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    Substrate manufacturing method
    1.
    发明申请
    Substrate manufacturing method 审中-公开
    基板制造方法

    公开(公告)号：US20090084494A1

    公开(公告)日：2009-04-02

    申请号：US12007475

    申请日：2008-01-10

    申请人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    发明人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    IPC分类号： B29C65/00

    CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0228 ,  H05K2203/0384 ,  Y10T156/1052

    摘要： A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.

    摘要翻译： 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。

    Optical wiring board and manufacturing method thereof
    8.
    发明申请
    Optical wiring board and manufacturing method thereof 审中-公开
    光接线板及其制造方法

    公开(公告)号：US20090130390A1

    公开(公告)日：2009-05-21

    申请号：US12149952

    申请日：2008-05-09

    申请人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

    发明人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

    IPC分类号： B32B3/00 ,  B29D11/00

    CPC分类号： B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

    摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

    摘要翻译： 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。