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    Point of use slurry dispensing system
    1.
    发明授权
    Point of use slurry dispensing system 失效
    使用点浆料分配系统

    公开(公告)号：US5478435A

    公开(公告)日：1995-12-26

    申请号：US356987

    申请日：1994-12-16

    申请人： James J. Murphy ,  Janos Farkas ,  Lucia C. Markert ,  Rahul Jairath

    发明人： James J. Murphy ,  Janos Farkas ,  Lucia C. Markert ,  Rahul Jairath

    IPC分类号： B01F3/12 ,  B01F5/04 ,  H01L21/00

    CPC分类号： H01L21/6715 ,  B01F5/0403 ,  B01F2003/1257 ,  B01F2215/0045

    摘要： A point of use slurry dispensing system with controls for dilution, temperature and oxidizer/etchant/additive infusion. A slurry in unmixed form and a diluting agent are independently pumped to a pad on a CMP tool. Liquid heaters are used to heat the slurry and the diluting agent to a desirable temperature. The actual mixing occurs at the point of use on the pad or in a dispensing line just prior to the point of use. In some instances a third independent distribution line is used to dispense an oxidizer, etchant and/or chemical additive at or near the point of use.

    摘要翻译： 一种使用的浆料分配系统，其具有用于稀释，温度和氧化剂/蚀刻剂/添加剂输注的对照。 将未混合的浆料和稀释剂独立地泵送到CMP工具上的垫上。 液体加热器用于将浆料和稀释剂加热至所需温度。 在使用点之前，实际的混合发生在垫上或使用点处。 在一些情况下，使用第三独立分配线来在使用点处或附近分配氧化剂，蚀刻剂和/或化学添加剂。

    Method of using additives with silica-based slurries to enhance selectivity in metal CMP
    2.
    发明授权
    Method of using additives with silica-based slurries to enhance selectivity in metal CMP 失效
    使用添加剂与二氧化硅基浆料以提高金属CMP中的选择性的方法

    公开(公告)号：US5614444A

    公开(公告)日：1997-03-25

    申请号：US469164

    申请日：1995-06-06

    申请人： Janos Farkas ,  Rahul Jairath ,  Matt Stell ,  Sing-Mo Tzeng

    发明人： Janos Farkas ,  Rahul Jairath ,  Matt Stell ,  Sing-Mo Tzeng

    IPC分类号： H01L21/3105 ,  H01L21/3213 ,  H01L21/302

    CPC分类号： H01L21/3105 ,  H01L21/3213

    摘要： A method of using additives with silica-based slurries to enhance metal selectivity in polishing metallic materials utilizing a chemical-mechanical polishing (CMP) process. Additives are used with silica-based slurries to passivate a dielectric surface, such as a silicon dioxide (SiO.sub.2) surface, of a semiconductor wafer so that dielectric removal rate is reduced when CMP is applied. The additive is comprised of at least a polar component and an apolar component. The additive interacts with the surface silanol group of the SiO.sub.2 surface to inhibit particles of the silica-based slurry from interacting with hydroxyl molecules of the surface silanol group. By applying a surface passivation layer on the SiO.sub.2 surface, erosion of the SiO.sub.2 surface is reduced. However, the metallic surface is not influenced significantly by the additive, so that the selectivity of metal removal over oxide removal is enhanced.

    摘要翻译： 使用具有二氧化硅基浆料的添加剂的方法，以通过化学机械抛光（CMP）工艺来提高金属材料抛光的金属选择性。 添加剂与二氧化硅基浆料一起使用以钝化半导体晶片的电介质表面，例如二氧化硅（SiO 2）表面，使得当施加CMP时电介质去除速率降低。 添加剂由至少极性组分和非极性组分组成。 该添加剂与SiO 2表面的表面硅烷醇基团相互作用，以抑制二氧化硅基浆料的颗粒与表面硅烷醇基团的羟基分子相互作用。 通过在SiO 2表面上施加表面钝化层，降低了SiO 2表面的侵蚀。 然而，金属表面不会被添加剂显着影响，从而提高了金属去除对氧化物去除的选择性。

    Apparatus for cleaning of circuit substrates
    3.
    发明授权
    Apparatus for cleaning of circuit substrates 有权
    电路基板清洗装置

    公开(公告)号：US08752228B2

    公开(公告)日：2014-06-17

    申请号：US11912126

    申请日：2005-04-20

    申请人： Janos Farkas ,  Srdjan Kordic ,  Sebastien Petitdidier ,  Kevin E Cooper ,  Jan Van Hassel

    发明人： Janos Farkas ,  Srdjan Kordic ,  Sebastien Petitdidier ,  Kevin E Cooper ,  Jan Van Hassel

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67046

    摘要： Silicon wafers and the like are cleaned using new scrubber-type apparatus in which measures are taken to compensate for differential cleaning of the central region of the wafer by: using rotary brushes having one or more non-contact portions arranged in the section thereof that faces the central region of the substrate, or toggling the relative position of the wafer and the rotary brushes, or directing cleaning fluid(s) preferentially towards the central region of the wafer. Another aspect of the invention provides scrubber-type cleaning apparatus in which the rotary brushes are replaced by rollers (110). A web of cleaning material (116) is interposed between each roller and the substrate. Various different webs of cleaning material may be used, e.g. a length of tissue, a continuous loop of cleaning material whose surface is reconditioned on each cleaning pass, adhesive material provided on a carrier tape, etc.

