-
公开(公告)号：US20120192789A1
公开(公告)日：2012-08-02
申请号：US13341965
申请日：2011-12-31
申请人： Karl-Josef Kramer , Mehrdad M. Moslehi , Seiichi Yokoi , George D. Kamian , Shashank Sharma , Jay Ashjaee
发明人： Karl-Josef Kramer , Mehrdad M. Moslehi , Seiichi Yokoi , George D. Kamian , Shashank Sharma , Jay Ashjaee
IPC分类号： C23C16/455 , C23C16/458 , C23C16/52
CPC分类号： C23C16/45502 , C23C16/4412 , C23C16/45517 , C23C16/4582 , C23C16/4583 , C23C16/4587 , C23C16/481 , C30B25/12 , C30B25/14 , C30B29/06
摘要： This disclosure enables gas recovery and utilization for use in deposition systems and processes. The system includes a thin-film semiconductor layer deposition system comprising a deposition reactor, precursor gas feeds, and a gas recovery system.
摘要翻译： 该公开使得能够用于沉积系统和工艺中的气体回收和利用。 该系统包括薄膜半导体层沉积系统，其包括沉积反应器，前体气体进料和气体回收系统。
-
2.发明申请DOUBLE-SIDED REUSABLE TEMPLATE FOR FABRICATION OF SEMICONDUCTOR SUBSTRATES FOR PHOTOVOLTAIC CELL AND MICROELECTRONICS DEVICE MANUFACTURING 有权用于制造用于光电晶体和微电子器件制造的半导体衬底的双面可重复模板公开(公告)号：US20110256654A1
公开(公告)日：2011-10-20
申请号：US13026239
申请日：2011-02-12
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D Kamian , Jay Ashjaee , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D Kamian , Jay Ashjaee , Takao Yonehara
CPC分类号： H01L21/20 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： This disclosure presents manufacturing methods and apparatus designs for making TFSSs from both sides of a re-usable semiconductor template, thus effectively increasing the substrate manufacturing throughput and reducing the substrate manufacturing cost. This approach also reduces the amortized starting template cost per manufactured substrate (TFSS) by about a factor of 2 for a given number of template reuse cycles.
摘要翻译： 本公开提供了从可再使用的半导体模板的两侧制造TFSS的制造方法和装置设计，从而有效地增加了基板制造的吞吐量并降低了基板的制造成本。 对于给定数量的模板重用周期，这种方法还将每个制造的衬底（TFSS）的平均起始模板成本降低约2倍。
-
公开(公告)号：US20120085278A1
公开(公告)日：2012-04-12
申请号：US13157250
申请日：2011-06-09
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , Jay Ashjaee , George D. Kamian , David Mordo , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , Jay Ashjaee , George D. Kamian , David Mordo , Takao Yonehara
IPC分类号： C30B23/06 , H01L21/673 , C30B23/02 , C23C16/455 , C23C16/46
CPC分类号： H01L21/67754 , C23C16/45585 , C23C16/481 , C23C16/54 , H01L21/02532 , H01L21/0262 , H01L21/6719 , H01L21/67757
摘要： High productivity thin film deposition methods and tools are provided wherein a thin film semiconductor material layer with a thickness in the range of less than 1 micron to 100 microns is deposited on a plurality of wafers in a reactor. The wafers are loaded on a batch susceptor and the batch susceptor is positioned in the reactor such that a tapered gas flow space is created between the susceptor and an interior wall of the reactor. Reactant gas is then directed into the tapered gas space and over each wafer thereby improving deposition uniformity across each wafer and from wafer to wafer.
摘要翻译： 提供了高生产率薄膜沉积方法和工具，其中厚度在小于1微米至100微米范围内的薄膜半导体材料层沉积在反应器中的多个晶片上。 将晶片装载在分批基座上，并且批量基座位于反应器中，使得在基座和反应器的内壁之间形成锥形气体流动空间。 然后将反应性气体引导到锥形气体空间中并遍及每个晶片，从而改善每个晶片和从晶片到晶片的沉积均匀性。
-
4.发明授权公开(公告)号：US09870937B2
公开(公告)日：2018-01-16
申请号：US13157250
申请日：2011-06-09
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , Jay Ashjaee , George D. Kamian , David Mordo , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , Jay Ashjaee , George D. Kamian , David Mordo , Takao Yonehara
IPC分类号： C30B25/14 , H01L21/677 , C23C16/455 , C23C16/48 , C23C16/54 , H01L21/67 , H01L21/02
CPC分类号： H01L21/67754 , C23C16/45585 , C23C16/481 , C23C16/54 , H01L21/02532 , H01L21/0262 , H01L21/6719 , H01L21/67757
摘要： High productivity thin film deposition methods and tools are provided wherein a thin film semiconductor material layer with a thickness in the range of less than 1 micron to 100 microns is deposited on a plurality of wafers in a reactor. The wafers are loaded on a batch susceptor and the batch susceptor is positioned in the reactor such that a tapered gas flow space is created between the susceptor and an interior wall of the reactor. Reactant gas is then directed into the tapered gas space and over each wafer thereby improving deposition uniformity across each wafer and from wafer to wafer.
