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公开(公告)号：US06351399B2
公开(公告)日：2002-02-26
申请号：US09794053
申请日：2001-02-28
IPC分类号： H02H7122
CPC分类号： H02M1/08 , H02M7/538 , H02M7/5387
摘要： To prevent malfunction or breakdown due to a surge voltage in a power converter for converting DC into AC or the like so as to supply electric power to a load, not only a control signal is transmitted via a level shift circuit which is provided correspondingly to each of switching semiconductor elements forming a main circuit and shifts a level of a reference potential at its output side so as to follow variations of a reference potential of the switching semiconductor element to the switching semiconductor element, but a DC control power source for supplying electric power to the level shift circuit and a negative pole of the switching semiconductor element are connected to each other through at least one of an inductor and a resistance.
摘要翻译： 为了防止由于用于将DC转换成AC等的功率转换器中的浪涌电压的故障或故障，以便向负载提供电力，不仅通过电平移位电路发送控制信号，电平移位电路相应地被提供给每个 形成主电路的半导体元件的切换，并使其输出侧的基准电位的电平偏移，以使切换半导体元件的基准电位与开关用半导体元件的变化相对应，而用于供给电力的直流控制电源 并且通过电感器和电阻中的至少一个将开关半导体元件的负极连接到电平移位电路。
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公开(公告)号：US06529062B2
公开(公告)日：2003-03-04
申请号：US09767226
申请日：2001-01-23
申请人： Gourab Majumdar , Mitsutaka Iwasaki , Shinji Hatae , Fumitaka Tametani , Toru Iwagami , Akihisa Yamamoto
发明人： Gourab Majumdar , Mitsutaka Iwasaki , Shinji Hatae , Fumitaka Tametani , Toru Iwagami , Akihisa Yamamoto
IPC分类号： H03K17687
CPC分类号： H01L24/49 , H01L24/48 , H01L25/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/49109 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01023 , H01L2924/01042 , H01L2924/01058 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01084 , H01L2924/01088 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H03K2017/0806 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A power module is provided with an insulating substrate with a heat sink being bonded to one surface thereof and a circuit pattern being formed on the other surface. The circuit pattern is formed by an electrode layer. A switching semiconductor element and a free wheeling diode that is connected to a switching semiconductor element in anti-parallel therewith are placed on the circuit pattern. A controlling IC for controlling the switching semiconductor element is placed on the free wheeling diode. Thus, it is possible to make the entire power module compact, and it becomes possible to provide an inexpensive power module which can prevent the controlling IC from malfunctioning due to heat generated by the switching semiconductor element.
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公开(公告)号：US5444297A
公开(公告)日：1995-08-22
申请号：US75316
申请日：1993-06-11
申请人： Seiichi Oshima , Fumitaka Tametani , Jun Yamagata , Ken Takanashi
发明人： Seiichi Oshima , Fumitaka Tametani , Jun Yamagata , Ken Takanashi
IPC分类号： H01L29/78 , H01L23/538 , H01L23/64 , H01L25/07 , H01L25/16 , H01L25/18 , H01L27/04 , H01L29/739 , H02M7/5387 , H05K1/02 , H05K1/14 , H05K3/46 , H05K9/00 , H01L23/12 , H01L23/52 , H01L25/065
CPC分类号： H01L25/162 , H01L23/5383 , H01L23/642 , H01L24/06 , H01L24/49 , H01L25/16 , H05K1/0218 , H05K9/0039 , H01L2223/6644 , H01L2224/04042 , H01L2224/05599 , H01L2224/48091 , H01L2224/48137 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/3025 , H05K1/0219 , H05K1/0262 , H05K1/144 , H05K2201/093 , H05K2201/10015 , H05K2201/10689
摘要： In a circuit board having four-layered conductive pattern on which a control circuit is arranged, wiring sub-patterns 133a in the first layer are divided into four areas A1-A3 and A8, for respective sets of circuit parts having same power potentials. Respective sub-patterns belonging to the areas A1-A3 are partially or fully surrounded by wiring sub-patterns PEa1 PEa3 connected to negative power potentials of circuit parts belonging to respective areas, respectively. Similarly, at least part of a wiring patten Pa2 for transmitting an input signal to a semiconductor active element is surrounded by a wiring pattern PEa4. Penetration of electric noises to the wiring patterns for the control circuit, in particular to the wiring pattern for transmitting the input signal to semiconductor element, is decreased to thereby prevent misoperation due to electric noises.
