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    Electromechanical Systems Oscillator with Piezoelectric Contour Mode Resonator for Multiple Frequency Generation
    2.
    发明申请
    Electromechanical Systems Oscillator with Piezoelectric Contour Mode Resonator for Multiple Frequency Generation 失效
    机电系统振荡器用于多频发生的压电轮廓模式谐振器

    公开(公告)号：US20120286886A1

    公开(公告)日：2012-11-15

    申请号：US13107764

    申请日：2011-05-13

    申请人： Jonghae Kim ,  Je-Hsiung Lan ,  Changhan Yun ,  Chi Shun Lo ,  Matthew Nowak

    发明人： Jonghae Kim ,  Je-Hsiung Lan ,  Changhan Yun ,  Chi Shun Lo ,  Matthew Nowak

    IPC分类号： H03B7/14

    CPC分类号： H03H9/2426 ,  H03H9/02228 ,  H03H9/2405 ,  H03H9/462 ,  H03H2009/241

    摘要： Electromechanical systems resonator structures, devices, circuits, and systems are disclosed. In one aspect, an oscillator includes an active component and a passive component connected in a feedback configuration. The passive component includes one or more contour mode resonators (CMR). A CMR includes a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The conductive layers include an input electrode and an output electrode. The passive component is configured to output a first resonant frequency and a second resonant frequency, which is an odd integer harmonic of the first resonant frequency. The active component is configured to output a signal including the first resonant frequency and the second resonant frequency. This output signal can be a substantially square wave signal, which can serve as a clock in various applications.

    摘要翻译： 公开了机电系统谐振器结构，器件，电路和系统。 一方面，振荡器包括以反馈配置连接的有源部件和无源部件。 无源部件包括一个或多个轮廓模式谐振器（CMR）。 CMR包括设置在第一导电层和第二导电层之间的压电层。 导电层包括输入电极和输出电极。 无源部件被配置为输出第一谐振频率和第二谐振频率，其是第一谐振频率的奇整数谐波。 有源部件被配置为输出包括第一谐振频率和第二谐振频率的信号。 该输出信号可以是基本上为方波信号，其可以用作各种应用中的时钟。

    Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation
    3.
    发明授权
    Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation 失效
    具有压电轮廓模式谐振器的机电系统振荡器用于多频发生

    公开(公告)号：US08471643B2

    公开(公告)日：2013-06-25

    申请号：US13107764

    申请日：2011-05-13

    申请人： Jonghae Kim ,  Je-Hsiung Lan ,  Changhan Yun ,  Chi Shun Lo ,  Matthew Nowak

    发明人： Jonghae Kim ,  Je-Hsiung Lan ,  Changhan Yun ,  Chi Shun Lo ,  Matthew Nowak

    IPC分类号： H03B5/30

    CPC分类号： H03H9/2426 ,  H03H9/02228 ,  H03H9/2405 ,  H03H9/462 ,  H03H2009/241

    摘要： Electromechanical systems resonator structures, devices, circuits, and systems are disclosed. In one aspect, an oscillator includes an active component and a passive component connected in a feedback configuration. The passive component includes one or more contour mode resonators (CMR). A CMR includes a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The conductive layers include an input electrode and an output electrode. The passive component is configured to output a first resonant frequency and a second resonant frequency, which is an odd integer harmonic of the first resonant frequency. The active component is configured to output a signal including the first resonant frequency and the second resonant frequency. This output signal can be a substantially square wave signal, which can serve as a clock in various applications.

