公开(公告)号：US20100091630A1

公开(公告)日：2010-04-15

申请号：US12525227

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L21/78 ,  H01L23/29

CPC分类号： G11B7/1275 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices.

摘要翻译： 多个平行肋原型设置在平坦的基板上。 多个半导体元件被放置在相邻的肋原型之间的每个沟槽中，并且透明构件被结合到每个半导体元件。 半导体元件的电极焊盘被引线接合到连接电极。 然后用封装树脂填充沟槽。 此后，用切割锯切割肋骨原型的纵向中间部分，并且相邻的半导体元件彼此分离，从而获得半导体器件。

公开(公告)号：US20100008203A1

公开(公告)日：2010-01-14

申请号：US12525779

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L31/02 ,  H01L21/50

CPC分类号： H01L27/14618 ,  G11B7/12 ,  H01L23/055 ,  H01L23/3185 ,  H01L24/97 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires.

摘要翻译： 半导体元件安装在包装件的矩形基座上，该基座和肋设置在基座的一对相对的外缘上。 设置在肋上表面上的半导体元件和连接电极的电极焊盘通过金属线彼此连接。 在肋上表面上，间隔件设置在比连接电极更靠近外部的位置处。 透明盖粘附到间隔物的上表面以覆盖整个包装的整个表面。 间隔件的高度大于金属丝的直径。

公开(公告)号：US20100091633A1

公开(公告)日：2010-04-15

申请号：US12525217

申请日：2008-03-10

申请人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/135 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L31/0203 ,  G11B7/123 ,  G11B7/1275 ,  G11B7/13 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other.

摘要翻译： 制备包括连接电极，内部互连和外部连接部分的平板预板板。 将该预板板切割成相邻的连接电极之间的部分，从而形成沟槽。 多个半导体元件被放置在每个沟槽中。 电极焊盘和连接电极通过金属线彼此连接。 将透明盖放置在隔离物上并结合到覆盖半导体元件上。 此后，布置在相邻的沟槽之间的两条连接电极彼此分离。 随后，相邻的半导体元件也彼此分离。

公开(公告)号：US20100001174A1

公开(公告)日：2010-01-07

申请号：US12525499

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： H01J3/14 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L27/14683 ,  G11B7/1275 ,  G11B7/13 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2224/85 ,  H01L2924/00

摘要： In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams.

摘要翻译： 在半导体器件中，半导体元件安装在大致矩形的封装上。 第一肋分别设置在安装表面的一对相对的外边缘上并从该对相对的外边缘向上突出。 盖的外边缘放置在第一肋的上表面上，并用粘合剂固定在其上。 大坝设置在第一肋上表面的外边缘上。 粘合剂从盖的侧表面连续存在于坝。

公开(公告)号：US20110001208A1

公开(公告)日：2011-01-06

申请号：US12918023

申请日：2009-02-26

申请人： Junya Furuyashiki ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Toshimasa Itooka ,  Hiroki Utatsu

发明人： Junya Furuyashiki ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Toshimasa Itooka ,  Hiroki Utatsu

IPC分类号： H01L31/0203 ,  H01L31/18 ,  H01L35/22

CPC分类号： H01L31/0203 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

摘要： An insulation is provided in a portion surrounding a light receiving portion in a semiconductor element, and a sealing resin is provided around the insulation, thereby warping the insulation outward when viewed from the light receiving portion to prevent diffuse light from returning to the light receiving portion of the semiconductor element.

摘要翻译： 在半导体元件的光接收部周围的部分设置有绝缘体，在绝缘体周围设置密封树脂，从而从光接收部观察时向外翘曲绝缘体，防止扩散光返回到受光部 的半导体元件。

公开(公告)号：US20100308468A1

公开(公告)日：2010-12-09

申请号：US12867804

申请日：2009-03-02

申请人： Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Junya Furuyashiki ,  Toshimasa Itooka ,  Hiroki Utatsu

发明人： Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Junya Furuyashiki ,  Toshimasa Itooka ,  Hiroki Utatsu

IPC分类号： H01L23/28 ,  H01L21/78

CPC分类号： H01L23/49805 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a semiconductor device made of a plurality of materials, if the device is fabricated through a step of cutting the bonded plurality of materials, a boundary line of the plurality of materials is exposed on a cutting plane. Internal stress in the cutting remains at this boundary line to allow moisture and corrosive gas to easily enter into the device. In order to reduce the entrance of the moisture, the gas, and the like, the boundary appearing on the cutting plane is covered by a covering layer. At this time, partial cutting exposing the boundary line and not separating semiconductor devices are performed so that the covering layer can be formed with the plurality of semiconductor devices attached to the substrate.

摘要翻译： 在由多种材料制成的半导体器件中，如果通过切割粘合的多种材料的步骤制造器件，则在切割平面上暴露多种材料的边界线。 切割中的内部应力保持在该边界线处，以允许湿气和腐蚀性气体容易地进入该装置。 为了减少水分，气体等的入口，出现在切割平面上的边界被覆盖层覆盖。 此时，进行露出边界线而不分离半导体器件的部分切割，使得覆盖层可以形成有附接到基板的多个半导体器件。

公开(公告)号：US08274125B2

公开(公告)日：2012-09-25

申请号：US12918023

申请日：2009-02-26

申请人： Junya Furuyashiki ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Toshimasa Itooka ,  Hiroki Utatsu

发明人： Junya Furuyashiki ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Toshimasa Itooka ,  Hiroki Utatsu

IPC分类号： H01L27/146

CPC分类号： H01L31/0203 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

摘要： An insulation is provided in a portion surrounding a light receiving portion in a semiconductor element, and a sealing resin is provided around the insulation, thereby warping the insulation outward when viewed from the light receiving portion to prevent diffuse light from returning to the light receiving portion of the semiconductor element.

摘要翻译： 在半导体元件的光接收部周围的部分设置有绝缘体，在绝缘体周围设置密封树脂，从而从光接收部观察时向外翘曲绝缘体，防止扩散光返回到受光部 的半导体元件。

公开(公告)号：US20130043502A1

公开(公告)日：2013-02-21

申请号：US13695752

申请日：2011-03-26

申请人： Kenichi Koya ,  Tadaaki Ikeda ,  Michio Miyawaki ,  Hiroki Utatsu

发明人： Kenichi Koya ,  Tadaaki Ikeda ,  Michio Miyawaki ,  Hiroki Utatsu

IPC分类号： H01L33/62 ,  H01L33/60

CPC分类号： H01L33/486 ,  B29C39/10 ,  B29C45/14639 ,  B29L2011/00 ,  H01L24/48 ,  H01L24/73 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A light emitting device 10 includes a light emitting element 11, a package 13 in which the light emitting element 11 is accommodated, and a sealing member 14 configured to seal the light emitting element 11. The package 13 includes a base 13B configured to hold the light emitting element 11 and a frame part 13A vertically standing on the base 13B so as to surround the light emitting element 11. The sealing member 14 is embedded in a region surrounded by the frame part 13A. The frame part 13A includes a protruding wall 15 upwardly protruding from an upper end surface 132a of the frame part 13A and provided so as to surround the light emitting element 11.

摘要翻译： 发光器件10包括发光元件11，容纳有发光元件11的封装13以及密封构件14，密封构件14用于密封发光元件11.封装13包括：基座13B， 发光元件11和围绕发光元件11的底座13B垂直地竖立的框架部13A。密封构件14嵌入由框架部13A包围的区域中。 框架部13A包括从框架部13A的上端面132a向上方突出并设置为围绕发光元件11的突出壁15。