-
5.发明授权Apparatus for forming porous silicon layers on at least two surfaces of a plurality of silicon templates 有权用于在多个硅模板的至少两个表面上形成多孔硅层的装置公开(公告)号：US09401276B2
公开(公告)日：2016-07-26
申请号：US13554103
申请日：2012-07-20
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D. Kamian , Jay Ashjaee , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D. Kamian , Jay Ashjaee , Takao Yonehara
CPC分类号： H01L21/20 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： An apparatus for forming porous silicon layers on at least two surfaces of a plurality of silicon templates in a batch electrochemical anodic etch process is provided. The apparatus comprises a plurality of edge-sealing template mounts operable to prevent formation of porous silicon at the edges of a plurality of templates. An electrolyte is disposed among the plurality of templates. The apparatus further comprises a power supply operable to switch polarity, change current intensity, and control etching time to produce the porous silicon layers.
摘要翻译： 提供了一种在批次电化学阳极蚀刻工艺中在多个硅模板的至少两个表面上形成多孔硅层的装置。 该装置包括多个边缘密封模板安装件，其可操作以防止在多个模板的边缘处形成多孔硅。 在多个模板中设置电解质。 该装置还包括可操作以切换极性，改变电流强度和控制蚀刻时间以产生多孔硅层的电源。
-
6.发明申请DOUBLE-SIDED REUSABLE TEMPLATE FOR FABRICATION OF SEMICONDUCTOR SUBSTRATES FOR PHOTOVOLTAIC CELL AND MICROELECTRONICS DEVICE MANUFACTURING 有权用于制造用于光电晶体和微电子器件制造的半导体衬底的双面可重复模板公开(公告)号：US20130171808A1
公开(公告)日：2013-07-04
申请号：US13554103
申请日：2012-07-20
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D. Kamian , Jay Ashjaee , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D. Kamian , Jay Ashjaee , Takao Yonehara
IPC分类号： H01L21/20
CPC分类号： H01L21/20 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： This disclosure presents manufacturing methods and apparatus designs for making TFSSs from both sides of a re-usable semiconductor template, thus effectively increasing the substrate manufacturing throughput and reducing the substrate manufacturing cost. This approach also reduces the amortized starting template cost per manufactured substrate (TFSS) by about a factor of 2 for a given number of template reuse cycles.
摘要翻译： 本公开提供了从可再使用的半导体模板的两侧制造TFSS的制造方法和装置设计，从而有效地增加了基板制造的吞吐量并降低了基板的制造成本。 对于给定数量的模板重用周期，这种方法还将每个制造的衬底（TFSS）的平均起始模板成本降低约2倍。
-
7.发明授权Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing 有权用于制造用于光伏电池和微电子器件制造的半导体衬底的双面可重复使用的模板公开(公告)号：US08241940B2
公开(公告)日：2012-08-14
申请号：US13026239
申请日：2011-02-12
申请人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D Kamian , Jay Ashjaee , Takao Yonehara
发明人： Mehrdad M. Moslehi , Karl-Josef Kramer , David Xuan-Qi Wang , Pawan Kapur , Somnath Nag , George D Kamian , Jay Ashjaee , Takao Yonehara
IPC分类号： H01L21/00
CPC分类号： H01L21/20 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： This disclosure presents manufacturing methods and apparatus designs for making TFSSs from both sides of a re-usable semiconductor template, thus effectively increasing the substrate manufacturing throughput and reducing the substrate manufacturing cost. This approach also reduces the amortized starting template cost per manufactured substrate (TFSS) by about a factor of 2 for a given number of template reuse cycles.