    摘要翻译： 公开了机电系统谐振器结构，器件，电路和系统。 一方面，振荡器包括以反馈配置连接的有源部件和无源部件。 无源部件包括一个或多个轮廓模式谐振器（CMR）。 CMR包括设置在第一导电层和第二导电层之间的压电层。 导电层包括输入电极和输出电极。 无源部件被配置为输出第一谐振频率和第二谐振频率，其是第一谐振频率的奇整数谐波。 有源部件被配置为输出包括第一谐振频率和第二谐振频率的信号。 该输出信号可以是基本上为方波信号，其可以用作各种应用中的时钟。

    Method and apparatus for providing through silicon via (TSV) redundancy
    4.
    发明授权
    Method and apparatus for providing through silicon via (TSV) redundancy 有权
    用于通过硅通孔（TSV）冗余提供的方法和装置

    公开(公告)号：US08988130B2

    公开(公告)日：2015-03-24

    申请号：US12468908

    申请日：2009-05-20

    申请人： Jonghae Kim ,  Feng Wang ,  Matthew Nowak

    发明人： Jonghae Kim ,  Feng Wang ,  Matthew Nowak

    IPC分类号： H03K17/00 ,  H03K19/003 ,  H01L25/065

    CPC分类号： H03K19/00392 ,  G01R31/318513 ,  H01L23/481 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus includes a first die having a first bus, a second die having a second bus stacked on the first die, a plurality of through silicon vias connecting the first bus to the second bus, and first control logic for sending data to identified ones of the plurality of through silicon vias. Also, optionally, second control logic for determining a first set of the plurality of through silicon vias that are nonfunctional, wherein the second control logic is configured to send information to the first control logic identifying the first set of the plurality of through silicon vias or identifying a second set of through silicon vias that are functional. Also a method of sending signals through a plurality of through silicon vias.

    摘要翻译： 一种装置包括具有第一总线的第一管芯，具有堆叠在第一管芯上的第二总线的第二管芯，将第一总线连接到第二总线的多个通孔硅通孔，以及用于向第二总线发送数据的第一控制逻辑 多个通孔硅通孔。 另外，可选地，第二控制逻辑用于确定非功能性的多个通孔硅通孔的第一组，其中第二控制逻辑被配置为向第一控制逻辑发送信息，该第一控制逻辑识别多个通孔通孔中的第一组， 识别功能性的第二组通孔硅通孔。 也是通过多个通过硅通孔发送信号的方法。

    Three Dimensional Inductor, Transformer and Radio Frequency Amplifier
    5.
    发明申请
    Three Dimensional Inductor, Transformer and Radio Frequency Amplifier 有权
    三维电感，变压器和射频放大器

    公开(公告)号：US20120056680A1

    公开(公告)日：2012-03-08

    申请号：US13294351

    申请日：2011-11-11

    申请人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    发明人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    IPC分类号： H03F3/16

    CPC分类号： H01L28/10 ,  H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0207 ,  H01L2224/16145 ,  H01L2924/3011

    摘要： A three dimensional on-chip radio frequency amplifier is disclosed that includes first and second transformers and a first transistor. The first transformer includes first and second inductively coupled inductors. The second transformer includes third and fourth inductively coupled inductors. Each inductor includes multiple first segments in a first metal layer; multiple second segments in a second metal layer; first and second inputs, and multiple through vias coupling the first and second segments to form a continuous path between the first and second inputs. The first input of the first inductor is coupled to an amplifier input; the first input of the second inductor is coupled to the first transistor gate; the first input of the third inductor is coupled to the first transistor drain, the first input of the fourth inductor is coupled to an amplifier output. The second inductor inputs and the first transistor source are coupled to ground.

    摘要翻译： 公开了一种三维片上射频放大器，其包括第一和第二变压器和第一晶体管。 第一变压器包括第一和第二电感耦合电感器。 第二变压器包括第三和第四电感耦合电感器。 每个电感器包括在第一金属层中的多个第一段; 第二金属层中的多个第二段; 第一和第二输入以及耦合第一和第二段的多通孔，以形成第一和第二输入之间的连续路径。 第一电感器的第一输入耦合到放大器输入端; 第二电感器的第一输入耦合到第一晶体管栅极; 第三电感器的第一输入耦合到第一晶体管漏极，第四电感器的第一输入耦合到放大器输出端。 第二电感器输入和第一晶体管源耦合到地。

