公开(公告)号：US20060231853A1

公开(公告)日：2006-10-19

申请号：US10565601

申请日：2004-09-24

申请人： Kenichiro Tanaka ,  Masao Kubo

发明人： Kenichiro Tanaka ,  Masao Kubo

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

摘要： In a light-emitting device and its manufacturing method, mounting by batch process with surface-mount technology, high light extraction efficiency, and low manufacturing cost are realized. The light-emitting device 1 comprises semiconductor layers (2, 3) of p-type and n-type nitride semiconductor, semiconductor-surface-electrodes (21, 31) to apply currents into each of the semiconductor layers (2, 3), an insulating layer 4 which holds the semiconductor layers (2, 3), and mount-surface-electrodes (5). The semiconductor layers (2) has a non-deposited area 20 where the other semiconductor layer (3) is not deposited. The insulating layer (4) has VIA 10 which electrically connect the mount-surface-electrodes 5 and the semiconductor-surface-electrodes (21, 31). In the manufacturing process, firstly. semiconductor layers (2, 3) and semiconductor-surface-electrodes (21, 31) are deposited on the transparent crystal substrate, and by using build-up process, insulating layer (4) and the mount-surface-electrodes (5) are formed, and secondly, VIA 10 are formed. and finally, the transparent crystal substrate is separated to get light-emitting device (1). Light can be extracted directly and efficiently from the semiconductor layers (2, 3). With the mount-surface-electrodes (21, 31), light-emitting device (1) can be mounted by using surface mount technology.

摘要翻译： 在发光装置及其制造方法中，通过表面贴装技术的分批处理进行安装，实现了高的光提取效率和低的制造成本。 发光装置1包括p型和n型氮化物半导体的半导体层（2,3），用于向每个半导体层（2,3）施加电流的半导体表面电极（21,31） 保持半导体层（2,3）的绝缘层4和安装表面电极（5）。 半导体层（2）具有不沉积另一半导体层（3）的非沉积区域20。 绝缘层（4）具有将安装表面电极5和半导体表面电极（21,31）电连接的VIA10。 在制造过程中，首先。 半导体层（2,3）和半导体表面电极（21,31）沉积在透明晶体基板上，并且通过使用堆积工艺，绝缘层（4）和安装表面电极（5）是 形成，其次形成VIA 10。 最后分离透明晶体基板以得到发光器件（1）。 可以从半导体层（2,3）直接有效地提取光。 通过安装表面电极（21,31），可以通过表面贴装技术来安装发光装置（1）。

公开(公告)号：US07709282B2

公开(公告)日：2010-05-04

申请号：US10575489

申请日：2004-11-11

申请人： Hiroshi Fukshima ,  Masao Kubo ,  Akira Inoue ,  Kenichiro Tanaka ,  Mikio Masui ,  Shinji Matsui

发明人： Hiroshi Fukshima ,  Masao Kubo ,  Akira Inoue ,  Kenichiro Tanaka ,  Mikio Masui ,  Shinji Matsui

IPC分类号： H01L21/56

CPC分类号： H01L33/44 ,  H01L33/005 ,  H01L33/20 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00

摘要： A production method for producing a light-emitting device 1 in which a light-emitting layer at least comprised of a n-type substrate bearing layer 3 and a p-type substrate bearing layer 4 is layered on a transparent crystal substrate 2 is provided with a step of forming a transfer layer 5 on at least a part of the transparent crystal substrate 2 or the light-emitting layer 3, 4, which transfer layer 5 is softened or set upon supplying an energy thereto; a step of pressing a mold 6 formed with a minute unevenness structure 61 against the transfer layer 5 to transfer the minute unevenness structure 61 to an outer surface of the transfer layer 5, and a step of forming a minute unevenness structure 21, 34 for preventing multiple reflection based on the minute unevenness structure 51 transferred to the transfer layer 5.

