公开(公告)号：US20090071707A1

公开(公告)日：2009-03-19

申请号：US12228537

申请日：2008-08-13

申请人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

发明人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

IPC分类号： H05K1/11 ,  C25D5/02

CPC分类号： H05K3/4007 ,  C25D5/02 ,  H01L21/4846 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/06 ,  H05K3/20 ,  H05K3/243 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.

摘要翻译： 提供了制造多层基板的方法。 绝缘层可以具有覆盖图案化的第二金属层的孔。 反过来，第二金属层可以覆盖在第一金属层上。 第三金属层可以电镀在孔内的图案化的第二金属层上，第三金属层从第二金属层延伸到孔的壁上。 当电镀第三金属层时，第一和第二金属层可以用作导电共用元件。

公开(公告)号：US08299626B2

公开(公告)日：2012-10-30

申请号：US11894036

申请日：2007-08-16

申请人： Ilyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

发明人： Ilyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

IPC分类号： H01L21/50

CPC分类号： H01L23/48 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。

公开(公告)号：US20090045524A1

公开(公告)日：2009-02-19

申请号：US11894036

申请日：2007-08-16

申请人： IIyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

发明人： IIyas Mohammed ,  Belgacem Haba ,  Sean Moran ,  Wei-Shun Wang ,  Ellis Chau ,  Christopher Wade

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/48 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。

公开(公告)号：US08505199B2

公开(公告)日：2013-08-13

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US20090148594A1

公开(公告)日：2009-06-11

申请号：US12228896

申请日：2008-08-15

申请人： Sean Moran ,  Jinsu Kwon ,  Kimitaka Endo

发明人： Sean Moran ,  Jinsu Kwon ,  Kimitaka Endo

IPC分类号： B05D5/12

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element can be formed by plating a metal layer within holes in an essentially non-metallic layer of a mandrel, wherein posts can be plated onto a metal layer exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer to the conductive posts. At least a portion of the mandrel can then be removed from at least ends of the holes. In this way, the tips of the conductive posts can become raised above a major surface of the interconnection element such that at least the tips of the posts project beyond the major surface.

摘要翻译： 互连元件可以通过在心轴的基本非金属层中的孔内镀覆金属层而形成，其中柱可以电镀在露出在孔内的金属层上，例如覆盖非金属层中的孔的金属层， 金属层。 柱的尖端可以形成在盲孔的端部或底部附近。 端子可以形成为与导电柱导电连通。 端子可以通过电介质层连接到导电柱。 然后可以从孔的至少一端移除芯棒的至少一部分。 以这种方式，导电柱的尖端可以在互连元件的主表面上方升高，使得至少顶部的柱突出超过主表面。

公开(公告)号：US20090145645A1

公开(公告)日：2009-06-11

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H05K7/00 ,  H05K1/11 ,  G01R3/00 ,  H05K3/00

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US08777619B2

公开(公告)日：2014-07-15

申请号：US11439423

申请日：2006-05-24

申请人： Kevin Schubert ,  Sean Moran ,  Greg Wieboldt ,  Donnie Klein ,  Mark Haack ,  Sharon Lay ,  Chris Howard ,  Michael Dineen ,  Jerry R. Hubbard ,  William Araki

发明人： Kevin Schubert ,  Sean Moran ,  Greg Wieboldt ,  Donnie Klein ,  Mark Haack ,  Sharon Lay ,  Chris Howard ,  Michael Dineen ,  Jerry R. Hubbard ,  William Araki

IPC分类号： F41A33/00

CPC分类号： G09B9/003 ,  F41A33/00 ,  F41G3/26 ,  G09B9/04

摘要： A computer based simulation system for virtual training for vehicle crews is disclosed. The Vehicle Crew Training System (VCTS) simulates crew positions for different military ground and air vehicles. Two or more crewman modules are networked together to support a partial or full vehicle crew. The crewman modules are self-contained devices that are modular in hardware and software design, easily reconfigurable, and require minimal facility space, allowing use in restricted environments such as trailers. The VCTS is modular at the crew position level; crewman modules are added or deleted as required to meet a particular training need.

