Wafer level hermetic bond using metal alloy with keeper layer
    1.
    发明授权
    Wafer level hermetic bond using metal alloy with keeper layer 有权
    晶圆级密封使用金属合金与保持层

    公开(公告)号:US08736081B2

    公开(公告)日:2014-05-27

    申请号:US13573201

    申请日:2012-08-30

    IPC分类号: H01L23/28

    摘要: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. The two metals may for an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. This alloy may have advantageous features in terms of density, mechanical, electrical or physical properties that may improve the hermeticity of the seal, for example.

    摘要翻译: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件,其中之一支撑该装置。 气密密封由两个金属层的合金形成,一个沉积在第一基板上,另一个沉积在第二基板上。 衬底中的至少一个可以包括形成在至少一个金属层下面的凸起特征。 两种金属可以在凸起特征的中点的任一侧上的至少两个位置中具有预定化学计量的合金。 例如,该合金在密度,机械,电学或物理性质方面可能具有有利的特征,这可以改善密封的气密性。

    Wafer level hermetic bond using metal alloy with keeper layer
    2.
    发明申请
    Wafer level hermetic bond using metal alloy with keeper layer 有权
    晶圆级密封使用金属合金与保持层

    公开(公告)号:US20120319303A1

    公开(公告)日:2012-12-20

    申请号:US13573201

    申请日:2012-08-30

    IPC分类号: H01L23/28 H01L21/56

    摘要: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. The two metals may for an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. This alloy may have advantageous features in terms of density, mechanical, electrical or physical properties that may improve the hermeticity of the seal, for example.

    摘要翻译: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件,其中之一支撑该装置。 气密密封由两个金属层的合金形成,一个沉积在第一基板上,另一个沉积在第二基板上。 衬底中的至少一个可以包括形成在至少一个金属层下面的凸起特征。 两种金属可以在凸起特征的中点的任一侧上的至少两个位置中具有预定化学计量的合金。 例如,该合金在密度,机械,电学或物理性质方面可能具有有利的特征,这可以改善密封的气密性。

    Wafer level hermetic bond using metal alloy with keeper layer
    5.
    发明申请
    Wafer level hermetic bond using metal alloy with keeper layer 有权
    晶圆级密封使用金属合金与保持层

    公开(公告)号:US20110024923A1

    公开(公告)日:2011-02-03

    申请号:US12923872

    申请日:2010-10-13

    IPC分类号: H01L23/31 H01L21/71

    摘要: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. One of the metal layer may have a diffusion barrier layer and a “keeper” layer formed thereover, wherein the keeper layers keeps the metal confined to a particular area. By using such a “keeper” layer, the substrate components may be heated to clean their surfaces, without activating or spending the bonding mechanism.

    摘要翻译: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件,其中之一支撑该装置。 气密密封由两个金属层的合金形成,一个沉积在第一基板上,另一个沉积在第二基板上。 衬底中的至少一个可以包括形成在至少一个金属层下面的凸起特征。 金属层中的一个可以具有扩散阻挡层和在其上形成的“保持器”层,其中保持层将金属限制在特定区域。 通过使用这种“保持器”层,可以加热衬底部件以清洁其表面,而不会激活或消耗粘合机构。

    Wafer level hermetic bond using metal alloy with keeper layer
    7.
    发明授权
    Wafer level hermetic bond using metal alloy with keeper layer 有权
    晶圆级密封使用金属合金与保持层

    公开(公告)号:US08288211B2

    公开(公告)日:2012-10-16

    申请号:US12923872

    申请日:2010-10-13

    IPC分类号: H01L21/00

    摘要: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. One of the metal layer may have a diffusion barrier layer and a “keeper” layer formed thereover, wherein the keeper layers keeps the metal confined to a particular area. By using such a “keeper” layer, the substrate components may be heated to clean their surfaces, without activating or spending the bonding mechanism.

    摘要翻译: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件,其中之一支撑该装置。 气密密封由两个金属层的合金形成,一个沉积在第一基板上,另一个沉积在第二基板上。 衬底中的至少一个可以包括形成在至少一个金属层下面的凸起特征。 金属层中的一个可以具有扩散阻挡层和在其上形成的保持层,其中保持层将金属限制在特定区域上。 通过使用这种保持层,基板部件可以被加热以清洁它们的表面,而不激活或消耗粘合机构。