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公开(公告)号:US20090045524A1
公开(公告)日:2009-02-19
申请号:US11894036
申请日:2007-08-16
申请人: IIyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
发明人: IIyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
CPC分类号: H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
摘要翻译: 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片,其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元,其包括具有导电特征的上部单元基板,顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片,其覆盖在上部单元基板的顶表面上,并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。
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公开(公告)号:US08299626B2
公开(公告)日:2012-10-30
申请号:US11894036
申请日:2007-08-16
申请人: Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
发明人: Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
IPC分类号: H01L21/50
CPC分类号: H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
摘要翻译: 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片,其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元,其包括具有导电特征的上部单元基板,顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片,其覆盖在上部单元基板的顶表面上,并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。
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3.
公开(公告)号:US08618659B2
公开(公告)日:2013-12-31
申请号:US13462158
申请日:2012-05-02
申请人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号: H01L23/48
CPC分类号: H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译: 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上,并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部,每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间,使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。
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4.
公开(公告)号:US20120280386A1
公开(公告)日:2012-11-08
申请号:US13462158
申请日:2012-05-02
申请人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号: H01L23/498 , H01L21/56 , H01L21/50 , H01L23/48
CPC分类号: H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译: 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上,并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部,每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间,使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。
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公开(公告)号:US08697492B2
公开(公告)日:2014-04-15
申请号:US12938068
申请日:2010-11-02
申请人: Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
发明人: Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
IPC分类号: H01L25/065 , H01L21/56 , H01L21/60
CPC分类号: H01L23/49811 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1601 , H01L2224/1605 , H01L2224/16225 , H01L2224/1703 , H01L2224/73104 , H01L2224/73204 , H01L2224/81143 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要: A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.
摘要翻译: 一种用于制造微电子组件的方法包括:提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。 第一导电元件或第二导电元件中的至少一些可以是导电柱,并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。 底部填充层可能过度地部分第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动,使得支柱刺穿底部填充层并且至少使接合金属变形。 微电子元件和电介质元件可以被加热以将它们连接在一起。 表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40%。
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公开(公告)号:US20120104595A1
公开(公告)日:2012-05-03
申请号:US12938068
申请日:2010-11-02
申请人: Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
发明人: Belgacem Haba , Ilyas Mohammed , Ellis Chau , Sang Il Lee , Kishor Desai
CPC分类号: H01L23/49811 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1601 , H01L2224/1605 , H01L2224/16225 , H01L2224/1703 , H01L2224/73104 , H01L2224/73204 , H01L2224/81143 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/8349 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要: A method for making a microelectronic assembly includes providing a microelectronic element with first conductive elements and a dielectric element with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts and other of the first or second conductive elements may include a bond metal disposed between some of the conductive posts. An underfill layer may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer and at least deform the bond metal. The microelectronic element and the dielectric element can be heated to join them together. The height of the posts above the surface may be at least forty percent of a distance between surfaces of the microelectronic element and dielectric element.
摘要翻译: 一种用于制造微电子组件的方法包括:提供具有第一导电元件的微电子元件和具有第二导电元件的介质元件。 第一导电元件或第二导电元件中的至少一些可以是导电柱,并且第一或第二导电元件中的另一个可以包括设置在一些导电柱之间的接合金属。 底部填充层可能过度地部分第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动,使得支柱刺穿底部填充层并且至少使接合金属变形。 微电子元件和电介质元件可以被加热以将它们连接在一起。 表面上方的柱的高度可以是微电子元件和电介质元件的表面之间的距离的至少40%。
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公开(公告)号:US20120068338A1
公开(公告)日:2012-03-22
申请号:US12883821
申请日:2010-09-16
申请人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
发明人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
IPC分类号: H01L23/52
CPC分类号: H01L23/64 , H01L23/3128 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/02311 , H01L2224/02313 , H01L2224/02375 , H01L2224/02379 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/43
摘要: A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.
摘要翻译: 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件,表面导电元件,微电子器件,多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分,使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。
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公开(公告)号:US09136197B2
公开(公告)日:2015-09-15
申请号:US13472081
申请日:2012-05-15
申请人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
发明人: Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
IPC分类号: H01L23/495 , H01L23/31 , H01L23/552 , H01L23/00 , H01L25/065 , H01L23/13 , H01L23/498
CPC分类号: H01L23/3128 , H01L23/13 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/02311 , H01L2224/02313 , H01L2224/02375 , H01L2224/02379 , H01L2224/05554 , H01L2224/0603 , H01L2224/06156 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/4824 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06558 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要: A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.
摘要翻译: 微电子组件包括互连元件,导电平面,微电子器件,多个迹线以及第一和第二接合元件。 互连元件包括电介质元件,多个元件触点及其上的至少一个参考触点。 该微电子器件包括一个正面,其中设有触点暴露在该表面上。 导电平面覆盖微电子器件前表面的一部分。 覆盖导电平面表面的迹线与其绝缘,并与元件触点电连接。 迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分,使得对于迹线实现期望的阻抗。 第一接合元件将至少一个导电平面与至少一个参考触点电连接。 第二接合元件将器件触点与迹线电连接。
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公开(公告)号:US08222725B2
公开(公告)日:2012-07-17
申请号:US12883811
申请日:2010-09-16
申请人: Belgacem Haba , Ellis Chau , Wael Zohni , Richard Dewitt Crisp
发明人: Belgacem Haba , Ellis Chau , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L23/02
CPC分类号: H01L23/3128 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06136 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48227 , H01L2224/48471 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/013 , H01L2924/00013
摘要: A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.
摘要翻译: 微电子组件包括互连元件,元件触点,第一和第二金属层,导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面,使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。
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公开(公告)号:US08058101B2
公开(公告)日:2011-11-15
申请号:US11318404
申请日:2005-12-23
申请人: Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
发明人: Belgacem Haba , Teck-Gyu Kang , Ilyas Mohammed , Ellis Chau
IPC分类号: H01L21/00
CPC分类号: H01L21/565 , G01R31/2886 , H01L21/56 , H01L23/3128 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L23/49894 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.
摘要翻译: 制造微电子组件的方法包括提供具有衬底,覆盖衬底的微电子元件和从衬底的表面突出的至少两个导电元件的微电子封装,所述至少两个导电元件具有远离所述衬底的表面的表面 基质。 该方法包括压缩至少两个导电元件使其远端表面位于公共平面中,并且在压缩步骤之后,提供围绕至少两个导电元件的密封剂材料,用于支撑微电子封装并使得远端表面 所述至少两个导电元件在所述密封剂材料的外表面处保持可接近。
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