摘要:
The present invention provides a method of preventing a metal from corroding by giving a high corrosion resistance in the state of retaining the functions of the metal surface, a surface of a thin film material particularly. A stable silane coupling layer which has a robust bond is formed on a metal surface by using a silane coupling agent and an oxidizer in combination.
摘要:
A discrete track medium and a patterned medium that are excellent in both magnetic recording properties and corrosion resistance are realized. The medium has a magnetic recording layer, which includes a magnetic region formed in a projection portion of a projection/recess pattern over a substrate and a filler region embedded in a recess portion of the projection/recess pattern, and an organic compound, which exhibits corrosion inhibition action for cobalt or cobalt alloys, between the magnetic region and the filler region.
摘要:
A polishing liquid for CMP has a composition loaded with, for example, an inorganic salt, a protective film forming agent and a surfactant capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid for CMP, there can be simultaneously accomplished a speed increase for increasing CMP productivity, and wiring planarization for miniaturization and multilayer formation of wiring.
摘要:
A polishing liquid for CMP has a composition loaded with, for example, an inorganic salt, a protective film forming agent and a surfactant capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid for CMP, there can be simultaneously accomplished a speed increase for increasing CMP productivity, and wiring planarization for miniaturization and multilayer formation of wiring.
摘要:
A CMP slurry is mixed with an oxidant in polishing and contains a copper rust inhibitor, a water-soluble polymer, a pH controller capable of forming a complex with copper, and water, and is substantially free from abrasive. The CMP slurry effectively reduces dishing in chemical polishing of copper and forms reliable wiring. Preferably, the contents of the rust inhibitor, the water-soluble polymer, and the oxidant are 0.1 to 5 wt %, 0.05 to 5 wt %, and 0.01 to 5M relative to 1 liter of the CMP slurry, respectively, and the amount of the pH controller is a necessary amount for adjusting pH of the CMP slurry to 1.5 to 2.5.
摘要:
In an electrode in electrochemical device, particularly an anode lithium ion secondary battery, a cathode for use in alkali storage battery, an electrode for use in fuel cell, or a capacitor electrode, a metal structure has nano size micro-pillars is constructed with an electrode active material being formed on the surface of the metal structure. The metal structure having nano size micro-pillars can be formed, for example, by forming a metal layer as an electrode material by plating to the surface of a substrate having pores and then removing the substrate by dissolution, the metal filled in the pores of the substrate to form a group of micro-pillars. And the active material can be formed by depositing metal by plating. Since the active material is in direct contact with the conductive skeleton, the conducting agent for connecting the active materials to each other may not be added at all.
摘要:
In an electrode in electrochemical device, particularly an anode lithium ion secondary battery, a cathode for use in alkali storage battery, an electrode for use in fuel cell, or a capacitor electrode, a metal structure has nano size micro-pillars is constructed with an electrode active material being formed on the surface of the metal structure. The metal structure having nano size micro-pillars can be formed, for example, by forming a metal layer as an electrode material by plating to the surface of a substrate having pores and then removing the substrate by dissolution, the metal filled in the pores of the substrate to form a group of micro-pillars. And the active material can be formed by depositing metal by plating. Since the active material is in direct contact with the conductive skeleton, the conducting agent for connecting the active materials to each other may not be added at all.
摘要:
A discrete track medium and a patterned medium that are excellent in both magnetic recording properties and corrosion resistance are realized. The medium has a magnetic recording layer, which includes a magnetic region formed in a projection portion of a projection/recess pattern over a substrate and a filler region embedded in a recess portion of the projection/recess pattern, and an organic compound, which exhibits corrosion inhibition action for cobalt or cobalt alloys, between the magnetic region and the filler region.
摘要:
Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.
摘要:
The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.