摘要翻译： 在透明晶体基板2上层叠有至少由n型基板承载层3和p型基板承载层4构成的发光层的发光装置1的制造方法， 在透明晶体基板2或发光层3,4的至少一部分上形成转印层5的步骤，该转印层5在向其供应能量时被软化或设定; 将形成有微小凹凸结构61的模具6压靠在转印层5上以将微小凹凸结构61转印到转印层5的外表面的步骤，以及形成微小凹凸结构21,34以防止 基于转印到转印层5的微小凹凸结构51的多次反射。

公开(公告)号：US20070065960A1

公开(公告)日：2007-03-22

申请号：US10575489

申请日：2004-11-11

申请人： Hiroshi Fukshima ,  Masao Kubo ,  Akira Inoue ,  Kenichiro Tanaka ,  Mikio Masui ,  Shinji Matsui

发明人： Hiroshi Fukshima ,  Masao Kubo ,  Akira Inoue ,  Kenichiro Tanaka ,  Mikio Masui ,  Shinji Matsui

IPC分类号： H01L21/00

CPC分类号： H01L33/44 ,  H01L33/005 ,  H01L33/20 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00

摘要： A production method for producing a light-emitting device 1 in which a light-emitting layer at least comprised of a n-type substrate bearing layer 3 and a p-type substrate bearing layer 4 is layered on a transparent crystal substrate 2 is provided with a step of forming a transfer layer 5 on at least a part of the transparent crystal substrate 2 or the light-emitting layer 3, 4, which transfer layer 5 is softened or set upon supplying an energy thereto; a step of pressing a mold 6 formed with a minute unevenness structure 61 against the transfer layer 5 to transfer the minute unevenness structure 61 to an outer surface of the transfer layer 5, and a step of forming a minute unevenness structure 21, 34 for preventing multiple reflection based on the minute unevenness structure 51 transferred to the transfer layer 5.

摘要翻译： 在透明晶体基板2上层叠有至少由n型基板承载层3和p型基板承载层4构成的发光层的发光装置1的制造方法， 在透明晶体基板2或发光层3,4的至少一部分上形成转印层5的步骤，该转印层5在向其供应能量时被软化或设定; 将形成有微小凹凸结构61的模具6压靠在转印层5上以将微小凹凸结构61转印到转印层5的外表面的步骤，以及形成微小凹凸结构21,34以防止 基于转印到转印层5的微小凹凸结构51的多次反射。

公开(公告)号：US06878969B2

公开(公告)日：2005-04-12

申请号：US10447232

申请日：2003-05-29

申请人： Kenichiro Tanaka ,  Masao Kubo ,  Tomoaki Matsushima ,  Ryoichi Terauchi

发明人： Kenichiro Tanaka ,  Masao Kubo ,  Tomoaki Matsushima ,  Ryoichi Terauchi

IPC分类号： H01L33/20 ,  H01L33/22 ,  H01L29/72

CPC分类号： H01L33/20 ,  H01L33/025 ,  H01L33/22 ,  H01L2933/0083

摘要： A semiconductor light emitting device gives a large radiation surface with an enhanced light radiating capability. A N-type GaN layer and a P-type GaN layer are stacked to define therebetween an interface where a light is generated upon application of voltage across the interface. A light guide on which the GaN layers are developed is utilized to give a wide radiation surface from which the light is given off. The radiation surface is formed with a refractor layer composed of an array of a first medium and a second medium which have individual refraction indexes different from each other and are arranged alternately across the radiation surface. Thus, the light guide can be best utilized to give a large radiation surface, yet formed with the refractor layer which reduces multiple reflections inside of the light guide for effectively passing or radiating the light transmitted through the light guide.

摘要翻译： 半导体发光器件具有增强的光辐射能力的大的辐射面。 堆叠N型GaN层和P型GaN层，在其间界定在界面上施加电压时产生光的界面。 利用其上显现GaN层的光导，以产生宽的辐射表面，从该辐射表面发出光。 辐射表面形成有由第一介质和第二介质的阵列构成的折射层，所述第一介质和第二介质具有彼此不同的各个折射率并交替地布置在辐射表面上。 因此，光导可以最好地用于给出大的辐射表面，但是形成有折射器层，其减少光导内部的多个反射，以有效地传递或辐射透射通过光导的光。