摘要翻译： 在具有布置有控制电路的四层导电图案的电路板中，对于具有相同功率电位的各组电路部分，将第一层中的布线子图案133a分成四个区域A1-A3和A8。 属于区域A1-A3的各个子图案分别被部分地或完全地被连接到属于各个区域的电路部分的负功率电位的布线子图案PEa1 PEa3包围。 类似地，用于将输入信号发送到半导体有源元件的布线图案Pa2的至少一部分被布线图案PEa4包围。 对于控制电路的布线图案，特别是用于将输入信号传送到半导体元件的布线图形，电噪声的渗透被减小，从而防止由于电噪声引起的误操作。
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4.发明授权Semiconductor device, and life prediction circuit and life prediction method for semiconductor device 有权半导体器件，半导体器件的寿命预测电路和寿命预测方法公开(公告)号：US08004304B2
公开(公告)日：2011-08-23
申请号：US11543912
申请日：2006-10-06
IPC分类号： G01R31/26
CPC分类号： H01L22/34 , G01R31/2884 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05599 , H01L2224/0603 , H01L2224/48091 , H01L2224/48463 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/1305 , H01L2924/13055 , H01L2924/19043 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： A life prediction wire 14 is connected to an emitter-wire bonding pad 2 of a semiconductor device 1. Wire deterioration is detected by checking whether or not an electric current flows from the life prediction wire 14 to the emitter-wire bonding pad 2. Thus, by directly checking a deterioration state of the semiconductor device, the life of the semiconductor device is predicted.
摘要翻译： 寿命预测线14连接到半导体装置1的发射线接合焊盘2.通过检查电流是否从寿命预测导线14流到发射极接合焊盘2来检测线劣化。因此 通过直接检查半导体器件的劣化状态，预测半导体器件的寿命。
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公开(公告)号：US07102294B2
公开(公告)日：2006-09-05
申请号：US10965207
申请日：2004-10-15
IPC分类号： G09G3/10
CPC分类号： H05K5/02 , H05K7/20963
摘要： A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.
摘要翻译： 提供用于显示图像的显示面板，用于驱动显示面板的驱动电路和用于支撑显示面板的后板。 驱动电路包括固定在后板上的电路板，表面安装在电路板上以连接到形成在显示面板上的多个电极的半导体器件和附接到半导体器件的与 安装在电路板上的表面几乎与后板平行。
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公开(公告)号：US20050242748A1
公开(公告)日：2005-11-03
申请号：US10965207
申请日：2004-10-15
CPC分类号： H05K5/02 , H05K7/20963
摘要： A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.
摘要翻译： 提供用于显示图像的显示面板，用于驱动显示面板的驱动电路和用于支撑显示面板的后板。 驱动电路包括固定在后板上的电路板，表面安装在电路板上以连接到形成在显示面板上的多个电极的半导体器件和附接到半导体器件的与 安装在电路板上的表面几乎与后板平行。
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7.发明申请Semiconductor device, and life prediction circuit and life prediction method for semiconductor device 有权半导体器件，半导体器件的寿命预测电路和寿命预测方法公开(公告)号：US20070296040A1
公开(公告)日：2007-12-27
申请号：US11543912
申请日：2006-10-06
IPC分类号： H01L23/62
CPC分类号： H01L22/34 , G01R31/2884 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05599 , H01L2224/0603 , H01L2224/48091 , H01L2224/48463 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/1305 , H01L2924/13055 , H01L2924/19043 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： A life prediction wire 14 is connected to an emitter-wire bonding pad 2 of a semiconductor device 1. Wire deterioration is detected by checking whether or not an electric current flows from the life prediction wire 14 to the emitter-wire bonding pad 2. Thus, by directly checking a deterioration state of the semiconductor device, the life of the semiconductor device is predicted.
摘要翻译： 寿命预测线14连接到半导体装置1的发射线接合焊盘2.通过检查电流是否从寿命预测导线14流到发射极接合焊盘2来检测线劣化。因此 通过直接检查半导体器件的劣化状态，预测半导体器件的寿命。
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