摘要:
A modular fitting for conduits such as tube and pipe comprises a universal body (12) having at least two selectable configurations and at least one or more connecting parts that when joined with the body form a fitting. The body includes a drive member (24) and a conduit gripping member (28), and in an exemplary embodiment the conduit gripping member may be in the form of a conical spring (28) that grips the conduit (c) when axially compressed during pull-up. The modular design for a fitting facilitates postponement of final fitting configuration and assembly beyond the manufacturing facility to an end user or other location and time.
摘要:
Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit. The inductor is disposed conformal with an insulating layer disposed on an essentially planar surface of the substrate. The insulating layer has an undulating topography.
摘要:
Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit. The inductor is disposed conformal with an insulating layer disposed on an essentially planar surface of the substrate. The insulating layer has an undulating topography.
摘要:
A thin hard mask is formed over a semiconductor substrate. The thin hard mask allows diffusion of a sacrificial material or pore-forming agent therethrough to form an underlying air gap or porous dielectric region. The thin hard mask may be a polymer or an initially porous material that may be later densified. The thin hard mask may be used to prevent etch steps used in forming an unlanded via from reaching layers below the hard mask.
摘要:
A method of forming a microelectronic structure and its associated structures is described. In one embodiment, a substrate is provided with a sacrificial layer disposed on a hard mask layer, and a metal layer disposed in a trench of the substrate and on the sacrificial layer. The metal layer is then removed at a first removal rate wherein a dishing is induced on a top surface of the metal layer until the sacrificial layer is exposed, and simultaneously removing the metal layer and the sacrificial layer at a second removal rate without substantially removing the hard mask.
摘要:
Carborane may be used as a precursor to form low dielectric constant dielectrics. The carborane material may be modified to enable it to be deposited by chemical vapor deposition.
摘要:
A dielectric layer is made porous by treating the dielectric material after metal interconnects are formed in or through that layer. The porosity lowers the dielectric constant of the dielectric material. The dielectric material may be subjected to an electron beam or a sonication bath to create the pores. The structure has smooth sidewalls for metal interconnects extending through the dielectric layer.
摘要:
A resilient object adapted to be ridden by a person sitting or standing thereon and exerting repeated jumping motions thereagainst. In one embodiment, the device comprises a resilient body member having an upper seat portion and a lower bottom portion, a handle member attached proximate its seat portion, and foot supports extending from either side of its lower portion. The device is ridden by a rider sitting on the seat portion with his legs astraddle the body member, grasping the handle member and exerting repeating jumping motions against the foot supports to bounce the device across the ground. In a second embodiment, the device comprises a horizontally oriented resilient body member having an overall width dimension substantially greater than its heighth dimension, and including a pair of foot supports attached to its upper surface for engaging the feet of a rider standing thereon. This latter device is ridden by a rider standing on the upper surface of the body member, with his feet engaged by the foot supports, and jumping up and down to bounce the device across the ground. In either embodiment, the body member may be filled with a resilient material or be substantially hollow and inflatable. A reinforcing layer of resilient material is provided over the lower surface of the body member to protect it from damage caused by repeated contact with the ground as the device is ridden.