公开(公告)号：US20120225374A1

公开(公告)日：2012-09-06

申请号：US13409638

申请日：2012-03-01

申请人： Kentaro OKUDA ,  Yosuke Okamoto ,  Takaki Hashimoto ,  Hidenori Sato

发明人： Kentaro OKUDA ,  Yosuke Okamoto ,  Takaki Hashimoto ,  Hidenori Sato

IPC分类号： G03F1/44

CPC分类号： G03F1/42 ,  G03F1/26 ,  G03F1/44

摘要： According to one embodiment, a photomask includes a substrate, a film portion, a pattern, and a plurality of detection marks. The film portion is provided on a surface of the substrate. The film portion has a light transmittance lower than light transmittance of the substrate. The pattern is provided in a surface of the film portion. The pattern is configured to be transferred to a transfer target. The plurality of detection marks is provided in the film portion, with intensity of light transmitted through the detection marks being suppressed so as to suppress transfer the detection marks to the transfer target.

摘要翻译： 根据一个实施例，光掩模包括基板，膜部分，图案和多个检测标记。 膜部设置在基板的表面上。 膜部的透光率比基板的透光率低。 该图案设置在膜部分的表面中。 该模式被配置为传送到转移目标。 多个检测标记设置在胶片部分中，通过检测标记传输的光的强度被抑制，以便抑制检测标记传送到转印目标。

公开(公告)号：US08778570B2

公开(公告)日：2014-07-15

申请号：US13409638

申请日：2012-03-01

申请人： Kentaro Okuda ,  Yosuke Okamoto ,  Takaki Hashimoto ,  Hidenori Sato

发明人： Kentaro Okuda ,  Yosuke Okamoto ,  Takaki Hashimoto ,  Hidenori Sato

IPC分类号： G03F1/42 ,  G03F1/44

CPC分类号： G03F1/42 ,  G03F1/26 ,  G03F1/44

摘要： According to one embodiment, a photomask includes a substrate, a film portion, a pattern, and a plurality of detection marks. The film portion is provided on a surface of the substrate. The film portion has a light transmittance lower than light transmittance of the substrate. The pattern is provided in a surface of the film portion. The pattern is configured to be transferred to a transfer target. The plurality of detection marks is provided in the film portion, with intensity of light transmitted through the detection marks being suppressed so as to suppress transfer the detection marks to the transfer target.

摘要翻译： 根据一个实施例，光掩模包括基板，膜部分，图案和多个检测标记。 膜部设置在基板的表面上。 膜部的透光率比基板的透光率低。 该图案设置在膜部分的表面中。 该模式被配置为传送到转移目标。 多个检测标记设置在胶片部分中，通过检测标记传输的光的强度被抑制，以便抑制检测标记传送到转印目标。

公开(公告)号：US09036896B2

公开(公告)日：2015-05-19

申请号：US13083157

申请日：2011-04-08

申请人： Takanao Touya ,  Shuichi Tamamushi ,  Hidenori Sato ,  Hiroyuki Tanizaki ,  Takeshi Fujiwara ,  Eiji Sawa ,  Kentaro Okuda ,  Hiroyuki Ikeda ,  Hiromu Inoue ,  Hiroshi Tsukada

发明人： Takanao Touya ,  Shuichi Tamamushi ,  Hidenori Sato ,  Hiroyuki Tanizaki ,  Takeshi Fujiwara ,  Eiji Sawa ,  Kentaro Okuda ,  Hiroyuki Ikeda ,  Hiromu Inoue ,  Hiroshi Tsukada

IPC分类号： G06K9/00 ,  G06T7/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G06T7/0004 ,  G06T7/0006 ,  G06T7/70 ,  G06T7/74 ,  G06T2207/10004 ,  G06T2207/30141 ,  G06T2207/30148

摘要： A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

摘要翻译： 一种用于对待检查对象进行成像并获得光学图像的方法和系统; 从设计模式数据创建参考图像; 准备包括一个或多个模板和检查所需的参数设置的检查配方; 检查图案和模板，并选择与模板对应的参考图像; 根据使用确定的坐标作为参考的参数设置来检测所选参考图像中的第一和第二边缘; 检测光学图像中的第一和第二边缘，该光学图像对应于所选择的参考图像; 以及通过使用参考图像的第一边缘和第二边缘以及光学图像的第一边缘和第二边缘获取光学图像的线宽和参考图像之间的差来确定检查值。