摘要翻译： 公开了一种用于车辆人员虚拟训练的基于计算机的模拟系统。 车辆人员训练系统（VCTS）模拟不同军用地面和机动车辆的船员职位。 两个或多个船员模块联网在一起，以支持部分或全部车辆人员。 船员模块是独立的设备，其模块化的硬件和软件设计，易于重新配置，并且需要最小的设备空间，允许在受限的环境（如拖车）中使用。 VCTS在船员职位层面是模块化的; 船员模块根据需要添加或删除，以满足特定的培训需求。

公开(公告)号：US08502106B2

公开(公告)日：2013-08-06

申请号：US11434391

申请日：2006-05-15

申请人： Mark Ulrich ,  Sean Moran ,  Paul Leitermann

发明人： Mark Ulrich ,  Sean Moran ,  Paul Leitermann

IPC分类号： B23K9/20

CPC分类号： B23K9/205

摘要： A welding system and method having power controller with workpiece sensor. In some embodiments, the welding system includes a stud welding power supply having a welding power output, a stud welding power controller, and a workpiece sensor. The stud welding power controller may be communicatively coupled to the stud welding power supply and the workpiece sensor. In certain embodiments, the stud welding power controller is responsive to a signal from the workpiece sensor indicative of a position of a stud in general proximity or engagement with a workpiece.

摘要翻译： 一种具有工件传感器功率控制器的焊接系统和方法。 在一些实施例中，焊接系统包括具有焊接功率输出的螺柱焊接电源，螺柱焊接功率控制器和工件传感器。 螺柱焊接功率控制器可以通信地耦合到螺柱焊接电源和工件传感器。 在某些实施例中，螺柱焊接功率控制器响应于来自工件传感器的信号，其指示螺柱在普通接近或与工件接合的位置。

公开(公告)号：US20070287133A1

公开(公告)日：2007-12-13

申请号：US11439423

申请日：2006-05-24

申请人： Kevin Schubert ,  Sean Moran ,  Greg Wieboldt ,  Donnie Klein ,  Mark Haack ,  Sharon Lay ,  Chris Howard ,  Michael Dineen ,  Jerry R. Hubbard ,  William Araki

发明人： Kevin Schubert ,  Sean Moran ,  Greg Wieboldt ,  Donnie Klein ,  Mark Haack ,  Sharon Lay ,  Chris Howard ,  Michael Dineen ,  Jerry R. Hubbard ,  William Araki

IPC分类号： F41A33/00

CPC分类号： G09B9/003 ,  F41A33/00 ,  F41G3/26 ,  G09B9/04

摘要： A computer based simulation system for virtual training for vehicle crews is disclosed. The Vehicle Crew Training System (VCTS) simulates crew positions for different military ground and air vehicles. Two or more crewman modules are networked together to support a partial or full vehicle crew. The crewman modules are self-contained devices that are modular in hardware and software design, easily reconfigurable, and require minimal facility space, allowing use in restricted environments such as trailers. The VCTS is modular at the crew position level; crewman modules are added or deleted as required to meet a particular training need.

摘要翻译： 公开了一种用于车辆人员虚拟训练的基于计算机的模拟系统。 车辆人员训练系统（VCTS）模拟不同军用地面和机动车辆的船员职位。 两个或多个船员模块联网在一起，以支持部分或全部车辆人员。 船员模块是独立的设备，其模块化的硬件和软件设计，易于重新配置，并且需要最小的设备空间，允许在受限的环境（如拖车）中使用。 VCTS在船员职位层面是模块化的; 船员模块根据需要添加或删除，以满足特定的培训需求。

公开(公告)号：US20070262058A1

公开(公告)日：2007-11-15

申请号：US11434391

申请日：2006-05-15

申请人： Mark Ulrich ,  Sean Moran ,  Paul Leitermann

发明人： Mark Ulrich ,  Sean Moran ,  Paul Leitermann

IPC分类号： B23K9/20

CPC分类号： B23K9/205

摘要： A welding system and method having power controller with workpiece sensor. In some embodiments, the welding system includes a stud welding power supply having a welding power output, a stud welding power controller, and a workpiece sensor. The stud welding power controller may be communicatively coupled to the stud welding power supply and the workpiece sensor. In certain embodiments, the stud welding power controller is responsive to a signal from the workpiece sensor indicative of a position of a stud in general proximity or engagement with a workpiece.

摘要翻译： 一种具有工件传感器功率控制器的焊接系统和方法。 在一些实施例中，焊接系统包括具有焊接功率输出的螺柱焊接电源，螺柱焊接功率控制器和工件传感器。 螺柱焊接功率控制器可以通信地耦合到螺柱焊接电源和工件传感器。 在某些实施例中，螺柱焊接功率控制器响应于来自工件传感器的信号，其指示螺柱在普通接近或与工件接合的位置。