T137/7761

摘要： A sub-atmospheric gas delivery system (100) with a backflow control apparatus (10) for preventing backflow into the sub-atmospheric gas source (14). The gas delivery system includes three fluidly coupled sticks: a purge stick (120), a process gas delivery stick (124) and an evacuation stick (130). The backflow control apparatus comprises a gas line (26) fluidly coupling the sub-atmospheric gas source to a chamber (50), a valve (20) attached to the sub-atmospheric gas source for blocking fluid communication between the gas source and the gas line upon receipt of a first signal, a flow restrictor (R) in fluid communication with the gas line and positioned between the valve and the chamber, and first and second pressure transducers (P1 and P2) in fluid communication with the gas line and positioned on either side of the flow restrictor. Each transducer is capable of generating a signal representative of pressure. The backflow control apparatus further includes a valve controller unit (40) connected to the first and second pressure transducers and the valve. The controller is capable of generating the aforementioned first signal in response to the signals from the first and second pressure transducers.

摘要翻译： 具有用于防止回流到次大气气体源（14）中的回流控制装置（10）的次大气气体输送系统（100）。 气体输送系统包括三个流体耦合的棒：吹扫棒（120），处理气体输送棒（124）和抽空棒（130）。 回流控制装置包括将副气氛气体源流体耦合到室（50）的气体管线（26），附接到次大气气体源的阀（20），用于阻止气源和气体之间的流体连通 在与气体管线流体连通并且位于阀和腔室之间流体连通的限流器（R）以及与气体管线流体连通并定位的第一和第二压力换能器（P1和P2） 在限流器的两侧。 每个换能器能够产生代表压力的信号。 回流控制装置还包括连接到第一和第二压力换能器和阀的阀控制器单元（40）。 控制器能够响应于来自第一和第二压力换能器的信号产生上述第一信号。

公开(公告)号：US20110252883A1

公开(公告)日：2011-10-20

申请号：US13171434

申请日：2011-06-28

申请人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, JR.

发明人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, JR.

IPC分类号： G01F23/30

CPC分类号： G01N33/00 ,  F17C11/00 ,  G01F15/063 ,  G01F22/02 ,  G01F23/0076 ,  G01M3/32 ,  G01M3/3236 ,  G06Q10/087 ,  G06Q30/04 ,  G06Q50/04 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/10 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K1/185 ,  H05K3/4602 ,  H05K2203/0165 ,  H05K2203/085 ,  H05K2203/1469 ,  Y02P90/30 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/53183 ,  H01L2224/45099

摘要： A monitoring system for monitoring fluid in a fluid supply vessel during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor and display operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.

摘要翻译： 一种用于在操作期间监测流体供应容器中的流体的监测系统，包括从流体供应容器分配流体。 监测系统包括（i）用于监测流体供应容器或从其分配的流体的特性的一个或多个传感器，（ii）可操作地耦合到所述一个或多个传感器以从其接收监测数据的数据采集模块，并且响应地生成 输出与由一个或多个传感器监测的特性相关联，以及（iii）处理器和显示器，其与数据采集模块可操作地耦合并被布置成处理来自数据采集模块的输出并且响应地输出流体在流体中的图形表示 供应船，记帐单，使用报告和/或补货请求。

公开(公告)号：US20060237061A1

公开(公告)日：2006-10-26

申请号：US11453700

申请日：2006-06-15

申请人： Jose Arno ,  James Dietz

发明人： Jose Arno ,  James Dietz

IPC分类号： G05D11/13

CPC分类号： H01L22/20 ,  G01N21/3504 ,  Y10T137/0329 ,  Y10T137/2509 ,  Y10T137/87676

摘要： Apparatus and method for delivery of dilute active fluid, e.g., to a downstream active fluid-consuming process unit of a semiconductor manufacturing plant. The delivery system includes an active fluid source, a diluent fluid source, a fluid flow metering device for dispensing of the active fluid at a predetermined flow rate, a mixer arranged to mix active gas from the active fluid source that is dispensed at such predetermined flow rate by the fluid flow metering device, with diluent fluid to form a diluted active fluid mixture, and a monitor arranged to measure concentration of active fluid in the diluted active fluid mixture, and responsively adjust the fluid flow metering device, to control the dispensing rate of the active fluid, and maintain a predetermined concentration of active fluid in the diluted active fluid mixture.