公开(公告)号：US20110255770A1

公开(公告)日：2011-10-20

申请号：US13083157

申请日：2011-04-08

申请人： Takanao Touya ,  Shuichi Tamamushi ,  Hidenori Sato ,  Hiroyuki Tanizaki ,  Takeshi Fujiwara ,  Eiji Sawa ,  Kentaro Okuda ,  Hiroyuki Ikeda ,  Hiromu Inoue ,  Hiroshi Tsukada

发明人： Takanao Touya ,  Shuichi Tamamushi ,  Hidenori Sato ,  Hiroyuki Tanizaki ,  Takeshi Fujiwara ,  Eiji Sawa ,  Kentaro Okuda ,  Hiroyuki Ikeda ,  Hiromu Inoue ,  Hiroshi Tsukada

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G06T7/0004 ,  G06T7/0006 ,  G06T7/70 ,  G06T7/74 ,  G06T2207/10004 ,  G06T2207/30141 ,  G06T2207/30148

摘要： A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

摘要翻译： 一种用于对待检查对象进行成像并获得光学图像的方法和系统; 从设计模式数据创建参考图像; 准备包括一个或多个模板和检查所需的参数设置的检查配方; 检查图案和模板，并选择与模板对应的参考图像; 根据使用确定的坐标作为参考的参数设置来检测所选参考图像中的第一和第二边缘; 检测光学图像中的第一和第二边缘，该光学图像对应于所选择的参考图像; 以及通过使用参考图像的第一边缘和第二边缘以及光学图像的第一边缘和第二边缘获取光学图像的线宽和参考图像之间的差来确定检查值。

公开(公告)号：US20140043063A1

公开(公告)日：2014-02-13

申请号：US14112926

申请日：2012-03-26

申请人： Kazuo Tomita ,  Toshiyuki Oashi ,  Hidenori Sato

发明人： Kazuo Tomita ,  Toshiyuki Oashi ,  Hidenori Sato

IPC分类号： H01L23/52

CPC分类号： H01L29/0696 ,  H01L21/823871 ,  H01L23/52 ,  H01L23/5286 ,  H01L27/0207 ,  H01L27/092 ,  H01L29/1095 ,  H01L29/45 ,  H01L2924/0002 ,  H01L2924/00

摘要： A gate interconnection portion includes a first gate interconnection portion, a second gate interconnection portion, and a third gate interconnection portion. The first gate interconnection portion is formed in parallel to a Y axis direction toward a power supply interconnection and extends to a prescribed position within an element formation region. The second gate interconnection portion is formed in parallel to a direction obliquely bent with respect to the Y-axis direction from the first gate interconnection portion toward the power supply interconnection, and extends across a boundary between the element formation region and an element isolation insulating film, which is in parallel to an X axis direction. The third gate interconnection portion further extends in parallel to the Y-axis direction from the second gate interconnection portion toward the power supply interconnection.

摘要翻译： 栅极互连部分包括第一栅极互连部分，第二栅极互连部分和第三栅极互连部分。 第一栅极互连部分形成为平行于Y轴方向朝向电源互连并延伸到元件形成区域内的规定位置。 第二栅极互连部分形成为平行于从第一栅极互连部分朝向电源互连方向相对于Y轴方向倾斜弯曲的方向，并延伸穿过元件形成区域和元件隔离绝缘膜之间的边界 ，它与X轴方向平行。 第三栅极互连部分还从第二栅极互连部分向电源互连方向平行于Y轴方向延伸。

公开(公告)号：US08354730B2

公开(公告)日：2013-01-15

申请号：US11997436

申请日：2006-08-25

申请人： Satoshi Moriya ,  Toshio Saito ,  Goichi Yokoyama ,  Tsuyoshi Fujiwara ,  Hidenori Sato ,  Nobuaki Miyakawa

发明人： Satoshi Moriya ,  Toshio Saito ,  Goichi Yokoyama ,  Tsuyoshi Fujiwara ,  Hidenori Sato ,  Nobuaki Miyakawa

IPC分类号： H01L21/70

CPC分类号： H01L21/76898 ,  H01L21/2007 ,  H01L21/76232 ,  H01L21/8221 ,  H01L23/481 ,  H01L24/94 ,  H01L2224/2518 ,  H01L2924/01004 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/00

摘要： A structure obtaining a desired integrated circuit by sticking together a plurality of semiconductor substrates and electrically connecting integrated circuits formed on semiconductor chips of the respective semiconductor substrates is provided, and a penetrating electrode penetrating between a main surface and a rear surface of each of the semiconductor substrates and a penetrating separation portion separating the penetrating electrode are separately arranged. Thereby, after forming an insulation trench portion for formation of the penetrating separation portion on the semiconductor substrate, a MIS•FET is formed, and then, a conductive trench portion for formation of the penetrating electrode can be formed. Therefore, element characteristics of a semiconductor device having a three-dimensional structure can be improved.