    摘要翻译： 使用新的洗涤器型装置清洁硅晶片等，其中采取措施来补偿晶片的中心区域的差别清洁：使用具有一个或多个非接触部分的旋转电刷， 或者切换晶片和旋转刷的相对位置，或者将清洁流体优先地引向晶片的中心区域。 本发明的另一方面提供了一种洗涤器型清洁装置，其中旋转刷由辊（110）代替。 清洁材料网（116）插入在每个辊和基底之间。 可以使用各种不同的清洁材料网，例如。 组织长度，每个清洁通道上表面被修复的清洁材料的连续回路，设置在载带上的粘合材料等。

    Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
    4.
    发明授权
    Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device 有权
    包括耦合电介质层和金属层的半导体器件，其制造方法以及用于在半导体器件中耦合电介质层和金属层的材料

    公开(公告)号：US07691756B2

    公开(公告)日：2010-04-06

    申请号：US12065179

    申请日：2006-09-01

    申请人： Janos Farkas ,  Srdjan Kordic ,  Cindy Goldberg

    发明人： Janos Farkas ,  Srdjan Kordic ,  Cindy Goldberg

    IPC分类号： H01L21/31 ,  H01L23/58

    CPC分类号： H01L21/3105 ,  C04B35/5603 ,  C04B35/565 ,  C04B2235/483 ,  C08G77/60 ,  C08L83/16 ,  C09D183/16 ,  H01L21/02063 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/02203 ,  H01L21/288 ,  H01L21/76801 ,  H01L21/7682 ,  H01L21/76838

    摘要： A passivating coupling material for, on the one hand, passivating a dielectric layer in a semiconductor device, and on the other hand, for permitting or at least promoting liquid phase metal deposition thereon in a subsequent process step. In a particular example, the dielectric layer may be a porous material having a desirably decreased dielectric constant k, and the passivating coupling material provides steric shielding groups that substantially block the adsorption and uptake of ambient moisture into the porous dielectric layer. The passivating coupling materials also provides metal nucleation sides for promoting the deposition of a metal thereon in liquid phase, in comparison with metal deposition without the presence of the passivating coupling material. The use of a liquid phase metal deposition process facilitates the subsequent manufacture of the semiconductor device. In one example, the passivating coupling material has multiple Si atoms in its chemical composition, which desirably increases the thermal stability of the material.

    摘要翻译： 一种钝化耦合材料，一方面使半导体器件中的电介质层钝化，另一方面，用于在随后的工艺步骤中允许或至少促进液相金属沉积。 在具体实例中，电介质层可以是具有理想的降低介电常数k的多孔材料，并且钝化耦合材料提供空间屏蔽基团，其基本上阻止环境水分吸附和吸收到多孔介电层中。 与金属沉积相比，钝化耦合材料还提供金属成核侧，用于促进金属沉积在液相中，而不存在钝化偶联材料。 使用液相金属沉积工艺有助于随后的半导体器件的制造。 在一个实例中，钝化偶联材料在其化学组成中具有多个Si原子，这有利地增加了材料的热稳定性。

    Promotion of a wine industry
    5.
    发明申请
    Promotion of a wine industry 审中-公开
    推广葡萄酒产业

    公开(公告)号：US20090094098A1

    公开(公告)日：2009-04-09

    申请号：US11906980

    申请日：2007-10-04

    申请人： Janos Farkas

    发明人： Janos Farkas

    IPC分类号： G06Q30/00

    CPC分类号： G06Q30/02 ,  G06Q30/0236 ,  G06Q30/0241

    摘要： Disclosed herein is a method and system for promoting a first wine industry of a first geographical location utilizing a plurality of advertising media. In a first embodiment, the plurality of advertising mediums is selected for promoting the first wine industry. The disclosed method links information of contribution of the first wine industry to a second wine industry. The information is publicized in a plurality of locations. In a second embodiment, the first wine industry is promoted utilizing a web portal. The web portal comprises a first set of information of the first wine industry and a second set of information of the second wine industry. The web portal establishes a virtual link between the first set of information and the second set of information. Further, revenue may be generated through the advertising mediums and targeted advertising.

