摘要:
A memory device having an error notification function includes an error correction code (ECC) engine detecting and correcting an error bit by performing an ECC operation on data of the plurality of memory cells, and an error notifying circuit configured to output an error signal according to the ECC operation. The ECC engine outputs error information corresponding to the error bit corresponding to a particular address corrected by the ECC operation. The error notifying circuit may output the error signal when the particular address is not the same as any one of existing one or more failed addresses.
摘要:
An error correction apparatus includes an error correction circuit configured to selectively perform error correction on a portion of data that is at least one of written to and read from a plurality of memory cells of a memory device. The portion of data is at least one of written to and read from a subset of the plurality of memory cells, and the subset includes only fail cells among the plurality of memory cells. The error correction apparatus further includes a fail address storage circuit configured to store address information for the fail cells.
摘要:
A method of operating a volatile memory device includes storing address information of weak cell rows. According to some examples, after writing to a weak cell row, a refresh operation is performed on the weak cell row within a predetermined time. According to some examples, the writing operation to a weak cell row may be performed with a longer write recovery time than a write recovery time to normal cell rows.
摘要:
A stacked semiconductor memory device comprises an error correction code (ECC) controller that controls the number of bits in an ECC word and corrects errors in memory cell array layers using the ECC word.
摘要:
A stacked semiconductor memory device comprises memory cell array layers that are stacked in an inverted wedge shape and have different redundancy sizes from each other. The stacked semiconductor memory device has space for vertical connection between layers, a relatively small size, and a relatively high yield.
摘要:
A method for outputting internal temperature data in a semiconductor memory device can output, at high speed, relatively accurate temperature data externally, without continuously or periodically driving a temperature sensor. The method for outputting the internal temperature data comprises externally outputting internal temperature data stored in a register in a preceding driving cycle in response to a temperature data request signal; driving a temperature sensor during a predefined time section after the output of the internal temperature data is completed; and storing the internal temperature data obtained from the temperature sensor in the register. Power consumption is reduced and accurate temperature data is output externally within a shorter time.
摘要:
A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.
摘要:
A semiconductor memory device includes a memory cell array, a mode register set and a test circuit. The memory cell array includes a plurality of wordlines, a plurality of bitlines, and a plurality of spin-transfer torque magneto-resistive random access memory (STT-MRAM) cells, and each STT-MRAM cell disposed in a cross area of each wordline and bitline, and the STT-MRAM cell includes a magnetic tunnel junction (MTJ) element and a cell transistor. The MTJ element includes a free layer, a barrier layer and a pinned layer. A gate of the cell transistor is coupled to a wordline, a first electrode of the cell transistor is coupled to a bitline via the MTJ element, and a second electrode of the cell transistor is coupled to a source line. The mode register set is configured to set a test mode, and the test circuit is configured to perform a test operation by using the mode register set.
摘要:
A stacked semiconductor memory device comprises a semiconductor substrate having a functional circuit, a plurality of memory cell array layers, and at least one connection layer. The memory cell array layers are stacked above the semiconductor substrate. The connection layers are stacked above the semiconductor substrate independent of the memory cell array layers. The connection layers electrically connect memory cell selecting lines arranged on the memory cell array layers to the functional circuit.
摘要:
A semiconductor memory device and an arrangement method thereof are disclosed. The semiconductor memory device comprises column selecting signal lines and global data IO signal lines arranged on the same layer in the same direction above a memory cell array; word lines and first local data IO signal lines arranged on a different layer from the column selecting signal lines above the memory cell array, in a perpendicular direction to the column selecting signal lines; and second local data IO signal lines arranged on a different layer from the column selecting signal lines and the word lines above the memory cell array, in the same direction as the first local data IO signal lines.