摘要翻译： 提供了通过将形成在各个半导体衬底的半导体芯片上的多个半导体衬底和电连接集成电路粘合在一起而获得所需集成电路的结构，并且穿透电极穿透每个半导体衬底的主表面和后表面 分离基板和分离穿透电极的穿透分离部分。 因此，在半导体衬底上形成用于形成穿透分离部分的绝缘沟槽部分之后，形成MIS·FET，然后形成用于形成穿透电极的导电沟槽部分。 因此，可以提高具有三维结构的半导体器件的元件特性。

公开(公告)号：US07320527B2

公开(公告)日：2008-01-22

申请号：US11235211

申请日：2005-09-27

申请人： Ayako Yamada ,  Hidenori Sato

发明人： Ayako Yamada ,  Hidenori Sato

IPC分类号： G02B7/182 ,  G60R1/06

CPC分类号： B60R1/072

摘要： A vehicle mirror comprises: a mirror surface; an actuator 100 which tilts the mirror surface; a plate pivot 110, which changes its direction together with the mirror surface; a spring 112, which applies a resilient force to the plate pivot 110 in the direction substantially vertical to the mirror surface; a guide spring 114 which is fitted to the end of the spring 112 at the side far from the interlocking member; a semiconductor pressure sensor 116, which is in contact with the guide spring at substantially one point so as to detect a load loaded on the one point from the pressing member; and a signal outputting portion which outputs a signal depending upon the tilted angle of the mirror surface based on the force detected by the semiconductor pressure sensor 116.

摘要翻译： 车辆镜子包括：镜面; 致动器100，其使镜面倾斜; 平板枢轴110，其与镜面一起改变其方向; 弹簧112，其在基本上垂直于镜面的方向上向板枢轴110施加弹性力; 导向弹簧114，其在远离联锁构件的一侧装配到弹簧112的端部; 半导体压力传感器116，其基本上一点与导向弹簧接触，以便检测从按压部件加载到该一个点上的负载; 以及信号输出部，其基于由半导体压力传感器116检测出的力，输出取决于镜面的倾斜角度的信号。

公开(公告)号：US07208391B2

公开(公告)日：2007-04-24

申请号：US11149538

申请日：2005-06-10

申请人： Hidenori Sato ,  Norio Suzuki ,  Akira Takamatsu ,  Hiroyuki Maruyama ,  Takeshi Saikawa ,  Katsuhiko Hotta ,  Hiroyuki Ichizoe

发明人： Hidenori Sato ,  Norio Suzuki ,  Akira Takamatsu ,  Hiroyuki Maruyama ,  Takeshi Saikawa ,  Katsuhiko Hotta ,  Hiroyuki Ichizoe

IPC分类号： H01L21/762

CPC分类号： H01L21/76229 ,  H01L21/02271 ,  H01L21/02282 ,  H01L21/3125 ,  H01L21/31612 ,  H01L27/0211 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/10814 ,  H01L27/10844 ,  H01L27/10894

摘要： A method for manufacturing a semiconductor integrated circuit device includes the steps of forming an isolation trench in an isolation region of a semiconductor substrate, filling the isolation trench up to predetermined middle position in its depth direction with a first insulating film deposited by a coating method, filling a remaining depth portion of the isolation trench into which the first insulating film is filled with a second insulating film, then forming a plurality of patterns on the semiconductor substrate, filling a trench forming between the plurality of patterns up to predetermined middle position in a trench depth direction with a third insulating film deposited by a coating method, and filling a remaining portion of the trench into which the third insulating film is filled with a fourth insulating film that is more difficult to etch than the third insulating film. The method may also include the step of forming dummy patters in a relatively large isolation region of isolation regions with relatively different planar dimensions before the first insulating film is deposited.

