公开(公告)号：US08779586B2

公开(公告)日：2014-07-15

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L25/11

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110210455A1

公开(公告)日：2011-09-01

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L23/00 ,  B32B27/38 ,  C09J7/00 ,  B32B7/12

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110084408A1

公开(公告)日：2011-04-14

申请号：US12903661

申请日：2010-10-13

申请人： Yuichiro Shishido ,  Naohide Takamoto

发明人： Yuichiro Shishido ,  Naohide Takamoto

IPC分类号： H01L23/14 ,  C08L63/00 ,  B32B27/38

CPC分类号： H01L24/29 ,  C08G59/4261 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.

摘要翻译： 本发明的目的在于提供一种能够通过抑制芯片接合后的膜的固化收缩，以及切割/芯片接合薄膜来防止被粘物翘曲的热固性型芯片接合薄膜。 本发明涉及一种用于将半导体元件粘附并固定在被粘物上的热固性芯片接合薄膜，至少包含环氧树脂和酚醛树脂作为热固性组分，其中环氧基的摩尔数与 热固性组分中酚羟基的摩尔数在1.5至6的范围内。

公开(公告)号：US08614139B2

公开(公告)日：2013-12-24

申请号：US13415524

申请日：2012-03-08

申请人： Yuichiro Shishido ,  Takeshi Matsumura

发明人： Yuichiro Shishido ,  Takeshi Matsumura

IPC分类号： H01L21/46

CPC分类号： H01L21/6836 ,  B32B7/02 ,  B32B7/12 ,  B32B27/20 ,  B32B27/281 ,  B32B27/36 ,  B32B27/365 ,  B32B2457/14 ,  C09J7/385 ,  C09J2203/326 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/85 ,  H01L2224/9205 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/1467 ,  Y10T428/1471 ,  Y10T428/24802 ,  Y10T428/24942 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.

摘要翻译： 本发明提供一种具有保护膜的切割膜，其能够将切割膜粘贴到半导体晶片而不会发生位置偏移，同时减少停机时间。 提供了一种具有保护膜的切割膜，其中层压有切割膜和保护膜，其中保护膜的透射率与切割膜部分之间的保护膜的切割膜的透射率之间的差异 其中首先检测膜的光在600〜700nm的波长下为20％以上。

公开(公告)号：US20110084413A1

公开(公告)日：2011-04-14

申请号：US12903498

申请日：2010-10-13

申请人： Yuichiro Shishido ,  Naohide Takamoto

发明人： Yuichiro Shishido ,  Naohide Takamoto

IPC分类号： C09J133/08 ,  H01L29/00

CPC分类号： H01L24/29 ,  C08G59/4261 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An object thereof is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, wherein the gel fraction in an organic component after thermal curing is performed by a heat treatment at 120° C. for 1 hour is 20% by weight or less, and the gel fraction in the organic component after thermal curing is performed by a heat treatment at 175° C. for 1 hour is in a range of 10 to 30% by weight.

摘要翻译： 其目的在于提供一种能够通过抑制芯片接合后的膜的固化收缩来防止被粘物翘曲的热固性型芯片接合薄膜和切割/芯片接合薄膜。 本发明涉及一种用于将半导体元件粘附并固定在被粘物上的热固性芯片接合膜，其中通过在120℃下热处理1小时进行热固化后的有机成分中的凝胶分数为20％ 以下，通过在175℃下热处理1小时进行热固化后的有机成分中的凝胶分数为10〜30重量％的范围。

公开(公告)号：US08658515B2

公开(公告)日：2014-02-25

申请号：US13415073

申请日：2012-03-08

申请人： Koichi Inoue ,  Miki Morita ,  Yuichiro Shishido

发明人： Koichi Inoue ,  Miki Morita ,  Yuichiro Shishido

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83906 ,  H01L2224/85205 ,  H01L2224/9205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims to provides a method of manufacturing a film for a semiconductor device in which a dicing film, a die bond film, and a protecting film are laminated in this order, including the steps of: irradiating the die bond film with a light ray having a wavelength of 400 to 800 nm to detect the position of the die bond film based on the obtained light transmittance and punching the dicing film out based on the detected position of the die bond film, and in which T2/T1 is 0.04 or more, wherein T1 is the light transmittance of the portion where the dicing film and the protecting film are laminated and T2 is the light transmittance of the portion where the dicing film, the die bond film, and the protecting film are laminated.

摘要翻译： 本发明的目的在于提供一种半导体装置用膜的制造方法，其中切割膜，芯片接合膜和保护膜依次层叠，包括以下步骤：用光照射芯片接合膜 根据获得的透光率检测芯片接合膜的位置，并根据检测到的芯片接合膜的位置对该切割膜进行冲压，其中T2 / T1为0.04或 其中，T1是层叠有切割膜和保护膜的部分的透光率，T2是层叠有切割膜，芯片接合膜和保护膜的部分的透光率。

公开(公告)号：US20110217501A1

公开(公告)日：2011-09-08

申请号：US13041086

申请日：2011-03-04

申请人： Yuichiro Shishido ,  Takeshi Matsumura ,  Shuhei Murata

发明人： Yuichiro Shishido ,  Takeshi Matsumura ,  Shuhei Murata

IPC分类号： B32B33/00

CPC分类号： H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/1476 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A dicing die-bonding film with excellent peeling property when a diced semiconductor chip and its die-bonding film are, without deteriorating a holding force during dicing a semiconductor wafer even if it is thin. A dicing die-bonding film, comprising a dicing film having at least a pressure-sensitive adhesive layer formed on a supporting base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the thickness of the pressure-sensitive adhesive layer is 5 to 80 μm, and when the dicing film is peeled off from the die-bonding film after dicing from the side of the die-bonding film to a part of the pressure-sensitive adhesive layer, the maximum value of a peeling force in the vicinity of the cut surface is 0.7 N/10 mm or less under the conditions of a temperature of 23° C., a peeling angle of 180°, and a peeling point moving rate of 10 mm/min.

摘要翻译： 当切割的半导体芯片和芯片接合薄膜即使在薄的半导体晶片的切割时也不会使保持力变差，因此具有优异的剥离性能的切割芯片接合薄膜。 一种切割芯片接合薄膜，包括至少形成在支撑基材上的压敏粘合剂层的切割薄膜和形成在压敏粘合剂层上的芯片接合薄膜，其中压敏粘合剂的厚度 粘合剂层为5〜80μm，从芯片接合膜侧到粘合剂层的一部分切割后将切割膜从芯片接合薄膜剥离后，剥离的最大值 在23℃，剥离角度180°，剥离移动速度为10mm / min的条件下，切割面附近的力为0.7N / 10mm以下。