公开(公告)号：US07268013B2

公开(公告)日：2007-09-11

申请号：US11265350

申请日：2005-11-02

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L21/00

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207

摘要： A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 公开了一种包括用于在其中接收半导体管芯的中心腔的球栅阵列（BGA）封装。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊接球或导电粘合元件与迹线电连接。 导体又通过导电通孔与基底层压板的相对侧的导电元件位置通过电介质层电连接，导电元件部位承载焊球或其它离散的导电结合元件，用于连接到更高级的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于管芯的外壳。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US06326244B1

公开(公告)日：2001-12-04

申请号：US09567633

申请日：2000-05-09

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L2100

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207

摘要： A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically-conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 球栅阵列（BGA）封装包括用于在其中接收半导体管芯的中心腔。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊接球或导电粘合元件与迹线电连接。 这些迹线又通过导电通孔与基底层压板的相对侧的导电元件位置电连接，通过电介质层，导电元件位置承载焊球或其它分立的导电接合元件，用于连接到更高级别的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于模具的外壳 。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US06982486B2

公开(公告)日：2006-01-03

申请号：US10847705

申请日：2004-05-17

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L23/053 ,  H01L23/48 ,  H01L23/02 ,  H01L21/00

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207

摘要： A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 公开了一种包括用于在其中接收半导体管芯的中心腔的球栅阵列（BGA）封装。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊接球或导电粘合元件与迹线电连接。 导体又通过导电通孔与基底层压板的相对侧的导电元件位置通过电介质层电连接，导电元件部位承载焊球或其它离散的导电结合元件，用于连接到更高级的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于管芯的外壳。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US06740971B2

公开(公告)日：2004-05-25

申请号：US10011525

申请日：2001-11-05

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L23053

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207

摘要： A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically-conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 球栅阵列（BGA）封装包括用于在其中接收半导体管芯的中心腔。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊接球或导电粘合元件与迹线电连接。 导体又通过导电通孔与基底层压板的相对侧的导电元件位置通过电介质层电连接，导电元件部位承载焊球或其它离散的导电结合元件，用于连接到更高级的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于管芯的外壳。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US6084297A

公开(公告)日：2000-07-04

申请号：US146643

申请日：1998-09-03

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/552 ,  H01L23/053 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically-conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 球栅阵列（BGA）封装包括用于在其中接收半导体管芯的中心腔。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊料球或导电粘合元件与迹线电连接。 导体又通过导电通孔与基底层压板的相对侧的导电元件位置电连接，通过电介质层，导电元件部位承载焊球或其它离散的导电结合元件，用于连接到更高级的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于模具的外壳 。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US06626656B2

公开(公告)日：2003-09-30

申请号：US10010113

申请日：2001-11-13

申请人： Steven G. Thummel

发明人： Steven G. Thummel

IPC分类号： B29C3312

CPC分类号： B29C70/72 ,  B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0097 ,  H05K3/284 ,  Y10S425/812 ,  H01L2924/00014

摘要： The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

公开(公告)号：US06287503B1

公开(公告)日：2001-09-11

申请号：US09481166

申请日：2000-01-12

申请人： Steven G. Thummel

发明人： Steven G. Thummel

IPC分类号： B29C7070

CPC分类号： B29C70/72 ,  B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0097 ,  H05K3/284 ,  Y10S425/812 ,  H01L2924/00014

摘要： The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

摘要翻译： 传送成型机的上模板和下模板被配置为一对具有相对的导体栅格阵列和/或裸露的散热器/散热器的基板安装的电子器件的一侧封装。 该对装置在单个模腔内背对背地定位，用于同时封装。 可选择地具有切口或孔的缓冲构件可以放置在两个背靠背基板之间，用于保护网格阵列，并且能够在不调整模制机器的情况下使具有变化厚度的装置进行封装。 或者，上板和下板被配置为使用具有相对的导体栅格阵列和/或裸散热器/耗散器的一对基板安装的电子器件的盖的单面封装。

公开(公告)号：US6085962A

公开(公告)日：2000-07-11

申请号：US925507

申请日：1997-09-08

申请人： John O. Jacobson ,  Derek J. Gochnour ,  Steven G. Thummel

发明人： John O. Jacobson ,  Derek J. Gochnour ,  Steven G. Thummel

IPC分类号： B23K20/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.

摘要翻译： 用于监测在分层封装上形成的引线键合的引线键合监视系统包括一种用于访问模具和层压包装件的技术，并与其接触，以便测试引线接合连接的连续性。 可以通过使通过向下延伸穿过封装件的通孔接触电连接到模具和层压体封装之间的金属迹线。 或者，可以使用柔性接触件从上方进行接触。 柔性触点可以附接到引线键合夹。

公开(公告)号：US06989121B2

公开(公告)日：2006-01-24

申请号：US10633954

申请日：2003-08-04

申请人： Steven G. Thummel

发明人： Steven G. Thummel

IPC分类号： B29C70/70 ,  B29C70/74

CPC分类号： B29C70/72 ,  B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0097 ,  H05K3/284 ,  Y10S425/812 ,  H01L2924/00014

摘要： The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.

摘要翻译： 传递模塑机的上模板和下模板被配置为一对具有相对的导体栅格阵列和/或裸露的散热器/耗散器的基板安装的电子器件的一侧封装。 可选地具有切口或孔的缓冲构件可以放置在两个背靠背基板之间，用于保护网格阵列并且能够在不调整模制机的情况下使具有变化厚度的装置进行封装。 或者，上板和下板被配置为使用具有相对的导体栅格阵列和/或裸的散热器/耗散器的一对基板安装的电子器件的盖的单面封装。

公开(公告)号：US06616880B2

公开(公告)日：2003-09-09

申请号：US09920253

申请日：2001-08-01

申请人： Steven G. Thummel

发明人： Steven G. Thummel

IPC分类号： B29C7070

CPC分类号： B29C70/72 ,  B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0097 ,  H05K3/284 ,  Y10S425/812 ,  H01L2924/00014

摘要： The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

摘要翻译： 传送成型机的上模板和下模板被配置为一对具有相对的导体栅格阵列和/或裸露的散热器/散热器的基板安装的电子器件的一侧封装。 可选地具有切口或孔的缓冲构件可以放置在两个背靠背基板之间，用于保护网格阵列并且能够在不调整模制机的情况下使具有变化厚度的装置进行封装。 或者，上板和下板被配置为使用具有相对的导体栅格阵列和/或裸散热器/耗散器的一对基板安装的电子器件的盖的单面封装。