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    Apparatus for ejecting relatively thin IC chip from semiconductor wafer
    3.
    发明申请
    Apparatus for ejecting relatively thin IC chip from semiconductor wafer 审中-公开
    用于从半导体晶片排出相对薄的IC芯片的装置

    公开(公告)号：US20060003491A1

    公开(公告)日：2006-01-05

    申请号：US11153750

    申请日：2005-06-14

    申请人： Goon-Woo Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin ,  Jong-Ung Lee

    发明人： Goon-Woo Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin ,  Jong-Ung Lee

    IPC分类号： H01L21/44

    CPC分类号： H01L21/67132

    摘要： An apparatus and method for ejecting a thin IC chip from a UV-sensitive tape attached to a bottom face of a semiconductor wafer, includes a vacuum holder that partly supports the UV-sensitive tape by applying vacuum force. The apparatus further includes an ejecting block inserted in the vacuum holder and configured to move vertically relative to the vacuum holder, and a plurality of ejecting pins inserted in the ejecting block and configured to move vertically and elastically. The ejecting pins move upward from the ejecting block driven by a pin-driving plate, detaching the IC chip from the UV-sensitive tape. Then the ejecting block moves upward from the vacuum holder driven by a block-driving shaft, applying a pressure to the bottom face of the IC chip.

    摘要翻译： 从安装在半导体晶片底面的紫外线敏感胶带排出薄IC芯片的装置和方法包括通过施加真空力部分地支撑UV敏感胶带的真空支架。 所述装置还包括插入所述真空保持器中并被配置为相对于所述真空保持件垂直移动的排出块，以及插入所述排出块中并被构造成垂直和弹性移动的多个排出销。 排出销从由销驱动板驱动的排出块向上移动，将IC芯片从紫外线敏感胶带分离。 然后，排出块从由块驱动轴驱动的真空保持器向上移动，向IC芯片的底面施加压力。

    Method of processing a semiconductor wafer for manufacture of semiconductor device
    4.
    发明授权
    Method of processing a semiconductor wafer for manufacture of semiconductor device 失效
    用于制造半导体器件的半导体晶片的处理方法

    公开(公告)号：US07452753B2

    公开(公告)日：2008-11-18

    申请号：US11172689

    申请日：2005-06-30

    申请人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

    发明人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

    IPC分类号： H01L21/00

    CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368

    摘要： A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.

    摘要翻译： 一种处理具有与第一表面相对的第一表面和第二表面的半导体晶片的方法。 该方法包括在其上形成有电路图案的第二表面上形成预定深度的凹槽，将保护带的第一表面附接到其上形成有凹槽的第二表面，将载带附着到保护层的第二表面上 带，使得半导体晶片的第一表面可以向上取向，将半导体晶片的第一表面除去预定的厚度，并通过凹槽将半导体晶片分成芯片，并将每个 在芯片的第一表面朝向上方的状态下的芯片接合器。 只需要一种管芯焊接机。 不需要UV型胶带。

    Package stack and manufacturing method thereof
    6.
    发明授权
    Package stack and manufacturing method thereof 有权
    封装堆栈及其制造方法

    公开(公告)号：US07420814B2

    公开(公告)日：2008-09-02

    申请号：US11100525

    申请日：2005-04-07

    申请人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

    发明人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

    IPC分类号： H05K1/14

    CPC分类号： H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/3511

    摘要： A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate. The first and the second packages may be stacked so that the active surface of the second IC may face and be electrically connected to a major surface of the first circuit substrate.

    摘要翻译： 包装堆叠可以包括第一包装和第二包装。 第一封装可以具有带有活性表面和背面的IC芯片。 有源表面可以连接到第一电路基板的第一主表面。 第二封装可以包括具有有源表面和后表面的第二IC芯片。 第二IC芯片的背面可以附接到第二电路基板的第一主表面，并且第二IC芯片的有源表面可以电连接到第二电路基板的第一主表面。 第一封装可以堆叠在第二封装上，使得第二封装的有源表面可以电连接到第一封装的第一电路基板的第二主表面。 一种方法可以包括提供具有第一IC芯片和第一电路基板的第一封装，并提供具有第二IC芯片和第二电路基板的第二封装。 可以堆叠第一和第二封装，使得第二IC的有源表面可以面对并且电连接到第一电路基板的主表面。