摘要翻译： 本公开提供了从可再使用的半导体模板的两侧制造TFSS的制造方法和装置设计，从而有效地增加了基板制造的吞吐量并降低了基板的制造成本。 对于给定数量的模板重用周期，这种方法还将每个制造的衬底（TFSS）的平均起始模板成本降低约2倍。
-
8.发明申请APPARATUS AND METHODS FOR UNIFORMLY FORMING POROUS SEMICONDUCTOR ON A SUBSTRATE 有权在基板上均匀形成多孔半导体的装置和方法公开(公告)号：US20120145553A1
公开(公告)日：2012-06-14
申请号：US13288721
申请日：2011-11-03
申请人： Karl-Josef Kramer , Mehrdad M. Moslehi , Subramanian Tamilmani , George D. Kamian , Jay Ashjaee , Takao Yonehara
发明人： Karl-Josef Kramer , Mehrdad M. Moslehi , Subramanian Tamilmani , George D. Kamian , Jay Ashjaee , Takao Yonehara
CPC分类号： C25D11/005 , C25D7/12 , C25D11/022 , C25D11/024 , C25D11/32 , C25D17/001 , C25D17/008 , C25D17/08 , C25D21/04 , C25F7/00
摘要： This disclosure enables high-productivity controlled fabrication of uniform porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.
摘要翻译： 本公开使得能够高生产率控制制造均匀的多孔半导体层（由单层或多层多孔半导体（例如多孔硅，包括单孔隙或多孔层）制成）。 一些应用包括制造用于脱模和MEMS器件制造，膜形成和浅沟槽隔离（STI）多孔硅的MEMS分离和牺牲层（使用具有最佳孔隙率的多孔硅形成及其随后的氧化）。 此外，本公开适用于光伏技术的MEMS领域，包括传感器和执行器，独立的或与集成半导体微电子，半导体微电子芯片和光电子集成。
-
公开(公告)号：US20120167819A1
公开(公告)日：2012-07-05
申请号：US13341976
申请日：2011-12-31
申请人： Karl-Josef Kramer , Mehrdad M. Moslehi , David Xuan-Qi Wang , Rahim Kavari , Rafael Ricolcol , Jay Ashjaee
发明人： Karl-Josef Kramer , Mehrdad M. Moslehi , David Xuan-Qi Wang , Rahim Kavari , Rafael Ricolcol , Jay Ashjaee
IPC分类号： C30B25/18
CPC分类号： H01L21/02532 , H01L21/02381 , H01L21/02428 , H01L21/0243 , H01L21/0245 , H01L21/02513 , H01L21/0259 , H01L31/02363 , H01L31/035281 , H01L31/18 , H01L31/1892 , Y02E10/50
摘要： The disclosed subject matter pertains to deposition of thin film or thin foil materials in general, but more specifically to deposition of epitaxial monocrystalline or quasi-monocrystalline silicon film (epi film) for use in manufacturing of high efficiency solar cells. In operation, methods are disclosed which extend the reusable life and to reduce the amortized cost of a substrate or template used in the manufacturing process of silicon solar cells. Further, methods are disclosed which provide for the conversion of a low quality starting surface into an improved quality starting surface of a silicon wafer.
摘要翻译： 所公开的主题一般涉及薄膜或薄箔材料的沉积，更具体地涉及用于制造高效率太阳能电池的外延单晶或准单晶硅膜（epi膜）的沉积。 在操作中，公开了延长可再利用寿命并降低在硅太阳能电池的制造过程中使用的基板或模板的摊销成本的方法。 此外，公开了提供将低质量起始表面转化为硅晶片的改进质量起始表面的方法。
-
10.发明授权Apparatus and methods for uniformly forming porous semiconductor on a substrate 有权在基板上均匀地形成多孔半导体的装置和方法公开(公告)号：US08906218B2
公开(公告)日：2014-12-09
申请号：US13288721
申请日：2011-11-03
申请人： Karl-Josef Kramer , Mehrdad M. Moslehi , Subramanian Tamilmani , George Kamian , Jay Ashjaee , Takao Yonehara
发明人： Karl-Josef Kramer , Mehrdad M. Moslehi , Subramanian Tamilmani , George Kamian , Jay Ashjaee , Takao Yonehara
CPC分类号： C25D11/005 , C25D7/12 , C25D11/022 , C25D11/024 , C25D11/32 , C25D17/001 , C25D17/008 , C25D17/08 , C25D21/04 , C25F7/00
摘要： This disclosure enables high-productivity controlled fabrication of uniform porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.
摘要翻译： 本公开使得能够高生产率控制制造均匀的多孔半导体层（由单层或多层多孔半导体（例如多孔硅，包括单孔隙或多孔层）制成）。 一些应用包括制造用于脱模和MEMS器件制造，膜形成和浅沟槽隔离（STI）多孔硅的MEMS分离和牺牲层（使用具有最佳孔隙率的多孔硅形成及其随后的氧化）。 此外，本公开适用于光伏技术的MEMS领域，包括传感器和执行器，独立的或与集成半导体微电子，半导体微电子芯片和光电子集成。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.034 秒)