摘要翻译： 一种制造半导体集成电路器件的方法包括以下步骤：在半导体衬底的隔离区域中形成隔离沟槽，通过涂覆方法沉积的第一绝缘膜将隔离沟填充到其深度方向上的预定中间位置， 用第二绝缘膜填充绝缘沟槽的剩余深度部分，然后在半导体衬底上形成多个图案，在多个图案之间填充形成沟槽直到预定中间位置的沟槽 沟槽深度方向与通过涂覆方法沉积的第三绝缘膜，并且填充第三绝缘膜填充有比第三绝缘膜更难蚀刻的第四绝缘膜的沟槽的剩余部分。 该方法还可以包括在第一绝缘膜沉积之前在具有相对不同的平面尺寸的隔离区的相对大的隔离区域中形成伪图案的步骤。

公开(公告)号：US20050239257A1

公开(公告)日：2005-10-27

申请号：US11149538

申请日：2005-06-10

申请人： Hidenori Sato ,  Norio Suzuki ,  Akira Takamatsu ,  Hiroyuki Maruyama ,  Takeshi Saikawa ,  Katsuhiko Hotta ,  Hiroyuki Ichizoe

发明人： Hidenori Sato ,  Norio Suzuki ,  Akira Takamatsu ,  Hiroyuki Maruyama ,  Takeshi Saikawa ,  Katsuhiko Hotta ,  Hiroyuki Ichizoe

IPC分类号： H01L21/76 ,  G02B17/00 ,  G02B21/00 ,  G02B23/00 ,  H01L21/302 ,  H01L21/312 ,  H01L21/316 ,  H01L21/461 ,  H01L21/762 ,  H01L21/8239 ,  H01L21/8242 ,  H01L27/02 ,  H01L27/10 ,  H01L27/105 ,  H01L27/108

CPC分类号： H01L21/76229 ,  H01L21/02271 ,  H01L21/02282 ,  H01L21/3125 ,  H01L21/31612 ,  H01L27/0211 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/10814 ,  H01L27/10844 ,  H01L27/10894

摘要： A method for manufacturing a semiconductor integrated circuit device includes the steps of forming an isolation trench in an isolation region of a semiconductor substrate, filling the isolation trench up to predetermined middle position in its depth direction with a first insulating film deposited by a coating method, filling a remaining depth portion of the isolation trench into which the first insulating film is filled with a second insulating film, then forming a plurality of patterns on the semiconductor substrate, filling a trench forming between the plurality of patterns up to predetermined middle position in a trench depth direction with a third insulating film deposited by a coating method, and filling a remaining portion of the trench into which the third insulating film is filled with a fourth insulating film that is more difficult to etch than the third insulating film. The method may also include the step of forming dummy patters in a relatively large isolation region of isolation regions with relatively different planar dimensions before the first insulating film is deposited.

公开(公告)号：US06905982B2

公开(公告)日：2005-06-14

申请号：US10477539

申请日：2002-04-19

申请人： Hidenori Sato ,  Katsuhiko Ichinose ,  Yukino Ishii ,  Tomoko Jinbo

发明人： Hidenori Sato ,  Katsuhiko Ichinose ,  Yukino Ishii ,  Tomoko Jinbo

IPC分类号： H01L21/8247 ,  C23C16/34 ,  C23C16/452 ,  H01L21/28 ,  H01L21/318 ,  H01L21/60 ,  H01L21/8238 ,  H01L21/8239 ,  H01L21/8242 ,  H01L27/092 ,  H01L27/10 ,  H01L27/108 ,  H01L27/115 ,  H01L29/51 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  H01L21/31

CPC分类号： H01L21/0217 ,  C23C16/345 ,  C23C16/452 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/28194 ,  H01L21/3185 ,  H01L21/76897 ,  H01L27/1052 ,  H01L27/10888 ,  H01L27/10894 ,  H01L29/518 ,  H01L2924/0002 ,  H01L2924/00

摘要： A CVD device (100) used for depositing a silicon nitride has a structure in which a hot wall furnace (103) for thermally degrading a source gas and a chamber (101) for forming a film over a surface of a wafer (1) are separated from each other. The hot wall furnace (103) for thermally degrading the source gas is provided above the chamber (101), and a heater (104) capable of setting the inside of the furnace at a high temperature atmosphere of approximately 1200° C. is provided at the outer periphery thereof. The source gas, supplied to the hot wall furnace (103) through pipes (105) and (106), is thermally degraded in this furnace in advance, and degraded components thereof are supplied on a stage (102) of the chamber (101) to form a film on the surface of the wafer (1).

摘要翻译： 用于沉积氮化硅的CVD装置（100）具有如下结构：在晶片（1）的表面上用于使源气体热降解的热壁炉（103）和用于形成膜的室（101） 彼此分离。 用于使源气体热降解的热壁炉（103）设置在室（101）的上方，并且能够在大约1200℃的高温气氛下将炉内部设置的加热器（104）设置在 其外围。 通过管道（105）和（106）供应到热壁炉（103）的源气体预先在该炉中热劣化，并且将其劣化的组分供应到室（101）的台（102）上， 以在晶片（1）的表面上形成膜。