公开(公告)号：US07923270B2

公开(公告)日：2011-04-12

申请号：US12410069

申请日：2009-03-24

申请人： Kenichiro Tanaka ,  Masao Kubo

发明人： Kenichiro Tanaka ,  Masao Kubo

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

摘要： In a light-emitting device and its manufacturing method, mounting by batch process with surface-mount technology, high light extraction efficiency, and low manufacturing cost are realized. The light-emitting device comprises semiconductor layers of p-type and n-type nitride semiconductor, semiconductor-surface-electrodes to apply currents into each of the semiconductor layers, an insulating layer which holds the semiconductor layers, and mount-surface-electrodes. The semiconductor layers has a non-deposited area where the other semiconductor layer is not deposited. The insulating layer has VIA which electrically connect the mount-surface-electrodes and the semiconductor-surface-electrodes. In the manufacturing process, firstly, semiconductor layers and semiconductor-surface-electrodes are deposited on the transparent crystal substrate, and by using build-up process, insulating layer and the mount-surface-electrodes are formed, and secondly, VIA are formed, and finally, the transparent crystal substrate is separated to get light-emitting device. Light can be extracted directly and efficiently from the semiconductor layers. With the mount-surface-electrodes, light-emitting device can be mounted by using surface mount technology.

摘要翻译： 在发光装置及其制造方法中，通过表面贴装技术的分批处理进行安装，实现了高的光提取效率和低的制造成本。 发光装置包括p型和n型氮化物半导体的半导体层，将电流施加到每个半导体层中的半导体表面电极，保持半导体层的绝缘层和安装表面电极。 半导体层具有不沉积另一半导体层的非沉积区域。 绝缘层具有将安装表面电极和半导体表面电极电连接的VIA。 在制造工序中，首先，在透明晶体基板上沉积半导体层和半导体表面电极，通过使用积聚工序，形成绝缘层和安装面电极，其次，形成VIA， 最后分离出透明的晶体基板，得到发光元件。 可以从半导体层直接有效地提取光。 通过安装表面电极，可以通过使用表面贴装技术来安装发光装置。

公开(公告)号：US06414263B1

公开(公告)日：2002-07-02

申请号：US09627308

申请日：2000-07-27

申请人： Yuichi Uchida ,  Masao Kubo ,  Kenichiro Tanaka ,  Isamu Miyamoto

发明人： Yuichi Uchida ,  Masao Kubo ,  Kenichiro Tanaka ,  Isamu Miyamoto

IPC分类号： B23K2600

CPC分类号： H05K3/0035 ,  B23K26/03 ,  B23K26/032 ,  B23K26/082 ,  H05K1/0269 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2203/0315 ,  H05K2203/163

摘要： To form a hole for electrically connecting an upper conductor layer 11 of an insulating layer 10 of a printed wiring board 1 and a lower conductor layer 12 of the insulating layer 10 in the insulating layer 10 to expose the lower conductor layer 12 to the hole bottom, when laser processing is executed for making the hole 13 in the insulating layer 10 using the printed wiring board 1 comprising a treatment layer 14 being placed between the lower conductor layer 12 and the insulating layer 10 for emitting an electromagnetic wave having a wavelength different from the wavelength of processing laser during the laser processing, change in a signal emitted from the treatment layer 14 of the printed wiring board 1 is measured to determine the remaining state of the insulating layer 10. The electromagnetic wave emitted in laser processing from the treatment layer 14 placed between the lower conductor layer 12 and the insulating layer 10 rather than the reflection of laser of laser is used, so that the hole 13 piercing the insulating layer can be detected precisely.

摘要翻译： 为了形成用于将绝缘层10中的印刷电路板1的绝缘层10的上导体层11和绝缘层10的下导体层12电连接的孔，以将下导体层12暴露于孔底 当使用包括处理层14的印刷布线板1在绝缘层10中进行激光加工来进行激光加工时，该处理层14位于下导体层12和绝缘层10之间，用于发射波长不同于 测量激光处理期间的处理激光的波长，从印刷布线板1的处理层14发射的信号的变化，以确定绝缘层10的剩余状态。激光加工中从处理层发射的电磁波 因此，使用放置在下导体层12和绝缘层10之间而不是激光的激光的反射 可以精确地检测穿透绝缘层的孔13。

公开(公告)号：US08592836B2

公开(公告)日：2013-11-26

申请号：US13331028

申请日：2011-12-20

申请人： Ryoji Yokotani ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Ryoji Yokotani ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： H01L29/18

