公开(公告)号：US20060255016A1

公开(公告)日：2006-11-16

申请号：US11489874

申请日：2006-07-19

申请人： Julia Svirchevski ,  Saket Chadda ,  Ismail Emesh ,  Thomas Laursen ,  Bentley Palmer ,  Sanjay Basak ,  Krishna Murella

发明人： Julia Svirchevski ,  Saket Chadda ,  Ismail Emesh ,  Thomas Laursen ,  Bentley Palmer ,  Sanjay Basak ,  Krishna Murella

IPC分类号： C03C15/00 ,  H01L21/461

CPC分类号： B24B27/0023 ,  B24B37/042 ,  B24B37/345 ,  H01L21/3212

摘要： A method for polishing a metal layer on a workpiece is provided wherein relative motion is produced between the metal layer and a polishing surface and wherein the metal layer has a polish resistant film thereon. The metal layer is first pre-treated to substantially remove the polish resistant film. Next, the metal layer is polished at low pressure between the metal layer and the polishing surface in the presence of a polishing solution. The pretreating may be accomplished by, for example, sputtering, polishing the polish-resistant film in the presence of abrasive polishing solution, polishing the polish-resistant film at higher pressures between the film and the polishing surface, maintaining the temperature of the pretreating step to be substantially between 10 degrees Centigrade and 30 degrees Centigrade, and chemically removing the film.

摘要翻译： 提供了一种在工件上抛光金属层的方法，其中在金属层和抛光表面之间产生相对运动，并且其中金属层在其上具有防抛光膜。 首先对金属层进行预处理以基本上除去耐抛光膜。 接着，在抛光液的存在下，金属层在金属层与研磨面之间以低压被抛光。 预处理可以通过例如溅射来实现，在研磨抛光溶液的存在下抛光耐抛光膜，在膜和抛光表面之间以更高的压力抛光耐抛光膜，保持预处理步骤的温度 基本上在10摄氏度和30摄氏度之间，并化学去除膜。

公开(公告)号：US06572755B2

公开(公告)日：2003-06-03

申请号：US09832657

申请日：2001-04-11

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/06 ,  C25D5/22 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/6723

摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

公开(公告)号：US07033464B2

公开(公告)日：2006-04-25

申请号：US10305860

申请日：2002-11-27

申请人： Ismail Emesh ,  Saket Chadda

发明人： Ismail Emesh ,  Saket Chadda

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/06 ,  C25D5/22 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/6723

摘要： A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one electrical conductor disposed therein. The multi-process workpiece apparatus also includes a planarization apparatus and at least one workpiece handling robot configured to transport a workpiece from the electrochemical deposition apparatus to the planarization apparatus.

公开(公告)号：US06736952B2

公开(公告)日：2004-05-18

申请号：US09781593

申请日：2001-02-12

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay N. Korovin ,  Brian L. Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay N. Korovin ,  Brian L. Mueller

IPC分类号： B23H508

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US06974525B2

公开(公告)日：2005-12-13

申请号：US10709598

申请日：2004-05-17

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay N. Korovin ,  Brian L. Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay N. Korovin ,  Brian L. Mueller

IPC分类号： B23H5/08 ,  B24B37/12 ,  B24B37/20 ,  H01L21/321 ,  C25F3/02

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US06849547B2

公开(公告)日：2005-02-01

申请号：US09826674

申请日：2001-04-05

申请人： Saket Chadda ,  Ismail Emesh ,  Brian L. Mueller

发明人： Saket Chadda ,  Ismail Emesh ,  Brian L. Mueller

IPC分类号： B24B57/02 ,  H01L21/321 ,  H01L21/302 ,  H01L21/461

CPC分类号： B24B57/02 ,  H01L21/3212

摘要： A process for removing a metallized surface from a workpiece is provided. A kinetic removal mechanism for removal of the metallized surface is characterized by a formation step for formation of a removable surface film and an abrasive step for removal of the film. The process includes causing the workpiece to contact a polishing surface while effecting relative motion between the workpiece and the polishing surface. The process also includes causing a polishing solution having less than 1 wt % of a polishing abrasive to be distributed at a contact area between the workpiece and the polishing surface so that the abrasive step is a rate-determining step of the removal mechanism.

摘要翻译： 提供了从工件去除金属化表面的工艺。 用于去除金属化表面的动力去除机构的特征在于形成可移除表面膜的形成步骤和用于除去膜的研磨步骤。 该过程包括使工件接触抛光表面，同时实现工件和抛光表面之间的相对运动。 该方法还包括使具有小于1重量％的抛光磨料的抛光溶液分布在工件和抛光表面之间的接触区域处，使得研磨步骤是除去机构的速率确定步骤。

公开(公告)号：US08268135B2

公开(公告)日：2012-09-18

申请号：US11164270

申请日：2005-11-16

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay N Korovin ,  Brian L Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay N Korovin ,  Brian L Mueller

IPC分类号： C25F3/16 ,  C25F3/30

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US20060081460A1

公开(公告)日：2006-04-20

申请号：US11164270

申请日：2005-11-16

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25D17/00 ,  C25B9/00

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US20050121969A1

公开(公告)日：2005-06-09

申请号：US10729119

申请日：2003-12-04

申请人： Ismail Emesh ,  Bentley Palmer

发明人： Ismail Emesh ,  Bentley Palmer

IPC分类号： B24B7/22 ,  B24B55/02 ,  B60B7/00 ,  C09G1/02

CPC分类号： B24B55/02 ,  B24B7/228 ,  C09G1/02

摘要： A polishing fluid for a chemical-mechanical polishing process, an apparatus including the polishing fluid, and methods for making and using the polishing fluid, the fluid including a surfactant having an aliphatic structure, a buffer for maintaining the polishing fluid at a pH ranging between about 5 and about 14, and a chelating agent.

摘要翻译： 一种用于化学机械抛光工艺的抛光液，包括抛光液的设备，以及制造和使用抛光液的方法，所述流体包括具有脂族结构的表面活性剂，用于将抛光液保持在pH范围 约5至约14，和螯合剂。

公开(公告)号：US20050016681A1

公开(公告)日：2005-01-27

申请号：US10921666

申请日：2004-08-18

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

IPC分类号： B23H5/08 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00 ,  H01L21/288 ,  H01L21/321 ,  C23F1/00

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又由与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层以及设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。