    摘要翻译： 本文公开了一种利用多种广告媒体促进第一地理位置的第一葡萄酒业的方法和系统。 在第一实施例中，多个广告媒体被选择用于促进第一葡萄酒行业。 所公开的方法将第一葡萄酒行业的贡献信息与第二葡萄酒行业相关联。 该信息在多个位置公开。 在第二实施例中，利用门户网站来推广第一葡萄酒行业。 该门户网站包括第一葡萄酒行业的第一组信息和第二葡萄酒行业的第二组信息。 网络门户在第一组信息和第二组信息之间建立虚拟链路。 此外，可以通过广告媒介和有针对性的广告来产生收入。

    CMP metal polishing slurry and process with reduced solids concentration
    6.
    发明授权
    CMP metal polishing slurry and process with reduced solids concentration 失效
    CMP金属抛光浆料和固体浓度降低的工艺

    公开(公告)号：US07456105B1

    公开(公告)日：2008-11-25

    申请号：US10321973

    申请日：2002-12-17

    申请人： Kevin Elliot Cooper ,  Jennifer Lynn Cooper ,  Janos Farkas ,  John C. Flake ,  Johannes Friedrich Groschopf ,  Yuri Solomentsev

    发明人： Kevin Elliot Cooper ,  Jennifer Lynn Cooper ,  Janos Farkas ,  John C. Flake ,  Johannes Friedrich Groschopf ,  Yuri Solomentsev

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： H01L21/3212 ,  C09G1/02

    摘要： This disclosure describes a low particle concentration formulation for slurry which is particularly useful in continuous CMP polishing of copper layers during semiconductor wafer manufacture. The slurry is characterized by particle concentrations generally less than 2 wt %, and advantageously less than 1 wt %. In particular embodiments, where the particle concentration is in a range of 50 to 450 PPM, an 8-fold increase in polishing rate over reactive liquid slurries has been realized. Slurries thus formulated also achieve a reduction in defectivity and in the variations in planarity from wafer to wafer during manufacture, by improving the stability of polishing quality. The slurry formulations permit substantial cost savings over traditional 2-component, reactive liquid and fixed/bonded abrasive slurries. In addition the formulations provides an advantageous way during CMP to easily change the selectivity or rate of removal of one film material vs. another. Yet another use is to provide slurry “pulsing” as a means to activate bonded abrasive or fixed abrasive slurry technology.

    摘要翻译： 本公开内容描述了用于浆料的低颗粒浓度配方，其特别适用于半导体晶片制造过程中铜层的连续CMP抛光。 浆料的特征在于颗粒浓度通常小于2重量％，有利地小于1重量％。 在特定实施方案中，其中颗粒浓度在50至450PPM的范围内，抛光速率比反应性液体浆料高8倍。 因此，通过提高抛光质量的稳定性，由此制成的浆料也可以在制造过程中实现缺陷率的降低和从晶片到晶片的平面度的变化。 与传统的2组分反应性液体和固定/粘结的磨料浆料相比，浆料配方可节省大量成本。 此外，制剂在CMP期间提供有利的方式以容易地改变一种膜材料相对于另一种膜材料的选择性或速率。 另一种用途是提供浆料“脉冲”作为活化粘合磨料或固定磨料浆料技术的手段。

    Method and device for audience monitoring on multicast capable networks
    7.
    发明申请
    Method and device for audience monitoring on multicast capable networks 审中-公开
    用于组播能力网络的观众监控的方法和设备

    公开(公告)号：US20060294259A1

    公开(公告)日：2006-12-28

    申请号：US10595346

    申请日：2003-10-24

    申请人： Gergely Matefi ,  Janos Farkas ,  Tamas Elteto

    发明人： Gergely Matefi ,  Janos Farkas ,  Tamas Elteto

    IPC分类号： G06F15/16

    CPC分类号： H04L12/2861 ,  H04H60/44 ,  H04L12/18 ,  H04L12/2856 ,  H04L43/08 ,  H04L67/22

    摘要： The presented idea is a cheap solution for audience monitoring in multicast capable networks e.g. Ethernet, IP or UMTS. There is no need for user equipment in order to monitor the viewers' watching behavior. The measurement is done in the operator's network; therefore, there is no need to contact the end user. The idea can be applied in systems comprising multicast capable network contention server, network devices and user equipment. The content is carried in data packets to the end user. The network devices are remote manageable. The user can choose between several contents. The aim is to measure the user statistics regarding the chosen content. According to the invention it is enough to place a measurement host with our proposed software block in the network, which collects data from the network devices in the edge of the network periodically in order to make a content access survey.

    摘要翻译： 所提出的想法是用于在具有多播能力的网络中的观众监视的廉价解决方案。 以太网，IP或UMTS。 为了监视观众的观看行为，不需要用户设备。 测量在操作员网络中完成; 因此，无需与最终用户联系。 该思想可以应用于包括多播能力的网络争用服务器，网络设备和用户设备的系统中。 内容以数据包传送给最终用户。 网络设备可远程管理。 用户可以选择多个内容。 目的是衡量有关所选内容的用户统计信息。 根据本发明，将测量主机与我们提出的软件块放置在网络中，从而周期性地从网络边缘的网络设备收集数据，以进行内容访问调查。