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1.Semiconductor module with a semiconductor stack, and methods for its production 有权
标题翻译: 具有半导体堆叠的半导体模块及其生产方法公开(公告)号:US07456495B2
公开(公告)日:2008-11-25
申请号:US11013328
申请日:2004-12-17
申请人: Jens Pohl , Bernd Roemer , Bernhard Schaetzler , Christian Stuempfl , Herman Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人: Jens Pohl , Bernd Roemer , Bernhard Schaetzler , Christian Stuempfl , Herman Vilsmeier , Holger Woerner , Bernhard Zuhr
IPC分类号: H01L23/02
CPC分类号: H01L23/49833 , H01L21/563 , H01L23/04 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.
摘要翻译: 具有半导体堆叠的电子半导体模块组件包括以垂直堆叠的关系布置的半导体组件。 基本半导体部件包括下部插入单元,其上布置有下部外部接触垫。 基本半导体部件还包括上部插入单元,在其上布置有上部外部接触垫。 两个插入单元通过设置在其边缘区域处的接合连接彼此电连接。 基本的半导体部件是紧凑的部件,其上可以堆叠不同的客户特定的半导体部件。
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2.Semiconductor module with a semiconductor stack, and methods for its production 有权
标题翻译: 具有半导体堆叠的半导体模块及其生产方法公开(公告)号:US20050133932A1
公开(公告)日:2005-06-23
申请号:US11013328
申请日:2004-12-17
申请人: Jens Pohl , Bernd Roemer , Bernhard Schaetzler , Christian Stuempfl , Herman Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人: Jens Pohl , Bernd Roemer , Bernhard Schaetzler , Christian Stuempfl , Herman Vilsmeier , Holger Woerner , Bernhard Zuhr
IPC分类号: H01L23/12 , H01L21/56 , H01L23/00 , H01L23/04 , H01L23/31 , H01L23/498 , H01L25/10 , H01L23/48 , H01L21/48
CPC分类号: H01L23/49833 , H01L21/563 , H01L23/04 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.
摘要翻译: 具有半导体堆叠的电子半导体模块组件包括以垂直堆叠的关系布置的半导体组件。 基本半导体部件包括下部插入单元,其上布置有下部外部接触垫。 基本半导体部件还包括上部插入单元,在其上布置有上部外部接触垫。 两个插入单元通过设置在其边缘区域处的接合连接彼此电连接。 基本的半导体部件是紧凑的部件,其上可以堆叠不同的客户特定的半导体部件。
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公开(公告)号:US08815647B2
公开(公告)日:2014-08-26
申请号:US13602349
申请日:2012-09-04
申请人: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
发明人: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
CPC分类号: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要: A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.
摘要翻译: 提供了芯片封装,芯片封装包括:包括至少一个腔的载体; 至少部分地设置在所述至少一个空腔内的芯片; 设置在所述芯片的至少一个侧壁上的至少一个中间层; 其中所述至少一个中间层构造成将热量从所述芯片热传导到所述载体。
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公开(公告)号:US20140061669A1
公开(公告)日:2014-03-06
申请号:US13602349
申请日:2012-09-04
申请人: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
发明人: Ralf Otremba , Bernd Roemer , Erich Griebl , Fabio Brucchi
IPC分类号: H01L23/495 , H01L21/50 , H01L29/20
CPC分类号: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要: A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.
摘要翻译: 提供了芯片封装,芯片封装包括:包括至少一个腔的载体; 至少部分地设置在所述至少一个空腔内的芯片; 设置在所述芯片的至少一个侧壁上的至少一个中间层; 其中所述至少一个中间层构造成将热量从所述芯片热传导到所述载体。
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