公开(公告)号：US20050133932A1

公开(公告)日：2005-06-23

申请号：US11013328

申请日：2004-12-17

申请人： Jens Pohl ,  Bernd Roemer ,  Bernhard Schaetzler ,  Christian Stuempfl ,  Herman Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Jens Pohl ,  Bernd Roemer ,  Bernhard Schaetzler ,  Christian Stuempfl ,  Herman Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L23/48 ,  H01L21/48

CPC分类号： H01L23/49833 ,  H01L21/563 ,  H01L23/04 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

摘要翻译： 具有半导体堆叠的电子半导体模块组件包括以垂直堆叠的关系布置的半导体组件。 基本半导体部件包括下部插入单元，其上布置有下部外部接触垫。 基本半导体部件还包括上部插入单元，在其上布置有上部外部接触垫。 两个插入单元通过设置在其边缘区域处的接合连接彼此电连接。 基本的半导体部件是紧凑的部件，其上可以堆叠不同的客户特定的半导体部件。

公开(公告)号：US07456495B2

公开(公告)日：2008-11-25

申请号：US11013328

申请日：2004-12-17

申请人： Jens Pohl ,  Bernd Roemer ,  Bernhard Schaetzler ,  Christian Stuempfl ,  Herman Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Jens Pohl ,  Bernd Roemer ,  Bernhard Schaetzler ,  Christian Stuempfl ,  Herman Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/02

CPC分类号： H01L23/49833 ,  H01L21/563 ,  H01L23/04 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

摘要翻译： 具有半导体堆叠的电子半导体模块组件包括以垂直堆叠的关系布置的半导体组件。 基本半导体部件包括下部插入单元，其上布置有下部外部接触垫。 基本半导体部件还包括上部插入单元，在其上布置有上部外部接触垫。 两个插入单元通过设置在其边缘区域处的接合连接彼此电连接。 基本的半导体部件是紧凑的部件，其上可以堆叠不同的客户特定的半导体部件。

公开(公告)号：US07276783B2

公开(公告)日：2007-10-02

申请号：US10484443

申请日：2002-07-31

申请人： Bernd Goller ,  Robert Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L23/02

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/83104 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

摘要： An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

摘要翻译： 具有塑料封装的电子部件及其制造方法包括半导体芯片。 塑料包装的下侧有外部触点。 外部触点通过半导体芯片的接触柱和布置在塑料封装模塑料上的布线连接到半导体芯片的有源上侧的接触区域。 在这种情况下，接触柱代表接触区域的导电高度。

公开(公告)号：US06902951B2

公开(公告)日：2005-06-07

申请号：US10696369

申请日：2003-10-29

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L24/96 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

摘要翻译： 作为多芯片模块，电子设备具有集成到引线框架中的两个或更多个半导体芯片，使得引线框架的放置侧和电路芯片的有源顶侧齐平并具有公共的精细布线平面。 引线框架被布置为在重新布线基板上的扩展半导体芯片。

公开(公告)号：US07566968B2

公开(公告)日：2009-07-28

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

摘要翻译： 具有智能卡结构的生物传感器包括：半导体芯片，包括生物活性结构和布置在半导体芯片的第一面上的接触区域;以及重新布线基板，包括接触焊盘，外部接触区域和将接触焊盘电连接到 外部接触区域。 再配线基板覆盖半导体芯片的第一侧的一部分而不覆盖生物活性结构，使得重新布线基板与半导体芯片和接触焊盘的接触区域重叠，并且接触区域彼此对准并电连接 。 此外，测量装置被配置为接收生物传感器并进行传送到测量装置中的流体介质的测量。

公开(公告)号：US20060027905A1

公开(公告)日：2006-02-09

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L29/82 ,  G01N33/48

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

公开(公告)号：US20050184375A1

公开(公告)日：2005-08-25

申请号：US11114766

申请日：2005-04-26

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/495

CPC分类号： H01L24/96 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

摘要翻译： 作为多芯片模块，电子设备具有集成到引线框架中的两个或更多个半导体芯片，使得引线框架的放置侧和电路芯片的有源顶侧齐平并具有公共的精细布线平面。 引线框架被布置为在重新布线基板上的扩展半导体芯片。

公开(公告)号：US07592236B2

公开(公告)日：2009-09-22

申请号：US11582551

申请日：2006-10-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/6715 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.

摘要翻译： 在制造半导体器件中，将半导体芯片的背面施加接合材料的结构。 接合材料通过接合材料喷射器具以精细计量和结构化的形式施加到分开的半导体晶片的半导体芯片的背面。

公开(公告)号：US07547645B2

公开(公告)日：2009-06-16

申请号：US11504782

申请日：2006-08-16

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/20

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

摘要翻译： 涂覆包括至少一个半导体芯片的结构的方法包括在待涂覆结构的区域上静电沉积涂层颗粒。 首先将涂层颗粒施加到载体上，然后将涂层颗粒带电涂覆颗粒。 包括至少一个半导体芯片的结构被静电充电到与载体相反的极性。 然后将载体和/或结构沿待涂覆结构的区域的方向彼此移动，直到涂层颗粒跳到要涂覆的结构的区域并粘附在那里。 涂覆颗粒通过用涂覆颗粒加热该区域而液化以形成涂层。

公开(公告)号：US07294916B2

公开(公告)日：2007-11-13

申请号：US11465547

申请日：2006-08-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。