Electronic device on substrate with cavity and mitigated parasitic leakage path
    4.
    发明申请
    Electronic device on substrate with cavity and mitigated parasitic leakage path 失效
    衬底上的电子器件具有空腔和减轻的寄生泄漏路径

    公开(公告)号:US20070236310A1

    公开(公告)日:2007-10-11

    申请号:US11373434

    申请日:2006-03-10

    IPC分类号: H03H9/54

    摘要: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

    摘要翻译: 电子设备。 电子器件包括第一电极和涂层。 电子器件制造在衬底上; 衬底具有在衬底的顶表面中产生的空腔; 并且第一电极电耦合到衬底。 涂层涂覆在空腔中的基底表面的至少一部分,并且涂层的存在导致在第一电极和在基底上制造的附加电极之间的至少一个寄生泄漏路径的减轻。