    Three dimensional inductor, transformer and radio frequency amplifier
    8.
    发明授权
    Three dimensional inductor, transformer and radio frequency amplifier 有权
    三维电感，变压器和射频放大器

    公开(公告)号：US08508301B2

    公开(公告)日：2013-08-13

    申请号：US13294351

    申请日：2011-11-11

    申请人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    发明人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    IPC分类号： H03F3/14

    CPC分类号： H01L28/10 ,  H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0207 ,  H01L2224/16145 ,  H01L2924/3011

    摘要： A three dimensional on-chip radio frequency amplifier is disclosed that includes first and second transformers and a first transistor. The first transformer includes first and second inductively coupled inductors. The second transformer includes third and fourth inductively coupled inductors. Each inductor includes multiple first segments in a first metal layer; multiple second segments in a second metal layer; first and second inputs, and multiple through vias coupling the first and second segments to form a continuous path between the first and second inputs. The first input of the first inductor is coupled to an amplifier input; the first input of the second inductor is coupled to the first transistor gate; the first input of the third inductor is coupled to the first transistor drain, the first input of the fourth inductor is coupled to an amplifier output. The second inductor inputs and the first transistor source are coupled to ground.

    摘要翻译： 公开了一种三维片上射频放大器，其包括第一和第二变压器和第一晶体管。 第一变压器包括第一和第二电感耦合电感器。 第二变压器包括第三和第四电感耦合电感器。 每个电感器包括在第一金属层中的多个第一段; 第二金属层中的多个第二段; 第一和第二输入以及耦合第一和第二段的多通孔，以形成第一和第二输入之间的连续路径。 第一电感器的第一输入耦合到放大器输入端; 第二电感器的第一输入耦合到第一晶体管栅极; 第三电感器的第一输入耦合到第一晶体管漏极，第四电感器的第一输入耦合到放大器输出端。 第二电感器输入和第一晶体管源耦合到地。

    Three Dimensional Inductor and Transformer
    10.
    发明申请
    Three Dimensional Inductor and Transformer 有权
    三维电感和变压器

    公开(公告)号：US20110084765A1

    公开(公告)日：2011-04-14

    申请号：US12576033

    申请日：2009-10-08

    申请人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    发明人： Jonghae Kim ,  Shiqun Gu ,  Brian Matthew Henderson ,  Thomas R. Toms ,  Lew G. Chua-Eoan ,  Seyfollah S. Bazarjani ,  Matthew Nowak

    IPC分类号： H03F3/16 ,  H01F5/00

    CPC分类号： H01L28/10 ,  H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0207 ,  H01L2224/16145 ,  H01L2924/3011

    摘要： A three dimensional on-chip inductor, transformer and radio frequency amplifier are disclosed. The radio frequency amplifier includes a pair of transformers and a transistor. The transformers include at least two inductively coupled inductors. The inductors include a plurality of segments of a first metal layer, a plurality of segments of a second metal layer, a first inductor input, a second inductor input, and a plurality of through silicon vias coupling the plurality of segments of the first metal layer and the plurality of segments of the second metal layer to form a continuous, non-intersecting path between the first inductor input and the second inductor input. The inductors can have a symmetric or asymmetric geometry. The first metal layer can be a metal layer in the back-end-of-line section of the chip. The second metal layer can be located in the redistributed design layer of the chip.

    摘要翻译： 公开了三维片上电感器，变压器和射频放大器。 射频放大器包括一对变压器和晶体管。 变压器包括至少两个电感耦合电感器。 电感器包括第一金属层的多个段，第二金属层的多个段，第一电感器输入端，第二电感器输入端和耦合第一金属层的多个段的多个穿通硅通孔 以及第二金属层的多个段，以在第一电感器输入端和第二电感器输入端之间形成连续的，不相交的路径。 电感器可以具有对称或不对称的几何形状。 第一金属层可以是芯片的后端部分中的金属层。 第二金属层可以位于芯片的再分布设计层中。