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

摘要翻译： 发光器件包括固体发光元件; 将固体发光元件安装在其上的安装基板; 封装所述固体发光元件的封装构件; 以及通过线电连接到固体发光元件的引线框架。 引线框布置在安装基板的后表面上，安装基板包括安装有固体发光元件的前安装面。 前安装表面具有被封装构件覆盖的光滑表面区域。 安装基板还包括线，该线从安装基板的前安装表面延伸到其后表面。

公开(公告)号：US20130180803A1

公开(公告)日：2013-07-18

申请号：US13809557

申请日：2011-07-11

申请人： Kenichiro Tanaka ,  Tatsuhiko Goi ,  Hidenori Arisawa ,  Motohiko Nishimura

发明人： Kenichiro Tanaka ,  Tatsuhiko Goi ,  Hidenori Arisawa ,  Motohiko Nishimura

IPC分类号： F16H57/04

CPC分类号： F16H57/0421 ,  F16H57/0409 ,  F16H57/0423 ,  F16H57/0495

摘要： A lubricating device for a gear train (5) including a plurality of gears meshing with each other includes a shroud (7) configured to cover the gear train (5) and a housing (9) configured to cover the shroud (7). The shroud (7) includes: an oil supply nozzle (25) configured to supply oil (OL) to a meshing position (21) of the gear train (5); and oil-drain ports (41) through which the oil (OL) is discharged from the shroud. The housing (9) includes, at its lower part, a draw-out port (43) through which the oil (OL) discharged from the oil-drain ports (41) is drawn to the outside of the housing. Guide members (47) are provided between the shroud (7) and the housing (9). The guide members (47) guide the oil (OL) discharged from the respective oil-drain ports (41) of the shroud (7) such that the oil (OL) flows downward through space (S) between the shroud (7) and the housing (9).

摘要翻译： 一种用于包括彼此啮合的多个齿轮的齿轮系的润滑装置，包括构造成覆盖齿轮系（5）的护罩（7）和构造成覆盖罩（7）的壳体（9）。 护罩（7）包括：供油喷嘴（25），其构造成将油（OL）供应到齿轮系（5）的啮合位置（21）; 和排油口（41），油（OL）通过该排油口从护罩排出。 所述壳体（9）在其下部包括抽出口（43），从所述排油口（41）排出的油（OL）通过所述抽出口被抽吸到所述壳体的外部。 引导构件（47）设置在护罩（7）和壳体（9）之间。 引导构件（47）引导从护罩（7）的各个排油口（41）排出的油（OL），使得油（OL）向下流动通过护罩（7）与护罩（7）之间的空间（S） 外壳（9）。

公开(公告)号：US20120153313A1

公开(公告)日：2012-06-21

申请号：US13331028

申请日：2011-12-20

申请人： Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： H01L33/62 ,  H01L33/08

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

摘要翻译： 发光器件包括固体发光元件; 将固体发光元件安装在其上的安装基板; 封装所述固体发光元件的封装构件; 以及通过线电连接到固体发光元件的引线框架。 引线框布置在安装基板的后表面上，安装基板包括安装有固体发光元件的前安装面。 前安装表面具有被封装构件覆盖的光滑表面区域。 安装基板还包括线，该线从安装基板的前安装表面延伸到其后表面。

公开(公告)号：US08203157B2

公开(公告)日：2012-06-19

申请号：US12736240

申请日：2009-03-26

申请人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

发明人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

IPC分类号： H01L29/20 ,  H01L33/00 ,  H01L29/201 ,  H01L29/22 ,  H01L29/227 ,  H01L31/00

CPC分类号： H01L33/504 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A lighting device including an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member including a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member including a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.

摘要翻译： 一种照明装置，包括具有发光表面的LED芯片，并且被配置为从所述发光表面发射光;安装基板，其被配置为安装所述LED芯片;第一颜色转换构件，包括第一透光材料和 第一荧光体，第一荧光体被从LED芯片发射的光激励，从而发出比从LED芯片发射的光的波长长的波长的第一光，第一颜色转换部件直接 配置在所述LED芯片的发光面上的第二颜色转换构件，包括第二透光性材料和第二荧光体的第二颜色转换构件，所述第二荧光体被从所述LED芯片发射的光激励，从而发出具有 比从LED芯片发射的光的波长长的波长，第二颜色转换部件成形为具有圆顶状 pe，其中所述LED芯片和所述第一颜色转换构件设置在所述安装基板和所述第二颜色转换构件之间。